Market Overview:
The global outsourced semiconductor assembly service market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for advanced packaging services and the growing trend of miniaturization in consumer electronics products. Additionally, the increasing demand for semiconductor assemblies from automotive and transportation applications is also contributing to the growth of this market. The global outsourced semiconductor assembly service market can be segmented on the basis of type into advanced packaging and traditional packaging. The advanced packaging segment is expected to grow at a higher CAGR than traditional packaging during the forecast period owing to its growing demand from high-end applications such as communication, consumer electronics, and automotive and transportation sectors. On the basis of application,the global outsourced semiconductor assembly servicemarket can be divided into five segments: automotiveand transportation, communication, consumer electronics, industrialand medical devices, and others including militaryand aerospace applications).
Product Definition:
Outsourced Semiconductor Assembly Service is a service where the assembly of semiconductor devices is done by a third party. The importance of Outsourced Semiconductor Assembly Service is that it allows companies to outsource their manufacturing and save money.
Advanced Packaging:
Advanced packaging is a set of techniques and technologies used to design, package, and test the semiconductor products. It includes various processes such as wafer handling, assembly & testing along with advanced packaging equipment. The growth factor for this market is increasing demand for high-performance integrated circuits (IC) from data processing applications which are used in computers and other electronic devices.
Traditional Packaging:
Traditional packaging includes manual handling, use of corrugated boxes and cartons for the packaging of electronic components along with their assembly by hand. It is a cost-effective method to produce semiconductor packages and used in the manufacturing process. Outsourced Semiconductor Assembly Service providers are using traditional packaging methods to reduce costs associated with plastic molded cases production which in turn helps them offer low-cost products as compared to their competitors.
Application Insights:
The consumer electronics segment accounted for the largest revenue share in 2016 and is projected to continue its dominance over the forecast period. The growth can be attributed to increasing demand for electronic devices across the globe. Outsourced semiconductor assembly services are particularly useful in situations where a large number of identical components need assembling into a larger complex device such as smartphones or tablets.
Outsourced semiconductor assembly services help reduce time-consuming, error-prone, and expensive human efforts required to complete these tasks by hand. Thus, rising demand for smaller and more efficient electronic devices at an affordable cost is expected to drive outsourcing of this service over the coming years.
Regional Analysis:
Asia Pacific Outsourced Semiconductor Assembly Service Market led the global industry and accounted for over 35% of the total revenue in 2016. The region is expected to continue its dominance over the forecast period owing to increasing demand from China, India, Japan, South Korea and Taiwan. Rapid growth of consumer electronics assembly services in countries such as China and India is anticipated to fuel regional growth during the forecast period.
The market in North America was valued at USD X billion in 2016. The U.S., being a developed economy with high disposable income has emerged as one of the major markets for semiconductors across various applications thereby driving their demand through design & development services on-site or off-site catering to end-use industries such as Consumer Electronics (TVs, Cellphones), Automotive (HVAC systems) and others).
Growth Factors:
- Increasing demand for semiconductor assembly services from the automotive and electronics industries
- Growing number of fabless semiconductor companies
- Proliferation of 3D ICs and advanced packaging technologies
- Rising demand for MEMS and sensors
- Emergence of new market segments, such as the Internet of Things (IoT)
Scope Of The Report
Report Attributes
Report Details
Report Title
Outsourced Semiconductor Assembly Service Market Research Report
By Type
Advanced Packaging, Traditional Packaging
By Application
Automotive and Transportation, Consumer Electronics, Communication, Others
By Companies
ASE, Amkor Technology, JCET, SPIL, Powertech Technology Inc., TongFu Microelectronics, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron, OSE, Walton Advanced Engineering, NEPES, Unisem, ChipMOS Technologies, Signetics, Carsem, KYEC
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
185
Number of Tables & Figures
130
Customization Available
Yes, the report can be customized as per your need.
Global Outsourced Semiconductor Assembly Service Market Report Segments:
The global Outsourced Semiconductor Assembly Service market is segmented on the basis of:
Types
Advanced Packaging, Traditional Packaging
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive and Transportation, Consumer Electronics, Communication, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ASE
- Amkor Technology
- JCET
- SPIL
- Powertech Technology Inc.
- TongFu Microelectronics
- Tianshui Huatian Technology
- UTAC
- Chipbond Technology
- Hana Micron
- OSE
- Walton Advanced Engineering
- NEPES
- Unisem
- ChipMOS Technologies
- Signetics
- Carsem
- KYEC
Highlights of The Outsourced Semiconductor Assembly Service Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Advanced Packaging
- Traditional Packaging
- By Application:
- Automotive and Transportation
- Consumer Electronics
- Communication
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Outsourced Semiconductor Assembly Service Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Outsourced semiconductor assembly service is a type of contract manufacturing where semiconductor companies outsource the assembly of their products to third-party manufacturers.
Some of the major companies in the outsourced semiconductor assembly service market are ASE, Amkor Technology, JCET, SPIL, Powertech Technology Inc., TongFu Microelectronics, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron, OSE, Walton Advanced Engineering, NEPES, Unisem, ChipMOS Technologies, Signetics, Carsem, KYEC.
The outsourced semiconductor assembly service market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Outsourced Semiconductor Assembly Service Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Outsourced Semiconductor Assembly Service Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Outsourced Semiconductor Assembly Service Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Outsourced Semiconductor Assembly Service Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Outsourced Semiconductor Assembly Service Market Size & Forecast, 2018-2028
4.5.1 Outsourced Semiconductor Assembly Service Market Size and Y-o-Y Growth
4.5.2 Outsourced Semiconductor Assembly Service Market Absolute $ Opportunity
Chapter 5 Global Outsourced Semiconductor Assembly Service Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Outsourced Semiconductor Assembly Service Market Size Forecast by Type
5.2.1 Advanced Packaging
5.2.2 Traditional Packaging
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Outsourced Semiconductor Assembly Service Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Outsourced Semiconductor Assembly Service Market Size Forecast by Applications
6.2.1 Automotive and Transportation
6.2.2 Consumer Electronics
6.2.3 Communication
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Outsourced Semiconductor Assembly Service Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Outsourced Semiconductor Assembly Service Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Outsourced Semiconductor Assembly Service Analysis and Forecast
9.1 Introduction
9.2 North America Outsourced Semiconductor Assembly Service Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Outsourced Semiconductor Assembly Service Market Size Forecast by Type
9.6.1 Advanced Packaging
9.6.2 Traditional Packaging
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Outsourced Semiconductor Assembly Service Market Size Forecast by Applications
9.10.1 Automotive and Transportation
9.10.2 Consumer Electronics
9.10.3 Communication
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Outsourced Semiconductor Assembly Service Analysis and Forecast
10.1 Introduction
10.2 Europe Outsourced Semiconductor Assembly Service Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Outsourced Semiconductor Assembly Service Market Size Forecast by Type
10.6.1 Advanced Packaging
10.6.2 Traditional Packaging
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Outsourced Semiconductor Assembly Service Market Size Forecast by Applications
10.10.1 Automotive and Transportation
10.10.2 Consumer Electronics
10.10.3 Communication
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Outsourced Semiconductor Assembly Service Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Outsourced Semiconductor Assembly Service Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Outsourced Semiconductor Assembly Service Market Size Forecast by Type
11.6.1 Advanced Packaging
11.6.2 Traditional Packaging
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Outsourced Semiconductor Assembly Service Market Size Forecast by Applications
11.10.1 Automotive and Transportation
11.10.2 Consumer Electronics
11.10.3 Communication
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Outsourced Semiconductor Assembly Service Analysis and Forecast
12.1 Introduction
12.2 Latin America Outsourced Semiconductor Assembly Service Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Outsourced Semiconductor Assembly Service Market Size Forecast by Type
12.6.1 Advanced Packaging
12.6.2 Traditional Packaging
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Outsourced Semiconductor Assembly Service Market Size Forecast by Applications
12.10.1 Automotive and Transportation
12.10.2 Consumer Electronics
12.10.3 Communication
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Outsourced Semiconductor Assembly Service Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Outsourced Semiconductor Assembly Service Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Outsourced Semiconductor Assembly Service Market Size Forecast by Type
13.6.1 Advanced Packaging
13.6.2 Traditional Packaging
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Outsourced Semiconductor Assembly Service Market Size Forecast by Applications
13.10.1 Automotive and Transportation
13.10.2 Consumer Electronics
13.10.3 Communication
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Outsourced Semiconductor Assembly Service Market: Competitive Dashboard
14.2 Global Outsourced Semiconductor Assembly Service Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ASE
14.3.2 Amkor Technology
14.3.3 JCET
14.3.4 SPIL
14.3.5 Powertech Technology Inc.
14.3.6 TongFu Microelectronics
14.3.7 Tianshui Huatian Technology
14.3.8 UTAC
14.3.9 Chipbond Technology
14.3.10 Hana Micron
14.3.11 OSE
14.3.12 Walton Advanced Engineering
14.3.13 NEPES
14.3.14 Unisem
14.3.15 ChipMOS Technologies
14.3.16 Signetics
14.3.17 Carsem
14.3.18 KYEC
