Market Overview:
The global pin fin heat sink for IGBT market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for energy-efficient and high-performance electronics products, especially in the automotive and consumer electronics industries. In addition, the growing adoption of electric vehicles is also contributing to the growth of this market. The global pin fin heat sink for IGBT market can be segmented on the basis of type into copper pin fin heat sink and aluminum pin fin heat sink. On the basis of application, this market can be segmented into consumer electronics, automotive field, and others. The North American region is expected to account for a major share of this market during the forecast period owing to its large population base and high spending on electronic products such as smartphones, laptops, tablets, etc., which are used by consumers across all age groups.
Product Definition:
Pin fin heat sink is a device that helps in dissipating the heat from an electronic component. It does this by using pins or fins to increase the surface area that comes into contact with the surrounding air. This allows more heat to be transferred away from the component, making it cooler and preventing damage. Pin fin heat sinks are commonly used with IGBTs, as they can produce a lot of heat when they are working.
Copper Pin Fin Heat Sink:
The copper pin fin heat sink is a device that is used to remove the heat from the gate driver transistor in a power electronic device. The main function of this product is to help in increasing the life span of IGBT devices by reducing stress on its components caused due to high temperatures.
Copper Pin Fin Heat Sink, also known as cooling plate or simply pinsink, are widely used for removing.
Aluminum Pin Fin Heat Sink:
An aluminum pin fin heat sink is a device that is used to remove the heat from an insulated gate bipolar transistor (IGBT) and dissipate it into the surrounding environment. The IGBT module generates a significant amount of heat during operation, which must be removed or dissipated in order for the module to operate at its optimal temperature.
Application Insights:
The automotive field was the largest application segment in 2017 and is expected to continue its dominance over the forecast period. The growing demand for electric vehicles across the globe is anticipated to have a positive impact on market growth over the coming years.
The consumer electronics segment is also projected to witness significant growth during the forecast period owing to increasing demand from various end-use applications such as smartphones and wearable devices among others. In addition, rapid technological advancements coupled with miniaturization of electronic components are further expected to propel industry expansion over the coming years.    Pin fin heat sinks are used in numerous other industrial applications including power supplies for computers among others which include air conditioners, refrigerators and industrial furnaces among others which require high thermal conductivity products from vendors like Ascent Technology Corporation., Ltd., Infineon Technologies AG.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market with a CAGR of XX% from 2018 to 2030 owing to rapid industrialization and increasing adoption in end-use industries such as consumer electronics, automotive, and others. The region has witnessed an increase in demand for power electronics products due to growing demand from the rapidly expanding industrial sector coupled with robust economic growth.
The presence of key manufacturers such as WEG, Infineon Technologies (India), Nidec Corporation (Japan), Furukawa Electric Co., Ltd (Japan) among others is anticipated to boost product penetration across various applications thereby supporting the overall industry growth over the forecast period. Furthermore, favorable government initiatives pertaining rising investments are projecteded towards manufacturing electric vehicles along with high potential for solar energy generation will further propel industry expansion over next eight years.
Europe was estimated at USD X million in 2017.
Growth Factors:
- Increasing demand for IGBTs in power electronics applications
- Growing adoption of pin fin heat sink in automotive and industrial sectors
- Rising demand for high-performance cooling solutions
- Technological advancements in the field of heat sinks
- Growing awareness about the benefits of using pin fin heat sink
Scope Of The Report
Report Attributes
Report Details
Report Title
Pin Fin Heat Sink for IGBT Market Research Report
By Type
Copper Pin Fin Heat Sink, Aluminum Pin Fin Heat Sink
By Application
Consumer Electronics, Automotive Field, Others
By Companies
Advanced Micro Devices (AMD), Apex Microtechnology, Aavid Thermalloy, LLC, Advanced Thermal Solutions, Inc., Allbrass Industrial, CUI Inc, Comair Rotron, Honeywell International Inc, Kunshan Googe Metal Products Co., Ltd., Advanced Micro Devices (AMD)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
161
Number of Tables & Figures
113
Customization Available
Yes, the report can be customized as per your need.
Global Pin Fin Heat Sink for IGBT Market Report Segments:
The global Pin Fin Heat Sink for IGBT market is segmented on the basis of:
Types
Copper Pin Fin Heat Sink, Aluminum Pin Fin Heat Sink
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Automotive Field, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Advanced Micro Devices (AMD)
- Apex Microtechnology
- Aavid Thermalloy, LLC
- Advanced Thermal Solutions, Inc.
- Allbrass Industrial
- CUI Inc
- Comair Rotron
- Honeywell International Inc
- Kunshan Googe Metal Products Co., Ltd.
- Advanced Micro Devices (AMD)
Highlights of The Pin Fin Heat Sink for IGBT Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Copper Pin Fin Heat Sink
- Aluminum Pin Fin Heat Sink
- By Application:
- Consumer Electronics
- Automotive Field
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Pin Fin Heat Sink for IGBT Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A heat sink for IGBTs is a component that helps to dissipate the heat generated by the IGBT. This is especially important when the IGBTs are used in high-power applications, such as solar energy systems.
Some of the key players operating in the pin fin heat sink for igbt market are Advanced Micro Devices (AMD), Apex Microtechnology, Aavid Thermalloy, LLC, Advanced Thermal Solutions, Inc., Allbrass Industrial, CUI Inc, Comair Rotron, Honeywell International Inc, Kunshan Googe Metal Products Co., Ltd., Advanced Micro Devices (AMD).
The pin fin heat sink for igbt market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Pin Fin Heat Sink for IGBT Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Pin Fin Heat Sink for IGBT Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Pin Fin Heat Sink for IGBT Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Pin Fin Heat Sink for IGBT Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Pin Fin Heat Sink for IGBT Market Size & Forecast, 2018-2028
4.5.1 Pin Fin Heat Sink for IGBT Market Size and Y-o-Y Growth
4.5.2 Pin Fin Heat Sink for IGBT Market Absolute $ Opportunity
Chapter 5 Global Pin Fin Heat Sink for IGBT Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Pin Fin Heat Sink for IGBT Market Size Forecast by Type
5.2.1 Copper Pin Fin Heat Sink
5.2.2 Aluminum Pin Fin Heat Sink
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Pin Fin Heat Sink for IGBT Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Pin Fin Heat Sink for IGBT Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Automotive Field
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Pin Fin Heat Sink for IGBT Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Pin Fin Heat Sink for IGBT Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Pin Fin Heat Sink for IGBT Analysis and Forecast
9.1 Introduction
9.2 North America Pin Fin Heat Sink for IGBT Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Pin Fin Heat Sink for IGBT Market Size Forecast by Type
9.6.1 Copper Pin Fin Heat Sink
9.6.2 Aluminum Pin Fin Heat Sink
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Pin Fin Heat Sink for IGBT Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Automotive Field
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Pin Fin Heat Sink for IGBT Analysis and Forecast
10.1 Introduction
10.2 Europe Pin Fin Heat Sink for IGBT Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Pin Fin Heat Sink for IGBT Market Size Forecast by Type
10.6.1 Copper Pin Fin Heat Sink
10.6.2 Aluminum Pin Fin Heat Sink
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Pin Fin Heat Sink for IGBT Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Automotive Field
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Pin Fin Heat Sink for IGBT Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Pin Fin Heat Sink for IGBT Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Pin Fin Heat Sink for IGBT Market Size Forecast by Type
11.6.1 Copper Pin Fin Heat Sink
11.6.2 Aluminum Pin Fin Heat Sink
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Pin Fin Heat Sink for IGBT Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Automotive Field
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Pin Fin Heat Sink for IGBT Analysis and Forecast
12.1 Introduction
12.2 Latin America Pin Fin Heat Sink for IGBT Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Pin Fin Heat Sink for IGBT Market Size Forecast by Type
12.6.1 Copper Pin Fin Heat Sink
12.6.2 Aluminum Pin Fin Heat Sink
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Pin Fin Heat Sink for IGBT Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Automotive Field
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Pin Fin Heat Sink for IGBT Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Pin Fin Heat Sink for IGBT Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Pin Fin Heat Sink for IGBT Market Size Forecast by Type
13.6.1 Copper Pin Fin Heat Sink
13.6.2 Aluminum Pin Fin Heat Sink
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Pin Fin Heat Sink for IGBT Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Automotive Field
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Pin Fin Heat Sink for IGBT Market: Competitive Dashboard
14.2 Global Pin Fin Heat Sink for IGBT Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Advanced Micro Devices (AMD)
14.3.2 Apex Microtechnology
14.3.3 Aavid Thermalloy, LLC
14.3.4 Advanced Thermal Solutions, Inc.
14.3.5 Allbrass Industrial
14.3.6 CUI Inc
14.3.7 Comair Rotron
14.3.8 Honeywell International Inc
14.3.9 Kunshan Googe Metal Products Co., Ltd.
14.3.10 Advanced Micro Devices (AMD)
