Market Overview:
The global OEM electronics assembly for communications market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for electronic devices, such as mobile phones and infrastructure, across the globe. Additionally, the growing trend of miniaturization is also contributing to the growth of this market. On the basis of type, hardware accounted for a major share of the global OEM electronics assembly for communications market in 2017. This segment is expected to continue its dominance during the forecast period owing to factors such as miniaturization and increased demand for smart devices.
Product Definition:
OEM Electronics Assembly for Communications is an electronic assembly that is designed and manufactured by the Original Equipment Manufacturer (OEM) to be used in a communications device or system. OEM Electronics Assembly for Communications are often critical components of the system and must meet stringent performance requirements.
Hardware:
Hardware is the part of an electronic device that directly contributes to its functionality. It is responsible for carrying out operations at a specific time and in sequence, without which the device would not function. Hardware includes microprocessors, memory devices, input/output ports (I/O), and other components that are necessary to execute software instructions.
Software:
Software and it's usage in OEM electronics assembly for communications market is expected to witness significant growth over the forecast period. The OEMs are increasingly using software tools to design electronic products, which can be easily integrated with other systems on a computer or another device. Software tools have become an integral part of electronic devices as they help reduce time-to-market and manufacturing costs along with improving flexibility, reliability, quality, safety & security among other aspects.
Application Insights:
Mobile phones was the largest application segment in the communications industry and accounted for a revenue share of more than 60% in 2017. The growth is attributed to increasing demand for mobile phones, especially in developing countries such as India, China and Brazil. Moreover, growing demand for smartphones is expected to drive the market over the forecast period.
The infrastructure application segment is expected to witness significant growth over the forecast period owing to an increase in demand from data centers across various regions including North America and Europe. Data centers require a high-speed network connectivity which leads them towards using telecom service providers that offer customized solutions according to their requirements regarding hardware & software integration with their infrastructural offerings including cloud computing services & IT infrastructure management systems.
Regional Analysis:
Asia Pacific accounted for the largest revenue share in 2017 and is expected to continue its dominance over the forecast period. The region is home to several emerging economies, such as China, India, and South Korea. These countries are witnessing strong economic growth owing to rapid industrialization and urbanization. Growing population has led to increased demand for consumer electronics assembly services in this region. Moreover, increasing disposable income levels have triggered consumers into acquiring high-end smartphones with advanced features such as 4G connectivity support or larger screens measuring 5 inches or more diagonally.
The Latin American OEM electronics assembly for communications market was valued at USD X billion in 2017 owing to growing smartphone adoption coupled with an increase in internet usage across countries like Brazil.
Growth Factors:
- Increasing demand for smart devices and the Internet of Things (IoT) is expected to drive the growth of OEM electronics assembly for communications market.
- Proliferation of 4G and 5G networks is also anticipated to fuel the demand for OEM electronics assembly services in communication market.
- Growing number of telecom service providers is projected to create opportunities for OEMs in the coming years.
- Rising investments in research and development by telecom companies are likely to provide impetus to the growth of this market during forecast period.
Scope Of The Report
Report Attributes
Report Details
Report Title
OEM Electronics Assembly for Communications Market Research Report
By Type
Hardware, Software
By Application
Mobile Phones, Infrastructure, Other
By Companies
Arista Networks, China SpaceSa, Huawei, HTC, Harmonic, Fujitsu, Ericsson, Infinera, Lenovo, Panasonic, Panda Electronics, Quanta Computer, Samsung Electronics, Sony, TCL, Toshiba, Vivo, Xiaomi, ZTE, Nokia Oyj
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
190
Number of Tables & Figures
133
Customization Available
Yes, the report can be customized as per your need.
Global OEM Electronics Assembly for Communications Market Report Segments:
The global OEM Electronics Assembly for Communications market is segmented on the basis of:
Types
Hardware, Software
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Mobile Phones, Infrastructure, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Arista Networks
- China SpaceSa
- Huawei
- HTC
- Harmonic
- Fujitsu
- Ericsson
- Infinera
- Lenovo
- Panasonic
- Panda Electronics
- Quanta Computer
- Samsung Electronics
- Sony
- TCL
- Toshiba
- Vivo
- Xiaomi
- ZTE
- Nokia Oyj
Highlights of The OEM Electronics Assembly for Communications Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Hardware
- Software
- By Application:
- Mobile Phones
- Infrastructure
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the OEM Electronics Assembly for Communications Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
OEM electronics assembly for communications is the process of assembling electronic components into a finished product. This includes everything from designing and manufacturing the individual parts to putting them all together into a functional device.
Some of the major companies in the oem electronics assembly for communications market are Arista Networks, China SpaceSa, Huawei, HTC, Harmonic, Fujitsu, Ericsson, Infinera, Lenovo, Panasonic, Panda Electronics, Quanta Computer, Samsung Electronics, Sony, TCL, Toshiba, Vivo, Xiaomi, ZTE, Nokia Oyj.
The oem electronics assembly for communications market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 OEM Electronics Assembly for Communications Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 OEM Electronics Assembly for Communications Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 OEM Electronics Assembly for Communications Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the OEM Electronics Assembly for Communications Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global OEM Electronics Assembly for Communications Market Size & Forecast, 2018-2028
4.5.1 OEM Electronics Assembly for Communications Market Size and Y-o-Y Growth
4.5.2 OEM Electronics Assembly for Communications Market Absolute $ Opportunity
Chapter 5 Global OEM Electronics Assembly for Communications Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 OEM Electronics Assembly for Communications Market Size Forecast by Type
5.2.1 Hardware
5.2.2 Software
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global OEM Electronics Assembly for Communications Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 OEM Electronics Assembly for Communications Market Size Forecast by Applications
6.2.1 Mobile Phones
6.2.2 Infrastructure
6.2.3 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global OEM Electronics Assembly for Communications Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 OEM Electronics Assembly for Communications Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America OEM Electronics Assembly for Communications Analysis and Forecast
9.1 Introduction
9.2 North America OEM Electronics Assembly for Communications Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America OEM Electronics Assembly for Communications Market Size Forecast by Type
9.6.1 Hardware
9.6.2 Software
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America OEM Electronics Assembly for Communications Market Size Forecast by Applications
9.10.1 Mobile Phones
9.10.2 Infrastructure
9.10.3 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe OEM Electronics Assembly for Communications Analysis and Forecast
10.1 Introduction
10.2 Europe OEM Electronics Assembly for Communications Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe OEM Electronics Assembly for Communications Market Size Forecast by Type
10.6.1 Hardware
10.6.2 Software
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe OEM Electronics Assembly for Communications Market Size Forecast by Applications
10.10.1 Mobile Phones
10.10.2 Infrastructure
10.10.3 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific OEM Electronics Assembly for Communications Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific OEM Electronics Assembly for Communications Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific OEM Electronics Assembly for Communications Market Size Forecast by Type
11.6.1 Hardware
11.6.2 Software
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific OEM Electronics Assembly for Communications Market Size Forecast by Applications
11.10.1 Mobile Phones
11.10.2 Infrastructure
11.10.3 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America OEM Electronics Assembly for Communications Analysis and Forecast
12.1 Introduction
12.2 Latin America OEM Electronics Assembly for Communications Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America OEM Electronics Assembly for Communications Market Size Forecast by Type
12.6.1 Hardware
12.6.2 Software
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America OEM Electronics Assembly for Communications Market Size Forecast by Applications
12.10.1 Mobile Phones
12.10.2 Infrastructure
12.10.3 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) OEM Electronics Assembly for Communications Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) OEM Electronics Assembly for Communications Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) OEM Electronics Assembly for Communications Market Size Forecast by Type
13.6.1 Hardware
13.6.2 Software
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) OEM Electronics Assembly for Communications Market Size Forecast by Applications
13.10.1 Mobile Phones
13.10.2 Infrastructure
13.10.3 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 OEM Electronics Assembly for Communications Market: Competitive Dashboard
14.2 Global OEM Electronics Assembly for Communications Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Arista Networks
14.3.2 China SpaceSa
14.3.3 Huawei
14.3.4 HTC
14.3.5 Harmonic
14.3.6 Fujitsu
14.3.7 Ericsson
14.3.8 Infinera
14.3.9 Lenovo
14.3.10 Panasonic
14.3.11 Panda Electronics
14.3.12 Quanta Computer
14.3.13 Samsung Electronics
14.3.14 Sony
14.3.15 TCL
14.3.16 Toshiba
14.3.17 Vivo
14.3.18 Xiaomi
14.3.19 ZTE
14.3.20 Nokia Oyj
