Market Overview:
The global opto-electronic packaging market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for optoelectronic components in various applications, such as aerospace, military communication equipment, commercial communication equipment, and others. Additionally, the growing demand for high-power devices is also contributing to the growth of this market.
Product Definition:
Opto-electronic packaging is a technology that integrates optical elements into electronic circuits. This allows the transmission of data and power between different parts of the circuit using light instead of wires. The benefits of opto-electronic packaging include higher performance, smaller size, and lower weight.
Hybrid Integrated Circuit Metal Package:
Hybrid integrated circuit metal package is a combination of two technologies, one is opto-electronic packaging and other is integrated circuit (IC) packaging. Opto-electronic packaging technology has been evolving for more than half a century and ICs have been replacing most traditional components in modern electronic equipment. The hybrid integrated circuit metal package combines the best of both these worlds by using both opto-electronic packages as well as ICs in the same system or device.
Optoelectronic Component Packaging:
Optoelectronic components are used in a variety of applications such as LED lighting, laser devices, and photodiodes. These components require adequate protection from dust and other particles that may get into the device during handling or shipping. Optoelectronic packaging provides necessary protection to these sensitive electronic parts by providing an environmental barrier around it.
Application Insights:
The others application segment accounted for the largest revenue share in 2017 and is expected to witness significant growth over the forecast period. Other optoelectronic packaging solutions include medical equipment, consumer electronics, telecommunication equipment and military communication equipment among others. Opto-electronic components used in these applications are mostly semiconductors which require a minimal amount of assembly as they are self-assembly modules. Hence, optoelectronics assembly services have been witnessing considerable demand from various industries including aerospace & defense, communication & transportation etc over the past few years owing to its low cost assembling process as compared to traditional methods of manufacturing such products.
Regional Analysis:
Asia Pacific region dominated the global opto-electronic packaging market in 2016 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for optoelectronic components from various end-use industries such as aerospace & defense, consumer electronics, medical equipment & devices, and others.
The Asia Pacific regional market is characterized by high production volume of consumer electronics products along with a large number of players operating in this industry. Furthermore, rapid industrialization coupled with growing investments in R&D activities for development of advanced technologies will drive the growth further. In addition, rising disposable income levels are anticipated to fuel demand for high-tech communication devices among consumers across countries such as China and India thus driving product adoption across these regions significantly over the next eight years.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive industry
- Growing popularity of wearable electronics
- Proliferation of Internet of Things (IoT) devices
- Development of advanced packaging technologies
Scope Of The Report
Report Attributes
Report Details
Report Title
Opto-Electronic Packaging Market Research Report
By Type
Hybrid Integrated Circuit Metal Package, Optoelectronic Component Packaging, Microwave Component Packaging, Filter Component Packaging, Sensor Element Packaging, High-power Device Packaging
By Application
Aerospace, Military Communication Equipment, Commercial Communication Equipment, Others
By Companies
GE Inspection Technologies, SCHOTT, Mycronic AB, Jitai, MACOM, U-PAK, Innoptics, Jenoptik, HOPERF, Bay Photonics, PHIX
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
250
Number of Tables & Figures
175
Customization Available
Yes, the report can be customized as per your need.
Global Opto-Electronic Packaging Market Report Segments:
The global Opto-Electronic Packaging market is segmented on the basis of:
Types
Hybrid Integrated Circuit Metal Package, Optoelectronic Component Packaging, Microwave Component Packaging, Filter Component Packaging, Sensor Element Packaging, High-power Device Packaging
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Aerospace, Military Communication Equipment, Commercial Communication Equipment, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- GE Inspection Technologies
- SCHOTT
- Mycronic AB
- Jitai
- MACOM
- U-PAK
- Innoptics
- Jenoptik
- HOPERF
- Bay Photonics
- PHIX
Highlights of The Opto-Electronic Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Hybrid Integrated Circuit Metal Package
- Optoelectronic Component Packaging
- Microwave Component Packaging
- Filter Component Packaging
- Sensor Element Packaging
- High-power Device Packaging
- By Application:
- Aerospace
- Military Communication Equipment
- Commercial Communication Equipment
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Opto-Electronic Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Opto-electronic packaging is a type of packaging that uses light to control the flow of products. The packages are made up of several layers, including a light-sensitive layer that controls the release of products. This technology can be used to create tamper-proof and secure packaging systems.
Some of the major companies in the opto-electronic packaging market are GE Inspection Technologies, SCHOTT, Mycronic AB, Jitai, MACOM, U-PAK, Innoptics, Jenoptik, HOPERF, Bay Photonics, PHIX.
The opto-electronic packaging market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Opto-Electronic Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Opto-Electronic Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Opto-Electronic Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Opto-Electronic Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Opto-Electronic Packaging Market Size & Forecast, 2020-2028
4.5.1 Opto-Electronic Packaging Market Size and Y-o-Y Growth
4.5.2 Opto-Electronic Packaging Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Hybrid Integrated Circuit Metal Package
5.2.2 Optoelectronic Component Packaging
5.2.3 Microwave Component Packaging
5.2.4 Filter Component Packaging
5.2.5 Sensor Element Packaging
5.2.6 High-power Device Packaging
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Aerospace
6.2.2 Military Communication Equipment
6.2.3 Commercial Communication Equipment
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Opto-Electronic Packaging Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Opto-Electronic Packaging Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Hybrid Integrated Circuit Metal Package
9.6.2 Optoelectronic Component Packaging
9.6.3 Microwave Component Packaging
9.6.4 Filter Component Packaging
9.6.5 Sensor Element Packaging
9.6.6 High-power Device Packaging
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Aerospace
9.10.2 Military Communication Equipment
9.10.3 Commercial Communication Equipment
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Hybrid Integrated Circuit Metal Package
10.6.2 Optoelectronic Component Packaging
10.6.3 Microwave Component Packaging
10.6.4 Filter Component Packaging
10.6.5 Sensor Element Packaging
10.6.6 High-power Device Packaging
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Aerospace
10.10.2 Military Communication Equipment
10.10.3 Commercial Communication Equipment
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Hybrid Integrated Circuit Metal Package
11.6.2 Optoelectronic Component Packaging
11.6.3 Microwave Component Packaging
11.6.4 Filter Component Packaging
11.6.5 Sensor Element Packaging
11.6.6 High-power Device Packaging
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Aerospace
11.10.2 Military Communication Equipment
11.10.3 Commercial Communication Equipment
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Hybrid Integrated Circuit Metal Package
12.6.2 Optoelectronic Component Packaging
12.6.3 Microwave Component Packaging
12.6.4 Filter Component Packaging
12.6.5 Sensor Element Packaging
12.6.6 High-power Device Packaging
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Aerospace
12.10.2 Military Communication Equipment
12.10.3 Commercial Communication Equipment
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Hybrid Integrated Circuit Metal Package
13.6.2 Optoelectronic Component Packaging
13.6.3 Microwave Component Packaging
13.6.4 Filter Component Packaging
13.6.5 Sensor Element Packaging
13.6.6 High-power Device Packaging
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Aerospace
13.10.2 Military Communication Equipment
13.10.3 Commercial Communication Equipment
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Opto-Electronic Packaging Market: Competitive Dashboard
14.2 Global Opto-Electronic Packaging Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 GE Inspection Technologies
14.3.2 SCHOTT
14.3.3 Mycronic AB
14.3.4 Jitai
14.3.5 MACOM
14.3.6 U-PAK
14.3.7 Innoptics
14.3.8 Jenoptik
14.3.9 HOPERF
14.3.10 Bay Photonics
14.3.11 PHIX
