Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Plasma Etch System for Wafer Processing Market by Type (Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE)), By Application (Semiconductor, Electronics and Microelectronics, Other) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Plasma Etch System for Wafer Processing Market by Type (Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE)), By Application (Semiconductor, Electronics and Microelectronics, Other) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 262902 4200 Machinery & Equipment 377 157 Pages 4.8 (38)
                                          

Market Overview:


The global plasma etch system for wafer processing market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor and electronics products, and the growing trend of miniaturization in these industries. In addition, the increasing demand for 3D-printed electronics is also contributing to the growth of this market. On the basis of type, inductively coupled plasma (ICP) systems accounted for a major share of the global plasma etch system for wafer processing market in 2017. This can be attributed to their high throughput and superior performance as compared to other types of systems such as reactive ion etching (RIE) and deep reactive ion etching (DRIE). ICP systems are mainly used in applications such as semiconductor fabrication, microelectronics fabrication, MEMS fabrication, and others. On the basis of application, semiconductors accounted for a major share of the global plasma etch system for wafer processing market in 2017. This can be attributed to their high demand across various end-use industries such as consumer electronics, automotive industry, telecommunications industry etc.


Global Plasma Etch System for Wafer Processing Industry Outlook


Product Definition:


A plasma etch system is a device used to produce a plasma to etch away material from a workpiece. The importance of the plasma etch system for wafer processing is that it can provide an efficient and consistent means of removing material from the surface of a workpiece. This can be important for creating features on the surface of a workpiece, such as in microfabrication or semiconductor manufacturing.


Inductively Coupled Plasma (ICP):


Inductively coupled plasma (ICP) is a chemical process used for etching wafers in integrated circuits (IC). It utilizes an electric field to separate the silicon from the wafer. The ICP system uses a plasma as an etching medium which is generated by introducing gas into a chamber containing silica sand and metal salts.


Reactive Ion Etching (RIE):


Reactive ion etching (RIE) is a low-temperature process used to remove material from a wafer. It utilizes an accelerated gas of charged particles to remove material by chemical reactions and physical abrasion. The accelerated gas comprises mainly of ions, which are made up of atoms or molecules with extra electron pairs. These ions travel at high speed in the direction of the wafer surface and react with the materials present there by removing them from the surface gradually.


Application Insights:


The semiconductor application segment accounted for the largest market share in 2017 and is projected to expand at a CAGR of XX% over the forecast period. The growth can be attributed to increasing demand for integrated circuits from various end-use applications such as telecommunication, computing, automotive and healthcare. Furthermore, increasing adoption of 3D IC packaging will further propel the industry growth over the coming years.


Electronics and microelectronics is one of the fastest growing application segments owing to rising demand for advanced products with enhanced performance capabilities across all major regions including North America, Europe, Asia Pacific and Latin America. Plasma etch systems are used extensively in electronic manufacturing facilities due to their ability provide clean surfaces on which devices can be mounted without any additional masks or steps required during device packaging or testing procedures post completion of assembly operations at plant level.


Regional Analysis:


North America dominated the global market in 2017. The growth of this region can be attributed to increasing adoption of advanced technologies, presence of major players, and high demand for electronic products. Asia Pacific is expected to witness the fastest growth over the forecast period owing to rapid technological advancements and increased focus on developing microelectronics. Moreover, growing demand for consumer electronics such as smartphones and tablets is also anticipated to drive regional market growth over the next eight years.


The European region accounted for a significant share in terms of revenue in 2017 due to high manufacturing volume associated with semiconductor devices including computer chipsets, memory chipsets, digital signal processors (DSPs), application specific integrated circuits (ASICs), etc., which are being manufactured using plasma etch techniques at various foundries across Europe. In addition, presence of key industry participants such as Infineon Technologies AG; Lamina Technology LLC; Maxim Integrated Products Inc.; Micron Technology Inc.; Skyworks Solutions Holdings Inc.


Growth Factors:


  • Increasing demand for semiconductor devices and electronic products
  • Growing number of applications for plasma etching systems in various industries
  • Technological advancements in plasma etching systems that offer high performance and efficiency
  • Rising demand from developing countries for advanced plasma etching systems
  • Increasing investments by leading players to strengthen their position in the global market

Scope Of The Report

Report Attributes

Report Details

Report Title

Plasma Etch System for Wafer Processing Market Research Report

By Type

Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE)

By Application

Semiconductor, Electronics and Microelectronics, Other

By Companies

Oxford Instruments, ULVAC, Lam Research, AMEC, PlasmaTherm, SAMCO, Applied Materials, Sentech, SPTS Technologies (an Orbotech Company), GigaLane, Oxford Instruments, Trion Technology, NAURA, Plasma Etch, Inc., Tokyo Electron Limited

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

157

Number of Tables & Figures

110

Customization Available

Yes, the report can be customized as per your need.


Global Plasma Etch System for Wafer Processing Market Report Segments:

The global Plasma Etch System for Wafer Processing market is segmented on the basis of:

Types

Inductively Coupled Plasma (ICP), Reactive Ion Etching (RIE), Deep Reactive Ion Etching (DRIE)

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

Semiconductor, Electronics and Microelectronics, Other

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. Oxford Instruments
  2. ULVAC
  3. Lam Research
  4. AMEC
  5. PlasmaTherm
  6. SAMCO
  7. Applied Materials
  8. Sentech
  9. SPTS Technologies (an Orbotech Company)
  10. GigaLane
  11. Oxford Instruments
  12. Trion Technology
  13. NAURA
  14. Plasma Etch, Inc.
  15. Tokyo Electron Limited

Global Plasma Etch System for Wafer Processing Market Overview


Highlights of The Plasma Etch System for Wafer Processing Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. Inductively Coupled Plasma (ICP)
    2. Reactive Ion Etching (RIE)
    3. Deep Reactive Ion Etching (DRIE)
  1. By Application:

    1. Semiconductor
    2. Electronics and Microelectronics
    3. Other
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Plasma Etch System for Wafer Processing Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

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Global Plasma Etch System for Wafer Processing Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


The plasma etch system is a specialized tool that uses an electric arc to remove material from a wafer. The process can be used to create features on the surface of the wafer, or to remove material completely.

Some of the major companies in the plasma etch system for wafer processing market are Oxford Instruments, ULVAC, Lam Research, AMEC, PlasmaTherm, SAMCO, Applied Materials, Sentech, SPTS Technologies (an Orbotech Company), GigaLane, Oxford Instruments, Trion Technology, NAURA, Plasma Etch, Inc., Tokyo Electron Limited.

The plasma etch system for wafer processing market is expected to grow at a compound annual growth rate of 6.5%.

                                            
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Plasma Etch System for Wafer Processing Market Overview    4.1 Introduction       4.1.1 Market Taxonomy       4.1.2 Market Definition       4.1.3 Macro-Economic Factors Impacting the Market Growth    4.2 Plasma Etch System for Wafer Processing Market Dynamics       4.2.1 Market Drivers       4.2.2 Market Restraints       4.2.3 Market Opportunity    4.3 Plasma Etch System for Wafer Processing Market - Supply Chain Analysis       4.3.1 List of Key Suppliers       4.3.2 List of Key Distributors       4.3.3 List of Key Consumers    4.4 Key Forces Shaping the Plasma Etch System for Wafer Processing Market       4.4.1 Bargaining Power of Suppliers       4.4.2 Bargaining Power of Buyers       4.4.3 Threat of Substitution       4.4.4 Threat of New Entrants       4.4.5 Competitive Rivalry    4.5 Global Plasma Etch System for Wafer Processing Market Size & Forecast, 2018-2028       4.5.1 Plasma Etch System for Wafer Processing Market Size and Y-o-Y Growth       4.5.2 Plasma Etch System for Wafer Processing Market Absolute $ Opportunity

Chapter 5 Global Plasma Etch System for Wafer Processing Market Analysis and Forecast by Type
   5.1 Introduction
      5.1.1 Key Market Trends & Growth Opportunities by Type
      5.1.2 Basis Point Share (BPS) Analysis by Type
      5.1.3 Absolute $ Opportunity Assessment by Type
   5.2 Plasma Etch System for Wafer Processing Market Size Forecast by Type
      5.2.1 Inductively Coupled Plasma (ICP)
      5.2.2 Reactive Ion Etching (RIE)
      5.2.3 Deep Reactive Ion Etching (DRIE)
   5.3 Market Attractiveness Analysis by Type

Chapter 6 Global Plasma Etch System for Wafer Processing Market Analysis and Forecast by Applications
   6.1 Introduction
      6.1.1 Key Market Trends & Growth Opportunities by Applications
      6.1.2 Basis Point Share (BPS) Analysis by Applications
      6.1.3 Absolute $ Opportunity Assessment by Applications
   6.2 Plasma Etch System for Wafer Processing Market Size Forecast by Applications
      6.2.1 Semiconductor
      6.2.2 Electronics and Microelectronics
      6.2.3 Other
   6.3 Market Attractiveness Analysis by Applications

Chapter 7 Global Plasma Etch System for Wafer Processing Market Analysis and Forecast by Region
   7.1 Introduction
      7.1.1 Key Market Trends & Growth Opportunities by Region
      7.1.2 Basis Point Share (BPS) Analysis by Region
      7.1.3 Absolute $ Opportunity Assessment by Region
   7.2 Plasma Etch System for Wafer Processing Market Size Forecast by Region
      7.2.1 North America
      7.2.2 Europe
      7.2.3 Asia Pacific
      7.2.4 Latin America
      7.2.5 Middle East & Africa (MEA)
   7.3 Market Attractiveness Analysis by Region

Chapter 8 Coronavirus Disease (COVID-19) Impact 
   8.1 Introduction 
   8.2 Current & Future Impact Analysis 
   8.3 Economic Impact Analysis 
   8.4 Government Policies 
   8.5 Investment Scenario

Chapter 9 North America Plasma Etch System for Wafer Processing Analysis and Forecast
   9.1 Introduction
   9.2 North America Plasma Etch System for Wafer Processing Market Size Forecast by Country
      9.2.1 U.S.
      9.2.2 Canada
   9.3 Basis Point Share (BPS) Analysis by Country
   9.4 Absolute $ Opportunity Assessment by Country
   9.5 Market Attractiveness Analysis by Country
   9.6 North America Plasma Etch System for Wafer Processing Market Size Forecast by Type
      9.6.1 Inductively Coupled Plasma (ICP)
      9.6.2 Reactive Ion Etching (RIE)
      9.6.3 Deep Reactive Ion Etching (DRIE)
   9.7 Basis Point Share (BPS) Analysis by Type 
   9.8 Absolute $ Opportunity Assessment by Type 
   9.9 Market Attractiveness Analysis by Type
   9.10 North America Plasma Etch System for Wafer Processing Market Size Forecast by Applications
      9.10.1 Semiconductor
      9.10.2 Electronics and Microelectronics
      9.10.3 Other
   9.11 Basis Point Share (BPS) Analysis by Applications 
   9.12 Absolute $ Opportunity Assessment by Applications 
   9.13 Market Attractiveness Analysis by Applications

Chapter 10 Europe Plasma Etch System for Wafer Processing Analysis and Forecast
   10.1 Introduction
   10.2 Europe Plasma Etch System for Wafer Processing Market Size Forecast by Country
      10.2.1 Germany
      10.2.2 France
      10.2.3 Italy
      10.2.4 U.K.
      10.2.5 Spain
      10.2.6 Russia
      10.2.7 Rest of Europe
   10.3 Basis Point Share (BPS) Analysis by Country
   10.4 Absolute $ Opportunity Assessment by Country
   10.5 Market Attractiveness Analysis by Country
   10.6 Europe Plasma Etch System for Wafer Processing Market Size Forecast by Type
      10.6.1 Inductively Coupled Plasma (ICP)
      10.6.2 Reactive Ion Etching (RIE)
      10.6.3 Deep Reactive Ion Etching (DRIE)
   10.7 Basis Point Share (BPS) Analysis by Type 
   10.8 Absolute $ Opportunity Assessment by Type 
   10.9 Market Attractiveness Analysis by Type
   10.10 Europe Plasma Etch System for Wafer Processing Market Size Forecast by Applications
      10.10.1 Semiconductor
      10.10.2 Electronics and Microelectronics
      10.10.3 Other
   10.11 Basis Point Share (BPS) Analysis by Applications 
   10.12 Absolute $ Opportunity Assessment by Applications 
   10.13 Market Attractiveness Analysis by Applications

Chapter 11 Asia Pacific Plasma Etch System for Wafer Processing Analysis and Forecast
   11.1 Introduction
   11.2 Asia Pacific Plasma Etch System for Wafer Processing Market Size Forecast by Country
      11.2.1 China
      11.2.2 Japan
      11.2.3 South Korea
      11.2.4 India
      11.2.5 Australia
      11.2.6 South East Asia (SEA)
      11.2.7 Rest of Asia Pacific (APAC)
   11.3 Basis Point Share (BPS) Analysis by Country
   11.4 Absolute $ Opportunity Assessment by Country
   11.5 Market Attractiveness Analysis by Country
   11.6 Asia Pacific Plasma Etch System for Wafer Processing Market Size Forecast by Type
      11.6.1 Inductively Coupled Plasma (ICP)
      11.6.2 Reactive Ion Etching (RIE)
      11.6.3 Deep Reactive Ion Etching (DRIE)
   11.7 Basis Point Share (BPS) Analysis by Type 
   11.8 Absolute $ Opportunity Assessment by Type 
   11.9 Market Attractiveness Analysis by Type
   11.10 Asia Pacific Plasma Etch System for Wafer Processing Market Size Forecast by Applications
      11.10.1 Semiconductor
      11.10.2 Electronics and Microelectronics
      11.10.3 Other
   11.11 Basis Point Share (BPS) Analysis by Applications 
   11.12 Absolute $ Opportunity Assessment by Applications 
   11.13 Market Attractiveness Analysis by Applications

Chapter 12 Latin America Plasma Etch System for Wafer Processing Analysis and Forecast
   12.1 Introduction
   12.2 Latin America Plasma Etch System for Wafer Processing Market Size Forecast by Country
      12.2.1 Brazil
      12.2.2 Mexico
      12.2.3 Rest of Latin America (LATAM)
   12.3 Basis Point Share (BPS) Analysis by Country
   12.4 Absolute $ Opportunity Assessment by Country
   12.5 Market Attractiveness Analysis by Country
   12.6 Latin America Plasma Etch System for Wafer Processing Market Size Forecast by Type
      12.6.1 Inductively Coupled Plasma (ICP)
      12.6.2 Reactive Ion Etching (RIE)
      12.6.3 Deep Reactive Ion Etching (DRIE)
   12.7 Basis Point Share (BPS) Analysis by Type 
   12.8 Absolute $ Opportunity Assessment by Type 
   12.9 Market Attractiveness Analysis by Type
   12.10 Latin America Plasma Etch System for Wafer Processing Market Size Forecast by Applications
      12.10.1 Semiconductor
      12.10.2 Electronics and Microelectronics
      12.10.3 Other
   12.11 Basis Point Share (BPS) Analysis by Applications 
   12.12 Absolute $ Opportunity Assessment by Applications 
   12.13 Market Attractiveness Analysis by Applications

Chapter 13 Middle East & Africa (MEA) Plasma Etch System for Wafer Processing Analysis and Forecast
   13.1 Introduction
   13.2 Middle East & Africa (MEA) Plasma Etch System for Wafer Processing Market Size Forecast by Country
      13.2.1 Saudi Arabia
      13.2.2 South Africa
      13.2.3 UAE
      13.2.4 Rest of Middle East & Africa (MEA)
   13.3 Basis Point Share (BPS) Analysis by Country
   13.4 Absolute $ Opportunity Assessment by Country
   13.5 Market Attractiveness Analysis by Country
   13.6 Middle East & Africa (MEA) Plasma Etch System for Wafer Processing Market Size Forecast by Type
      13.6.1 Inductively Coupled Plasma (ICP)
      13.6.2 Reactive Ion Etching (RIE)
      13.6.3 Deep Reactive Ion Etching (DRIE)
   13.7 Basis Point Share (BPS) Analysis by Type 
   13.8 Absolute $ Opportunity Assessment by Type 
   13.9 Market Attractiveness Analysis by Type
   13.10 Middle East & Africa (MEA) Plasma Etch System for Wafer Processing Market Size Forecast by Applications
      13.10.1 Semiconductor
      13.10.2 Electronics and Microelectronics
      13.10.3 Other
   13.11 Basis Point Share (BPS) Analysis by Applications 
   13.12 Absolute $ Opportunity Assessment by Applications 
   13.13 Market Attractiveness Analysis by Applications

Chapter 14 Competition Landscape 
   14.1 Plasma Etch System for Wafer Processing Market: Competitive Dashboard
   14.2 Global Plasma Etch System for Wafer Processing Market: Market Share Analysis, 2019
   14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.3.1 Oxford Instruments
      14.3.2 ULVAC
      14.3.3 Lam Research
      14.3.4 AMEC
      14.3.5 PlasmaTherm
      14.3.6 SAMCO
      14.3.7 Applied Materials
      14.3.8 Sentech
      14.3.9 SPTS Technologies (an Orbotech Company)
      14.3.10 GigaLane
      14.3.11 Oxford Instruments
      14.3.12 Trion Technology
      14.3.13 NAURA
      14.3.14 Plasma Etch, Inc.
      14.3.15 Tokyo Electron Limited

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