Industry Growth Insights published a new data on “Pb-free Solder Market”. The research report is titled “Pb-free Solder Market research by Types (Lead-Free Tin Ball, Lead-Free Tin Bar, Lead-Free Tin Wire, Lead-Free Solder Paste, Other), By Applications (BGA, CSP & WLCSP, Flip-Chip & Others), By Players/Companies Henkel, Nihon Superior, Chernan Technology, Qualitek, Senju Metal Industry, Tamura, Alpha Assembly Solutions, KOKI, Kester, Tongfang Tech, Huaqing Solder, Indium Corporation, Earlysun Technology, AIM Solder, Nordson, Interflux Electronics, Balver Zinn Josef Jost, MG Chemicals, Uchihashi Estec, Guangchen Metal Products, Nihon Almit, Zhongya Electronic Solder, Tianjin Songben”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Pb-free Solder Market Research Report
By Type
Lead-Free Tin Ball, Lead-Free Tin Bar, Lead-Free Tin Wire, Lead-Free Solder Paste, Other
By Application
BGA, CSP & WLCSP, Flip-Chip & Others
By Companies
Henkel, Nihon Superior, Chernan Technology, Qualitek, Senju Metal Industry, Tamura, Alpha Assembly Solutions, KOKI, Kester, Tongfang Tech, Huaqing Solder, Indium Corporation, Earlysun Technology, AIM Solder, Nordson, Interflux Electronics, Balver Zinn Josef Jost, MG Chemicals, Uchihashi Estec, Guangchen Metal Products, Nihon Almit, Zhongya Electronic Solder, Tianjin Songben
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
233
Number of Tables & Figures
164
Customization Available
Yes, the report can be customized as per your need.
Global Pb-free Solder Market Report Segments:
The global Pb-free Solder market is segmented on the basis of:
Types
Lead-Free Tin Ball, Lead-Free Tin Bar, Lead-Free Tin Wire, Lead-Free Solder Paste, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
BGA, CSP & WLCSP, Flip-Chip & Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Henkel
- Nihon Superior
- Chernan Technology
- Qualitek
- Senju Metal Industry
- Tamura
- Alpha Assembly Solutions
- KOKI
- Kester
- Tongfang Tech
- Huaqing Solder
- Indium Corporation
- Earlysun Technology
- AIM Solder
- Nordson
- Interflux Electronics
- Balver Zinn Josef Jost
- MG Chemicals
- Uchihashi Estec
- Guangchen Metal Products
- Nihon Almit
- Zhongya Electronic Solder
- Tianjin Songben
Highlights of The Pb-free Solder Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lead-Free Tin Ball
- Lead-Free Tin Bar
- Lead-Free Tin Wire
- Lead-Free Solder Paste
- Other
- By Application:
- BGA
- CSP & WLCSP
- Flip-Chip & Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Pb-free Solder Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Pb-free solder is a type of solder that does not contain lead. Lead is a toxic metal that can cause health problems if it is ingested or inhaled. Pb-free solder is often used in electronics because it does not contain lead and therefore does not pose a health risk.
Some of the major players in the pb-free solder market are Henkel, Nihon Superior, Chernan Technology, Qualitek, Senju Metal Industry, Tamura, Alpha Assembly Solutions, KOKI, Kester, Tongfang Tech, Huaqing Solder, Indium Corporation, Earlysun Technology, AIM Solder, Nordson, Interflux Electronics, Balver Zinn Josef Jost, MG Chemicals, Uchihashi Estec, Guangchen Metal Products, Nihon Almit, Zhongya Electronic Solder, Tianjin Songben.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Pb-free Solder Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Pb-free Solder Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Pb-free Solder Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Pb-free Solder Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Pb-free Solder Market Size & Forecast, 2018-2028 4.5.1 Pb-free Solder Market Size and Y-o-Y Growth 4.5.2 Pb-free Solder Market Absolute $ Opportunity
Chapter 5 Global Pb-free Solder Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Pb-free Solder Market Size Forecast by Type
5.2.1 Lead-Free Tin Ball
5.2.2 Lead-Free Tin Bar
5.2.3 Lead-Free Tin Wire
5.2.4 Lead-Free Solder Paste
5.2.5 Other
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Pb-free Solder Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Pb-free Solder Market Size Forecast by Applications
6.2.1 BGA
6.2.2 CSP & WLCSP
6.2.3 Flip-Chip & Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Pb-free Solder Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Pb-free Solder Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Pb-free Solder Analysis and Forecast
9.1 Introduction
9.2 North America Pb-free Solder Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Pb-free Solder Market Size Forecast by Type
9.6.1 Lead-Free Tin Ball
9.6.2 Lead-Free Tin Bar
9.6.3 Lead-Free Tin Wire
9.6.4 Lead-Free Solder Paste
9.6.5 Other
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Pb-free Solder Market Size Forecast by Applications
9.10.1 BGA
9.10.2 CSP & WLCSP
9.10.3 Flip-Chip & Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Pb-free Solder Analysis and Forecast
10.1 Introduction
10.2 Europe Pb-free Solder Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Pb-free Solder Market Size Forecast by Type
10.6.1 Lead-Free Tin Ball
10.6.2 Lead-Free Tin Bar
10.6.3 Lead-Free Tin Wire
10.6.4 Lead-Free Solder Paste
10.6.5 Other
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Pb-free Solder Market Size Forecast by Applications
10.10.1 BGA
10.10.2 CSP & WLCSP
10.10.3 Flip-Chip & Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Pb-free Solder Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Pb-free Solder Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Pb-free Solder Market Size Forecast by Type
11.6.1 Lead-Free Tin Ball
11.6.2 Lead-Free Tin Bar
11.6.3 Lead-Free Tin Wire
11.6.4 Lead-Free Solder Paste
11.6.5 Other
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Pb-free Solder Market Size Forecast by Applications
11.10.1 BGA
11.10.2 CSP & WLCSP
11.10.3 Flip-Chip & Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Pb-free Solder Analysis and Forecast
12.1 Introduction
12.2 Latin America Pb-free Solder Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Pb-free Solder Market Size Forecast by Type
12.6.1 Lead-Free Tin Ball
12.6.2 Lead-Free Tin Bar
12.6.3 Lead-Free Tin Wire
12.6.4 Lead-Free Solder Paste
12.6.5 Other
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Pb-free Solder Market Size Forecast by Applications
12.10.1 BGA
12.10.2 CSP & WLCSP
12.10.3 Flip-Chip & Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Pb-free Solder Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Pb-free Solder Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Pb-free Solder Market Size Forecast by Type
13.6.1 Lead-Free Tin Ball
13.6.2 Lead-Free Tin Bar
13.6.3 Lead-Free Tin Wire
13.6.4 Lead-Free Solder Paste
13.6.5 Other
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Pb-free Solder Market Size Forecast by Applications
13.10.1 BGA
13.10.2 CSP & WLCSP
13.10.3 Flip-Chip & Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Pb-free Solder Market: Competitive Dashboard
14.2 Global Pb-free Solder Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Henkel
14.3.2 Nihon Superior
14.3.3 Chernan Technology
14.3.4 Qualitek
14.3.5 Senju Metal Industry
14.3.6 Tamura
14.3.7 Alpha Assembly Solutions
14.3.8 KOKI
14.3.9 Kester
14.3.10 Tongfang Tech
14.3.11 Huaqing Solder
14.3.12 Indium Corporation
14.3.13 Earlysun Technology
14.3.14 AIM Solder
14.3.15 Nordson
14.3.16 Interflux Electronics
14.3.17 Balver Zinn Josef Jost
14.3.18 MG Chemicals
14.3.19 Uchihashi Estec
14.3.20 Guangchen Metal Products
14.3.21 Nihon Almit
14.3.22 Zhongya Electronic Solder
14.3.23 Tianjin Songben