Market Overview:
The global outsourced semiconductor assembly and testing market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductors in various applications such as automotive, consumer electronics, industrial, telecommunication, and others. Additionally, the growing trend of miniaturization and increased complexity of semiconductor devices are also contributing to the growth of this market. Based on type, the outsourced semiconductor assembly and testing market can be segmented into outsourced semiconductor testing and outsourced semiconductor assembly. The outsourcing of semiconductor assembly is expected to grow at a higher rate than that for outsourcing of semiconductor testing during the forecast period from 2018 to 2030 owing to factors such as shorter turnaround time for products in comparison with traditional manufacturing processes and reduced capital expenditure requirements by OEMs/ODMs. Based on application, the global outsourced semiconductor assembly and testing market can be segmented into automotive, consumer electronics (CE), industrial sector including medical devices sector), telecommunication sector (including networking equipment & smartphones), defense & aerospace sector)and others including energy & power systems).
Product Definition:
Outsourced Semiconductor Assembly and Testing (OSAT) is the process of contracting out the assembly and testing of semiconductor devices to a third-party provider. OSAT providers offer a variety of services, including wafer fabrication, die attach, wire bonding, package assembly, final test and shipment.
The use of OSAT has become increasingly common in the semiconductor industry as chipmakers seek to reduce costs and improve time-to-market. By outsourcing these processes to a qualified third party, chipmakers can focus on their core competencies while still meeting stringent quality requirements.
Outsourced Semiconductor Testing:
Outsourced semiconductor testing is a specialized field of test engineering services that are provided by companies to the product manufacturers for ensuring the quality and reliability of electronic products. The outsourcing industry has been growing at a steady pace with an increasing number of small and medium-sized enterprises looking for cost benefits associated with it.
Outsourced Semiconductor Assembly:
Outsourced semiconductor assembly and testing market is expected to witness significant growth over the forecast period. The major drivers for this market are increasing demand for low-cost labor in countries such as India, China, Malaysia, etc., growing focus on time-to-market and cost optimization by end users along with a surge in complexity of designs due to rapid technological developments.
Application Insights:
The global market is segmented by application into automotive, consumer electronics, industrial and telecom. The automotive application accounted for the largest revenue share in 2016 and is projected to witness significant growth over the forecast period. Outsourced semiconductor assembly and testing services are used across various applications in the automobile sector such as infotainment systems, HVAC (heating, ventilation & cooling), lighting systems with high reliability requirements.
Outsourced semiconductor testing services are also used across various applications such as safety equipment for drivers assistance system which includes cruise control/traction control system along with other advanced driver-assistance systems (ADAS). ADAS test requires a variety of tests including vision recognition software that can detect moving objects and apply brakes automatically without human intervention or controls to avoid any kind of accidents. Such types of complex tests require highly skilled personnel who have experience in handling sophisticated equipment thereby driving up demand for outsourcing test services globally.
Regional Analysis:
Asia Pacific region accounted for the largest revenue share in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to increasing demand from end-use industries, such as consumer electronics, industrial, and telecommunication. In addition, rising investments by key players in developing countries of Asia Pacific are anticipated to drive market growth over the forecast period.
The market in North America is projected to grow at a significant rate owing to technological advancements and increased focus on security measures by government organizations. Moreover, presence of major technology providers such as Intel Corporation; Qualcomm Inc.; Texas Instruments Inc.; Avago Technologies Ltd; Broadcom Limited; Renesas Electronics Corporation; Fairchild Semiconductor International LLC; Maxim Integrated Products Inc.; Infineon technologies Austria AG will fuel regional market growth over the next eight years.
Growth Factors:
- Increasing demand for semiconductors in automotive and consumer electronics industries
- Growing number of fabless semiconductor companies
- Proliferation of 3D IC technology and advanced packaging solutions
- Rising demand for MEMS and sensors
- Emergence of new market segments such as the Internet of Things (IoT)
Scope Of The Report
Report Attributes
Report Details
Report Title
Outsourced Semiconductor Assembly and Testing Market Research Report
By Type
Outsourced Semiconductor Testing, Outsourced Semiconductor Assembly
By Application
Automotive, Consumer Electronics, Industrial, Telecommunication, Others
By Companies
ASE Technology Holding, Amkor Technology, Jiangsu Changjiang Electronics Technology, Powertech Technology Inc., Tianshui Huatian Technology Co., LTD., TongFu Microelectronics Co., LTD., King Yuan Electronics Co., Ltd., STATS ChipPAC, Siliconware Precision Industries, Unisem Group, UTAC Group, Chipbond Technology Corporation, ChipMOS Technologies
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
249
Number of Tables & Figures
175
Customization Available
Yes, the report can be customized as per your need.
Global Outsourced Semiconductor Assembly and Testing Market Report Segments:
The global Outsourced Semiconductor Assembly and Testing market is segmented on the basis of:
Types
Outsourced Semiconductor Testing, Outsourced Semiconductor Assembly
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive, Consumer Electronics, Industrial, Telecommunication, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ASE Technology Holding
- Amkor Technology
- Jiangsu Changjiang Electronics Technology
- Powertech Technology Inc.
- Tianshui Huatian Technology Co., LTD.
- TongFu Microelectronics Co., LTD.
- King Yuan Electronics Co., Ltd.
- STATS ChipPAC
- Siliconware Precision Industries
- Unisem Group
- UTAC Group
- Chipbond Technology Corporation
- ChipMOS Technologies
Highlights of The Outsourced Semiconductor Assembly and Testing Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Outsourced Semiconductor Testing
- Outsourced Semiconductor Assembly
- By Application:
- Automotive
- Consumer Electronics
- Industrial
- Telecommunication
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Outsourced Semiconductor Assembly and Testing Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Outsourced semiconductor assembly and testing is the process of assembling and testing semiconductors on behalf of a customer. This service can be used to reduce the time and cost required to produce a new product.
Some of the major companies in the outsourced semiconductor assembly and testing market are ASE Technology Holding, Amkor Technology, Jiangsu Changjiang Electronics Technology, Powertech Technology Inc., Tianshui Huatian Technology Co., LTD., TongFu Microelectronics Co., LTD., King Yuan Electronics Co., Ltd., STATS ChipPAC, Siliconware Precision Industries, Unisem Group, UTAC Group, Chipbond Technology Corporation, ChipMOS Technologies.
The outsourced semiconductor assembly and testing market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Outsourced Semiconductor Assembly and Testing Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Outsourced Semiconductor Assembly and Testing Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Outsourced Semiconductor Assembly and Testing Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Outsourced Semiconductor Assembly and Testing Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Outsourced Semiconductor Assembly and Testing Market Size & Forecast, 2020-2028
4.5.1 Outsourced Semiconductor Assembly and Testing Market Size and Y-o-Y Growth
4.5.2 Outsourced Semiconductor Assembly and Testing Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Outsourced Semiconductor Testing
5.2.2 Outsourced Semiconductor Assembly
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Automotive
6.2.2 Consumer Electronics
6.2.3 Industrial
6.2.4 Telecommunication
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Outsourced Semiconductor Assembly and Testing Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Outsourced Semiconductor Assembly and Testing Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Outsourced Semiconductor Testing
9.6.2 Outsourced Semiconductor Assembly
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Automotive
9.10.2 Consumer Electronics
9.10.3 Industrial
9.10.4 Telecommunication
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Outsourced Semiconductor Testing
10.6.2 Outsourced Semiconductor Assembly
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Automotive
10.10.2 Consumer Electronics
10.10.3 Industrial
10.10.4 Telecommunication
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Outsourced Semiconductor Testing
11.6.2 Outsourced Semiconductor Assembly
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Automotive
11.10.2 Consumer Electronics
11.10.3 Industrial
11.10.4 Telecommunication
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Outsourced Semiconductor Testing
12.6.2 Outsourced Semiconductor Assembly
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Automotive
12.10.2 Consumer Electronics
12.10.3 Industrial
12.10.4 Telecommunication
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Outsourced Semiconductor Testing
13.6.2 Outsourced Semiconductor Assembly
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Automotive
13.10.2 Consumer Electronics
13.10.3 Industrial
13.10.4 Telecommunication
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Outsourced Semiconductor Assembly and Testing Market: Competitive Dashboard
14.2 Global Outsourced Semiconductor Assembly and Testing Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ASE Technology Holding
14.3.2 Amkor Technology
14.3.3 Jiangsu Changjiang Electronics Technology
14.3.4 Powertech Technology Inc.
14.3.5 Tianshui Huatian Technology Co., LTD.
14.3.6 TongFu Microelectronics Co., LTD.
14.3.7 King Yuan Electronics Co., Ltd.
14.3.8 STATS ChipPAC
14.3.9 Siliconware Precision Industries
14.3.10 Unisem Group
14.3.11 UTAC Group
14.3.12 Chipbond Technology Corporation
14.3.13 ChipMOS Technologies
