Market Overview:
The global multichip package market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for miniaturization and higher performance in consumer electronics, industrial, automotive & transport, aerospace & defense and other applications. In terms of type, the HC or HIC segment is expected to hold the largest share of the global multichip package market during the forecast period. This can be attributed to its advantages such as high thermal conductivity and low junction capacitance over MCMs.
Product Definition:
A multichip package (MCP) is a single physical entity that contains multiple integrated circuits. The MCP allows the different chips to be tested and packaged together, which can then be sold as a single unit. This is advantageous for both the manufacturer and the consumer, as it saves on production costs and simplifies the buying process.
HC or HIC:
High-Current or HC is a type of packaging used for ICs that require high current handling capability. The technology has evolved over time and currently, multichip packages are widely used in the industry.
HC/HIC (high-current/high-power) package offers several benefits such as low external inductance and capacitance, small size, efficient heat dissipation mechanism among others which make it suitable to be used in various applications including consumer electronics & appliances.
MCMs:
Multichip package or MCM is a technology that involves the use of multiple chip modules in a single unit. It helps to reduce the size and weight of electronic devices along with providing enhanced functionality. The multichip module consists of several chips, which are mounted on a substrate or carrier board. These chips have different functions and can be used together as an integrated circuit (IC) within an electronic device such as mobile phones, personal computers (PC), digital cameras, etc.
Application Insights:
The global multichip package market has been segmented on the basis of application into consumer electronics, industrial, automotive & transport, aerospace & defense and other applications. The other applications segment includes medical equipment and military equipment. The consumer electronics application accounted for a share of over 30% in 2017 owing to increasing demand from smartphones and tablets coupled with growing demand for wearable devices is expected to drive growth over the forecast period.
The industrial application is projected to witness significant growth at a CAGR of XX% from 2018 to 2030 owing to rising adoption across various end-use industries such as oil & gas, construction materials handling etc., which require large number of chips per unit volume are expected drive industry expansion over the forecast period.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing market, registering a CAGR of XX% from 2018 to 2030. The region has been witnessing strong economic growth on account of increasing manufacturing activities in countries such as China and India. Furthermore, rising demand for consumer electronics products along with rapid development in the IT sector is anticipated to drive regional market growth over the forecast period.
The North American region dominated global multichip package (MCM) market by revenue and was valued at USD X million in 2017. This can be attributed to high demand for MCMs from various end-use industries such as automotive & transport, industrial & manufacturing, aerospace & defense among others across U.S., Canada and Mexico owing to technological advancements coupled with high disposable income of consumers especially after implementation of favorable policies by governments including tax incentives and rebates offered on purchasing new electronic devices or components manufactured using advanced technologies including 3D packaging or multi-chip modules (MCM).
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Proliferation of smart devices and the Internet of Things (IoT)
- Growing trend of system-in-package (SiP) and advanced packaging technologies
- Rising demand for high-performance, low-power, and reliable semiconductor products
- Emergence of new applications across a wide range of industries
Scope Of The Report
Report Attributes
Report Details
Report Title
Multichip Package Market Research Report
By Type
HC or HIC, MCMs, 3-D Packaging, SiP or SoP
By Application
Consumer Electronics, Industrial, Automotive & Transport, Aerospace & Defense, Others
By Companies
Micron Technology, Texas Instruments, Cypress Semiconductor Corporation, SK Hynix, ASE, Amkor, Intel, Samsung, AT&S, IBM, UTAC, TSMC, Qorvo
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
229
Number of Tables & Figures
161
Customization Available
Yes, the report can be customized as per your need.
Global Multichip Package Market Report Segments:
The global Multichip Package market is segmented on the basis of:
Types
HC or HIC, MCMs, 3-D Packaging, SiP or SoP
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Industrial, Automotive & Transport, Aerospace & Defense, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Micron Technology
- Texas Instruments
- Cypress Semiconductor Corporation
- SK Hynix
- ASE
- Amkor
- Intel
- Samsung
- AT&S
- IBM
- UTAC
- TSMC
- Qorvo
Highlights of The Multichip Package Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- HC or HIC
- MCMs
- 3-D Packaging
- SiP or SoP
- By Application:
- Consumer Electronics
- Industrial
- Automotive & Transport
- Aerospace & Defense
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Multichip Package Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Multichip Package is a technology that allows multiple chips to be packaged together on a single chip-sized package. This enables devices with more complex functionality, such as processors and memory controllers, to be built on a single chip.
Some of the major players in the multichip package market are Micron Technology, Texas Instruments, Cypress Semiconductor Corporation, SK Hynix, ASE, Amkor, Intel, Samsung, AT&S, IBM, UTAC, TSMC, Qorvo.
The multichip package market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Multichip Package Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Multichip Package Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Multichip Package Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Multichip Package Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Multichip Package Market Size & Forecast, 2018-2028
4.5.1 Multichip Package Market Size and Y-o-Y Growth
4.5.2 Multichip Package Market Absolute $ Opportunity
Chapter 5 Global Multichip Package Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Multichip Package Market Size Forecast by Type
5.2.1 HC or HIC
5.2.2 MCMs
5.2.3 3-D Packaging
5.2.4 SiP or SoP
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Multichip Package Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Multichip Package Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Industrial
6.2.3 Automotive & Transport
6.2.4 Aerospace & Defense
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Multichip Package Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Multichip Package Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Multichip Package Analysis and Forecast
9.1 Introduction
9.2 North America Multichip Package Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Multichip Package Market Size Forecast by Type
9.6.1 HC or HIC
9.6.2 MCMs
9.6.3 3-D Packaging
9.6.4 SiP or SoP
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Multichip Package Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Industrial
9.10.3 Automotive & Transport
9.10.4 Aerospace & Defense
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Multichip Package Analysis and Forecast
10.1 Introduction
10.2 Europe Multichip Package Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Multichip Package Market Size Forecast by Type
10.6.1 HC or HIC
10.6.2 MCMs
10.6.3 3-D Packaging
10.6.4 SiP or SoP
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Multichip Package Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Industrial
10.10.3 Automotive & Transport
10.10.4 Aerospace & Defense
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Multichip Package Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Multichip Package Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Multichip Package Market Size Forecast by Type
11.6.1 HC or HIC
11.6.2 MCMs
11.6.3 3-D Packaging
11.6.4 SiP or SoP
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Multichip Package Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Industrial
11.10.3 Automotive & Transport
11.10.4 Aerospace & Defense
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Multichip Package Analysis and Forecast
12.1 Introduction
12.2 Latin America Multichip Package Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Multichip Package Market Size Forecast by Type
12.6.1 HC or HIC
12.6.2 MCMs
12.6.3 3-D Packaging
12.6.4 SiP or SoP
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Multichip Package Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Industrial
12.10.3 Automotive & Transport
12.10.4 Aerospace & Defense
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Multichip Package Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Multichip Package Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Multichip Package Market Size Forecast by Type
13.6.1 HC or HIC
13.6.2 MCMs
13.6.3 3-D Packaging
13.6.4 SiP or SoP
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Multichip Package Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Industrial
13.10.3 Automotive & Transport
13.10.4 Aerospace & Defense
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Multichip Package Market: Competitive Dashboard
14.2 Global Multichip Package Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Micron Technology
14.3.2 Texas Instruments
14.3.3 Cypress Semiconductor Corporation
14.3.4 SK Hynix
14.3.5 ASE
14.3.6 Amkor
14.3.7 Intel
14.3.8 Samsung
14.3.9 AT&S
14.3.10 IBM
14.3.11 UTAC
14.3.12 TSMC
14.3.13 Qorvo
