Market Overview:
The global PCB depaneling systems market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for PCB depaneling systems from various end-use industries, such as consumer electronics, communications, industrial/medical, automotive and military/aerospace. In addition, the growing demand for miniaturized and lightweight PCBs is also contributing to the growth of the global PCB depaneling systems market. Based on type, the global PCB depaneling systems market can be segmented into in-line depaneling system and off-line depaneling system. Based on application , th e globa l PC B de pan eli ng sys tem s ma rke t ca nbe segmen tedintoconsumer electronics , communica ti ons , industria l /medica l , automoti ve , milita ry / aerospace an d ot hers segments .
Product Definition:
A PCB depaneling system is a machine that is used to remove the individual PCBs (printed circuit boards) from a larger panel. This can be done manually or automatically, and typically involves some type of blade or saw that cuts through the connecting material between the PCBs.
In-line Depaneling System:
In-line depaneling system is used in the manufacturing process of printed circuit boards (PCB). It’s major function is to provide a high quality surface for coating. In-line depaneling system consists of four major components, it includes planer, stamper, shaper and scaler. Planer is used to reduce the thickness of metal sheets and shape them into a uniform thickness all over the PCB.
Off-line Depaneling System:
The off-line depaneling system is used in the PCB depaneling systems. It's a mechanical equipment that removes the components from a printed circuit board by the help of suction cups and then places them in an assembly line fashion on another PCB. The system includes vacuum former, shippers, dischargers, re-leveler and detector among others.
Application Insights:
The consumer electronics segment accounted for the largest market share in 2017 and is expected to continue its dominance over the forecast period. This can be attributed to growing demand for smart devices, which require small components with high precision. PCB depaneling systems are widely used in assembling smartphones, tablets, e-readers and other smart devices. The increasing demand for such products across the globe has led to an increase in manufacturing activities, thereby augmenting product demand globally.
PCB assembly plays a significant role in enhancing device performance as well as providing aesthetic appeal of a device. Assembled PCBs find applications across various industries including consumer electronics (TVs/LCDs/monitors), automotive (interior & exterior lighting), medical equipment & appliances (monitor panels), military & aerospace (avionics) and communication equipment among others.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for electronic products, especially in China and India. In 2016, China accounted for a share of more than 30% of global PCB production owing to its low labor cost and high availability of land. Moreover, India is also expected to grow at a significant rate due to rapid industrialization along with favorable government policies regarding FDI investments in various sectors including electronics manufacturing sector.
The Asia Pacific region was followed by Europe that accounted for around 27% of the total revenue share in 2016 owing to rising demand from major end-use industries such as automotive, consumer electronics & appliances etc., mainly across Germany, France and Russia among other Eastern European countries. North America is projecteded third-largest market on account of growing production facilities along with increased spending on defense & aerospace applications within U.S.
Growth Factors:
- Increasing demand for miniaturization in electronic products
- Growing trend of using PCBs in automotive and aerospace applications
- Proliferation of 3D printing technology for PCB fabrication
- Rising popularity of LED lighting fixtures
- Emergence of Internet-of-Things (IoT) and connected devices
Scope Of The Report
Report Attributes
Report Details
Report Title
PCB Depaneling Systems Market Research Report
By Type
In-line Depaneling System, Off-line Depaneling System
By Application
Consumer Electronics, Communications, Industrial/Medical, Automotive, Military/Aerospace, Others
By Companies
ASYS Group, Cencorp Automation, SCHUNK Electronic, LPKF Laser & Electronics, CTI, Aurotek Corporation, Keli, SAYAKA, Jieli, IPTE, YUSH Electronic Technology, Genitec, Getech Automation, MSTECH, Osai, Hand in Hand Electronic
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
140
Number of Tables & Figures
98
Customization Available
Yes, the report can be customized as per your need.
Global PCB Depaneling Systems Market Report Segments:
The global PCB Depaneling Systems market is segmented on the basis of:
Types
In-line Depaneling System, Off-line Depaneling System
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Communications, Industrial/Medical, Automotive, Military/Aerospace, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ASYS Group
- Cencorp Automation
- SCHUNK Electronic
- LPKF Laser & Electronics
- CTI
- Aurotek Corporation
- Keli
- SAYAKA
- Jieli
- IPTE
- YUSH Electronic Technology
- Genitec
- Getech Automation
- MSTECH
- Osai
- Hand in Hand Electronic
Highlights of The PCB Depaneling Systems Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- In-line Depaneling System
- Off-line Depaneling System
- By Application:
- Consumer Electronics
- Communications
- Industrial/Medical
- Automotive
- Military/Aerospace
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the PCB Depaneling Systems Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
PCB depaneling systems are used to separate individual PCBs from a large quantity of PCBs. The system uses a series of magnets and an arm that moves the PCBs through the system.
Some of the major companies in the pcb depaneling systems market are ASYS Group, Cencorp Automation, SCHUNK Electronic, LPKF Laser & Electronics, CTI, Aurotek Corporation, Keli, SAYAKA, Jieli, IPTE, YUSH Electronic Technology, Genitec, Getech Automation, MSTECH, Osai, Hand in Hand Electronic.
The pcb depaneling systems market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 PCB Depaneling Systems Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 PCB Depaneling Systems Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 PCB Depaneling Systems Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the PCB Depaneling Systems Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global PCB Depaneling Systems Market Size & Forecast, 2020-2028
4.5.1 PCB Depaneling Systems Market Size and Y-o-Y Growth
4.5.2 PCB Depaneling Systems Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 In-line Depaneling System
5.2.2 Off-line Depaneling System
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Communications
6.2.3 Industrial/Medical
6.2.4 Automotive
6.2.5 Military/Aerospace
6.2.6 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global PCB Depaneling Systems Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 PCB Depaneling Systems Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 In-line Depaneling System
9.6.2 Off-line Depaneling System
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Communications
9.10.3 Industrial/Medical
9.10.4 Automotive
9.10.5 Military/Aerospace
9.10.6 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 In-line Depaneling System
10.6.2 Off-line Depaneling System
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Communications
10.10.3 Industrial/Medical
10.10.4 Automotive
10.10.5 Military/Aerospace
10.10.6 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 In-line Depaneling System
11.6.2 Off-line Depaneling System
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Communications
11.10.3 Industrial/Medical
11.10.4 Automotive
11.10.5 Military/Aerospace
11.10.6 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 In-line Depaneling System
12.6.2 Off-line Depaneling System
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Communications
12.10.3 Industrial/Medical
12.10.4 Automotive
12.10.5 Military/Aerospace
12.10.6 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 In-line Depaneling System
13.6.2 Off-line Depaneling System
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Communications
13.10.3 Industrial/Medical
13.10.4 Automotive
13.10.5 Military/Aerospace
13.10.6 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 PCB Depaneling Systems Market: Competitive Dashboard
14.2 Global PCB Depaneling Systems Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ASYS Group
14.3.2 Cencorp Automation
14.3.3 SCHUNK Electronic
14.3.4 LPKF Laser & Electronics
14.3.5 CTI
14.3.6 Aurotek Corporation
14.3.7 Keli
14.3.8 SAYAKA
14.3.9 Jieli
14.3.10 IPTE
14.3.11 YUSH Electronic Technology
14.3.12 Genitec
14.3.13 Getech Automation
14.3.14 MSTECH
14.3.15 Osai
14.3.16 Hand in Hand Electronic
