Market Overview:
The global PCB reflow oven market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for PCBs in various applications, such as telecommunications, consumer electronics, automotive electronics, and others. In addition, the growing demand for miniaturized and high-density PCBs is also contributing to the growth of this market. On the basis of type, the global PCB reflow oven market can be segmented into convection ovens and vapour phase ovens. The convection oven segment is expected to account for a larger share of this market than the vapour phase oven segment during the forecast period. This can be attributed to its low cost and easy operability as compared with vapour phase ovens. On the basis of application,the global PCB reflow ovenmarket can be divided into telecommunication equipment, consumer electronics equipment (such as smartphones), automotive electronic systems (such as infotainment systems), medical devices (such as pacemakers), industrial control systems (ICS) & machines (such as 3D printers), aerospace & defense systems (A&D) equipment; and other applications including test & measurement instruments).
Product Definition:
A PCB Reflow oven is a piece of equipment used to solder electronic components to a printed circuit board. It heats the components and the board so that the solder melts, joining the component to the board. This type of oven is important because it ensures that all of the components on a PCB are properly soldered, making for a reliable and durable finished product.
Convection Ovens:
Convection ovens are used to cook food by circulating the heat from a heating element around the food. The conventional method of cooking uses direct or indirect flame and is called as Conventional cooking. However, there is a shift in trend towards using convection ovens due to their several advantages such as uniform temperature distribution, less energy consumption, and better usability of kitchen space among others.
Vapour Phase Oven:
Vapour phase oven is a type of high-temperature cooking equipment used in PCB reflow oven. It uses vapour phase change to cook the circuit boards which increases the temperature up to 400°C. The working principle of this equipment is very simple, it works on the basis that as soon as a component gets hot, it vaporizes and carries away all heat from thereon resulting into an effective temperature increase for all components.
Application Insights:
The telecommunication application segment led the market and accounted for more than 30.0% share of the global revenue in 2017. The telecommunication industry is one of the largest consumers of PCBs as they are used to manufacture components and assemble complex electronic products into phones, computers, networking devices, etc. Rapid urbanization coupled with a rising number of mobile phone users is expected to drive demand for reflow ovens in this sector over the forecast period.
The consumer electronics application segment was valued at USD 281 million in 2017 owing to high product demand from major players such as Samsung Electronics Co., Ltd., Apple Inc., Lenovo Group Ltd., Aol Inc., HP Inc., etc.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market with a CAGR of XX% from 2018 to 2030. The growth can be attributed to increasing demand for electronic products in countries such as China, Japan, and India. Furthermore, rising disposable income coupled with the presence of numerous manufacturing facilities will boost product adoption in this region.
The telecommunication industry has witnessed significant growth owing to increased penetration of internet services and mobile phones resulting in an increase in data usage across various industries which is anticipated to drive the Asia Pacific PCB reflow oven market over the forecast period.
Europe was estimated at USD X million as well as USD X million respectively for 2016 and 2017 on account of high demand from major end-use sectors including Consumer Electronics (CE), Automotive Electronics (AE), IT & Telecommunication Equipment (ITTELE).
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive and aerospace industries
- Growing popularity of reflow ovens among small and medium-sized businesses
- Technological advancements that improve the performance of reflow ovens
- Increasing awareness about the benefits of using reflow ovens
Scope Of The Report
Report Attributes
Report Details
Report Title
PCB Reflow Oven Market Research Report
By Type
Convection Ovens, Vapour Phase Oven
By Application
Telecommunication, Consumer Electronics, Automotive Electronics, Others
By Companies
Rehm Thermal Systems, Kurtz Ersa, BTU International, Heller Industries, Shenzhen JT Automation, TAMURA Corporation, ITW EAE, SMT Wertheim, Senju Metal Industry Co., Ltd, Folungwin, JUKI, SEHO Systems GmbH, Suneast, ETA, Papaw, EIGHTECH TECTRON
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
168
Number of Tables & Figures
118
Customization Available
Yes, the report can be customized as per your need.
Global PCB Reflow Oven Market Report Segments:
The global PCB Reflow Oven market is segmented on the basis of:
Types
Convection Ovens, Vapour Phase Oven
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Telecommunication, Consumer Electronics, Automotive Electronics, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Rehm Thermal Systems
- Kurtz Ersa
- BTU International
- Heller Industries
- Shenzhen JT Automation
- TAMURA Corporation
- ITW EAE
- SMT Wertheim
- Senju Metal Industry Co., Ltd
- Folungwin
- JUKI
- SEHO Systems GmbH
- Suneast
- ETA
- Papaw
- EIGHTECH TECTRON
Highlights of The PCB Reflow Oven Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Convection Ovens
- Vapour Phase Oven
- By Application:
- Telecommunication
- Consumer Electronics
- Automotive Electronics
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the PCB Reflow Oven Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
PCB Reflow Oven is a type of oven that uses high temperatures and vacuum to remove the solder paste from printed circuit boards. The PCB Reflow Oven is used to remove the solder paste, which can cause defects in the printed circuit boards.
Some of the major companies in the pcb reflow oven market are Rehm Thermal Systems, Kurtz Ersa, BTU International, Heller Industries, Shenzhen JT Automation, TAMURA Corporation, ITW EAE, SMT Wertheim, Senju Metal Industry Co., Ltd, Folungwin, JUKI, SEHO Systems GmbH, Suneast, ETA, Papaw, EIGHTECH TECTRON.
The pcb reflow oven market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 PCB Reflow Oven Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 PCB Reflow Oven Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 PCB Reflow Oven Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the PCB Reflow Oven Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global PCB Reflow Oven Market Size & Forecast, 2018-2028
4.5.1 PCB Reflow Oven Market Size and Y-o-Y Growth
4.5.2 PCB Reflow Oven Market Absolute $ Opportunity
Chapter 5 Global PCB Reflow Oven Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 PCB Reflow Oven Market Size Forecast by Type
5.2.1 Convection Ovens
5.2.2 Vapour Phase Oven
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global PCB Reflow Oven Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 PCB Reflow Oven Market Size Forecast by Applications
6.2.1 Telecommunication
6.2.2 Consumer Electronics
6.2.3 Automotive Electronics
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global PCB Reflow Oven Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 PCB Reflow Oven Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America PCB Reflow Oven Analysis and Forecast
9.1 Introduction
9.2 North America PCB Reflow Oven Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America PCB Reflow Oven Market Size Forecast by Type
9.6.1 Convection Ovens
9.6.2 Vapour Phase Oven
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America PCB Reflow Oven Market Size Forecast by Applications
9.10.1 Telecommunication
9.10.2 Consumer Electronics
9.10.3 Automotive Electronics
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe PCB Reflow Oven Analysis and Forecast
10.1 Introduction
10.2 Europe PCB Reflow Oven Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe PCB Reflow Oven Market Size Forecast by Type
10.6.1 Convection Ovens
10.6.2 Vapour Phase Oven
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe PCB Reflow Oven Market Size Forecast by Applications
10.10.1 Telecommunication
10.10.2 Consumer Electronics
10.10.3 Automotive Electronics
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific PCB Reflow Oven Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific PCB Reflow Oven Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific PCB Reflow Oven Market Size Forecast by Type
11.6.1 Convection Ovens
11.6.2 Vapour Phase Oven
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific PCB Reflow Oven Market Size Forecast by Applications
11.10.1 Telecommunication
11.10.2 Consumer Electronics
11.10.3 Automotive Electronics
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America PCB Reflow Oven Analysis and Forecast
12.1 Introduction
12.2 Latin America PCB Reflow Oven Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America PCB Reflow Oven Market Size Forecast by Type
12.6.1 Convection Ovens
12.6.2 Vapour Phase Oven
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America PCB Reflow Oven Market Size Forecast by Applications
12.10.1 Telecommunication
12.10.2 Consumer Electronics
12.10.3 Automotive Electronics
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) PCB Reflow Oven Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) PCB Reflow Oven Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) PCB Reflow Oven Market Size Forecast by Type
13.6.1 Convection Ovens
13.6.2 Vapour Phase Oven
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) PCB Reflow Oven Market Size Forecast by Applications
13.10.1 Telecommunication
13.10.2 Consumer Electronics
13.10.3 Automotive Electronics
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 PCB Reflow Oven Market: Competitive Dashboard
14.2 Global PCB Reflow Oven Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Rehm Thermal Systems
14.3.2 Kurtz Ersa
14.3.3 BTU International
14.3.4 Heller Industries
14.3.5 Shenzhen JT Automation
14.3.6 TAMURA Corporation
14.3.7 ITW EAE
14.3.8 SMT Wertheim
14.3.9 Senju Metal Industry Co., Ltd
14.3.10 Folungwin
14.3.11 JUKI
14.3.12 SEHO Systems GmbH
14.3.13 Suneast
14.3.14 ETA
14.3.15 Papaw
14.3.16 EIGHTECH TECTRON
