Market Overview:
The global No Clean Solder Pastes market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for miniaturization and higher density in electronic devices, rising demand for lead-free solder pastes, and growing adoption of no clean solder paste technology in Asia Pacific. Based on type, the global No Clean Solder Pastes market is segmented into lead-containing and lead-free solder pastes. Lead-containing solder pastes are expected to account for a larger share of the market than lead-free solder pastes during the forecast period. However, due to environmental concerns over the use of lead in electronics products, there is a growing demand for lead-free soldering technologies across all regions. This is expected to result in faster growth rates for the lead-free segment than for the lead containing segment duringthe forecast period.
Product Definition:
A solder paste is a material made of metal alloys, fluxes, and solvents that is used to make electrical connections between components. No clean solder pastes are designed to be less harmful when used and cause less environmental impact.
Lead-containing:
Lead-Containing pastes are used in the manufacturing of printed circuit boards (PCB). They are also employed as an additive for lead frames and components during the production of electronic devices. The growing demand for electronics across various industry verticals is expected to be a key factor driving market growth over the forecast period.
The increasing use of environment-friendly products is also anticipated to fuel product demand over the coming years.
Lead Free:
Lead-free is a term used for components or materials that are free of heavy metals such as lead. Lead-free paste in no clean solder pastes market is expected to witness significant growth over the forecast period owing to its increasing application scope in electronics and automotive industries. In addition, rising concerns regarding environmental pollution caused by leaded products are further anticipated to drive the demand for lead-free products over the next seven years.
Application Insights:
The global no clean solder pastes market by application is segmented into surface mount assembly (SMT), through-hole assembly (THT), and semiconductor packaging. The through-hole assembly segment held the largest share in 2017, which can be attributed to growing demand for high Throughputs per Minute (TPM) and higher production volumes of electronic devices. Surface mount technology has revolutionized the electronics industry over the last two decades, with rising demand for small size, low power consumption and cost reduction. SMT is used in a wide range of applications including mobile phones, computers & laptops, consumer electronics among others.
Semiconductor packaging includes both surface mount component as well as deep lead free components on PCBs that are used to carry digital signals from one point to another along with providing mechanical support for various components mounted on it.
Regional Analysis:
Asia Pacific was the largest regional market in 2017 and accounted for over 40% of the overall revenue share. The region is anticipated to continue its dominance over the forecast period owing to increasing demand from end-use industries, such as electronics, automotive, medical devices and others. China is projected to remain a key consumer and producer in this region due to low manufacturing cost coupled with easy availability of labor & raw materials.
The growing population coupled with rising disposable income has led to an increase in consumer electronics products across Asia Pacific which will drive demand further. Furthermore, favorable government policies are encouraging domestic manufacturers by offering subsidies on electricity rates & other costs associated with production activities; this will also support industry growth over the coming years.
Latin America held a significant share of global no clean solder pastes market due to high demand from various application industries such as semiconductor packaging.
Growth Factors:
- Increasing demand from the electronics industry for miniaturization and higher density assemblies is driving the need for no clean solder pastes.
- The increasing popularity of lead-free soldering is also contributing to the growth of the no clean solder paste market, as these pastes are better suited for lead-free soldering processes than traditional rosin flux-based solder pastes.
- Rising demand from Asia Pacific for consumer electronics and automotive applications is also propelling growth in the no clean solder paste market.
- Growing awareness about environmental concerns related to traditional cleaning methods used in PCB assembly is prompting manufacturers to adopt cleaner and greener alternatives, such as no clean solder paste, which helps reduce emissions and waste disposal costs associated with these processes.
Scope Of The Report
Report Attributes
Report Details
Report Title
No Clean Solder Pastes Market Research Report
By Type
Lead-containing, Lead Free
By Application
SMT Assembly, Semiconductor Packaging
By Companies
AIM, Qualitek, Superior Flux, Alpha, Tamura, Henkel, Indium, Kester, Inventec, KOKI, Nihon Superior, MG Chemicals, Chipquik, DCCconcepts, Chemtools, Nordson EFD, Almit
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
131
Number of Tables & Figures
92
Customization Available
Yes, the report can be customized as per your need.
Global No Clean Solder Pastes Market Report Segments:
The global No Clean Solder Pastes market is segmented on the basis of:
Types
Lead-containing, Lead Free
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
SMT Assembly, Semiconductor Packaging
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- AIM
- Qualitek
- Superior Flux
- Alpha
- Tamura
- Henkel
- Indium
- Kester
- Inventec
- KOKI
- Nihon Superior
- MG Chemicals
- Chipquik
- DCCconcepts
- Chemtools
- Nordson EFD
- Almit
Highlights of The No Clean Solder Pastes Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lead-containing
- Lead Free
- By Application:
- SMT Assembly
- Semiconductor Packaging
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the No Clean Solder Pastes Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
No Clean Solder Pastes are a type of solder paste that is designed to be used without the need for clean up. This type of solder paste is typically more affordable than other types of solder pastes, and it can be used in a variety of applications.
Some of the key players operating in the no clean solder pastes market are AIM, Qualitek, Superior Flux, Alpha, Tamura, Henkel, Indium, Kester, Inventec, KOKI, Nihon Superior, MG Chemicals, Chipquik, DCCconcepts, Chemtools, Nordson EFD, Almit.
The no clean solder pastes market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 No Clean Solder Pastes Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 No Clean Solder Pastes Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 No Clean Solder Pastes Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the No Clean Solder Pastes Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global No Clean Solder Pastes Market Size & Forecast, 2018-2028
4.5.1 No Clean Solder Pastes Market Size and Y-o-Y Growth
4.5.2 No Clean Solder Pastes Market Absolute $ Opportunity
Chapter 5 Global No Clean Solder Pastes Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 No Clean Solder Pastes Market Size Forecast by Type
5.2.1 Lead-containing
5.2.2 Lead Free
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global No Clean Solder Pastes Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 No Clean Solder Pastes Market Size Forecast by Applications
6.2.1 SMT Assembly
6.2.2 Semiconductor Packaging
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global No Clean Solder Pastes Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 No Clean Solder Pastes Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America No Clean Solder Pastes Analysis and Forecast
9.1 Introduction
9.2 North America No Clean Solder Pastes Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America No Clean Solder Pastes Market Size Forecast by Type
9.6.1 Lead-containing
9.6.2 Lead Free
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America No Clean Solder Pastes Market Size Forecast by Applications
9.10.1 SMT Assembly
9.10.2 Semiconductor Packaging
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe No Clean Solder Pastes Analysis and Forecast
10.1 Introduction
10.2 Europe No Clean Solder Pastes Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe No Clean Solder Pastes Market Size Forecast by Type
10.6.1 Lead-containing
10.6.2 Lead Free
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe No Clean Solder Pastes Market Size Forecast by Applications
10.10.1 SMT Assembly
10.10.2 Semiconductor Packaging
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific No Clean Solder Pastes Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific No Clean Solder Pastes Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific No Clean Solder Pastes Market Size Forecast by Type
11.6.1 Lead-containing
11.6.2 Lead Free
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific No Clean Solder Pastes Market Size Forecast by Applications
11.10.1 SMT Assembly
11.10.2 Semiconductor Packaging
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America No Clean Solder Pastes Analysis and Forecast
12.1 Introduction
12.2 Latin America No Clean Solder Pastes Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America No Clean Solder Pastes Market Size Forecast by Type
12.6.1 Lead-containing
12.6.2 Lead Free
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America No Clean Solder Pastes Market Size Forecast by Applications
12.10.1 SMT Assembly
12.10.2 Semiconductor Packaging
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) No Clean Solder Pastes Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) No Clean Solder Pastes Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) No Clean Solder Pastes Market Size Forecast by Type
13.6.1 Lead-containing
13.6.2 Lead Free
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) No Clean Solder Pastes Market Size Forecast by Applications
13.10.1 SMT Assembly
13.10.2 Semiconductor Packaging
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 No Clean Solder Pastes Market: Competitive Dashboard
14.2 Global No Clean Solder Pastes Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 AIM
14.3.2 Qualitek
14.3.3 Superior Flux
14.3.4 Alpha
14.3.5 Tamura
14.3.6 Henkel
14.3.7 Indium
14.3.8 Kester
14.3.9 Inventec
14.3.10 KOKI
14.3.11 Nihon Superior
14.3.12 MG Chemicals
14.3.13 Chipquik
14.3.14 DCCconcepts
14.3.15 Chemtools
14.3.16 Nordson EFD
14.3.17 Almit
