Market Overview:
The global power supply in package and power supply on chip market is expected to grow at a CAGR of 6.5% from 2018 to 2030. The growth of this market can be attributed to the increasing demand for miniaturization and higher efficiency in electronic devices, rising adoption of advanced technologies such as 5G, and growing demand for electric vehicles. In terms of type, the power supply in package segment is expected to account for the majority share of the global market during the forecast period. This segment is projected to grow at a CAGR of 7.0% from 2018 to 2030 due to its high efficiency and miniaturization benefits over traditional discrete power supplies.
Product Definition:
The power supply in package (PSiP) and power supply on chip (PSoc) are important for many reasons. First, the PSiP provides a regulated voltage to the chip, which is necessary for proper operation. Second, the PSiP distributes power evenly across the die, which is important for heat dissipation.
Power Supply in Package:
Power Supply in Package, or P-SIP for short, is a new emerging trend in the power supply market. It is also known as Integrated Power Supply (IPS) and Smart Inverter Switched Mode Power Supply (SMPS). The P-SIP concept allows to integrate all electronic components into one single package.
The key driver of this technology is the need for reducing space occupied by electronic devices while delivering high performance efficiency.
Power Supply on Chip:
Power Supply on Chip (PSOC) is a power management integrated circuit that integrates all the essential components such as voltage regulator, current sense resistors, capacitors and other ancillary components on a single chip. It reduces the number of wires between the Power Supply Unit (PSU) and end-user devices.
Application Insights:
The telecom & IT application segment led the global power supply in package and power supply on chip market in 2017. The segment is projected to expand at a CAGR of XX% over the forecast period owing to increasing demand for high-speed data transfer services, especially from emerging countries such as India, China and Brazil. In addition, growing demand for smart devices is expected to drive the growth of telecom equipment over the coming years which will further fuel product demand during 2018-2030 period.
The consumer electronics application segment accounted for more than 30% share of total revenue in 2017 due to extensive usage of portable electronic devices including smartphones, tablets and e-readers across various end-use industries such as retailing, hospitality and transportation among others. Growing preference towards advanced technology products has been driving their sales which will have a positive impact on market growth during 2018 - 2030 period.
Regional Analysis:
The APAC region is expected to witness the highest CAGR of XX% during the forecast period. The growth can be attributed to increasing demand for power supply in package and power supply on chip from major application sectors including consumer electronics, telecom & IT, automotive, medical devices and others.
Increasing penetration of smartphones and high-speed internet connectivity have led to an exponential rise in data consumption across various industries which has resulted into increased requirement for global power supplies in package as well as Power Supply On Chip solutions. Moreover, rising investments by key players such as Qualcomm Inc., Broadcom Inc., Mediatek Ltd., MediaTek Inc.; along with favorable government regulations aimed at promoting digitalization are anticipated to drive industry growth over the next eight years.
North America accounted for a significant market share owing to early adoption of advanced technologies such as 3D printing and IoT-based smart homes among other factors that are expected drive regional growth over the forecast period.
Growth Factors:
- Increasing demand from the data center and telecommunications sectors
- Rising demand for miniaturization and higher efficiency in power supply systems
- Proliferation of portable devices and the need for smaller, lighter, and more efficient power supplies
- Development of new technologies that require higher-power density supplies
- Growing market for renewable energy sources such as solar and wind power
Scope Of The Report
Report Attributes
Report Details
Report Title
Power Supply in Package and Power Supply on Chip Market Research Report
By Type
Power Supply in Package, Power Supply on Chip
By Application
Consumer Electronics, Telecom & IT, Automotive, Medical Devices, Military & Defense, Other
By Companies
Intel Corporation, ASE Group, Amkor Technology, TDK Corporation, Panasonic, Bel Fuse Inc., Jiangsu Changjiang Electronics Technology, Texas Instruments Incorporated, ON Semiconductor, Vicor Corporation
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
134
Number of Tables & Figures
94
Customization Available
Yes, the report can be customized as per your need.
Global Power Supply in Package and Power Supply on Chip Market Report Segments:
The global Power Supply in Package and Power Supply on Chip market is segmented on the basis of:
Types
Power Supply in Package, Power Supply on Chip
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Telecom & IT, Automotive, Medical Devices, Military & Defense, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Intel Corporation
- ASE Group
- Amkor Technology
- TDK Corporation
- Panasonic
- Bel Fuse Inc.
- Jiangsu Changjiang Electronics Technology
- Texas Instruments Incorporated
- ON Semiconductor
- Vicor Corporation
Highlights of The Power Supply in Package and Power Supply on Chip Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Power Supply in Package
- Power Supply on Chip
- By Application:
- Consumer Electronics
- Telecom & IT
- Automotive
- Medical Devices
- Military & Defense
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Power Supply in Package and Power Supply on Chip Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A power supply in package is a power supply that is built into the device itself. Power supplies on chip are power supplies that are built into the microcontroller or other central processing unit (CPU) of a computer or other electronic device.
Some of the key players operating in the power supply in package and power supply on chip market are Intel Corporation, ASE Group, Amkor Technology, TDK Corporation, Panasonic, Bel Fuse Inc., Jiangsu Changjiang Electronics Technology, Texas Instruments Incorporated, ON Semiconductor, Vicor Corporation.
The power supply in package and power supply on chip market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Power Supply in Package and Power Supply on Chip Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Power Supply in Package and Power Supply on Chip Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Power Supply in Package and Power Supply on Chip Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Power Supply in Package and Power Supply on Chip Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Power Supply in Package and Power Supply on Chip Market Size & Forecast, 2020-2028
4.5.1 Power Supply in Package and Power Supply on Chip Market Size and Y-o-Y Growth
4.5.2 Power Supply in Package and Power Supply on Chip Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Power Supply in Package
5.2.2 Power Supply on Chip
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Telecom & IT
6.2.3 Automotive
6.2.4 Medical Devices
6.2.5 Military & Defense
6.2.6 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Power Supply in Package and Power Supply on Chip Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Power Supply in Package and Power Supply on Chip Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Power Supply in Package
9.6.2 Power Supply on Chip
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Telecom & IT
9.10.3 Automotive
9.10.4 Medical Devices
9.10.5 Military & Defense
9.10.6 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Power Supply in Package
10.6.2 Power Supply on Chip
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Telecom & IT
10.10.3 Automotive
10.10.4 Medical Devices
10.10.5 Military & Defense
10.10.6 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Power Supply in Package
11.6.2 Power Supply on Chip
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Telecom & IT
11.10.3 Automotive
11.10.4 Medical Devices
11.10.5 Military & Defense
11.10.6 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Power Supply in Package
12.6.2 Power Supply on Chip
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Telecom & IT
12.10.3 Automotive
12.10.4 Medical Devices
12.10.5 Military & Defense
12.10.6 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Power Supply in Package
13.6.2 Power Supply on Chip
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Telecom & IT
13.10.3 Automotive
13.10.4 Medical Devices
13.10.5 Military & Defense
13.10.6 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Power Supply in Package and Power Supply on Chip Market: Competitive Dashboard
14.2 Global Power Supply in Package and Power Supply on Chip Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Intel Corporation
14.3.2 ASE Group
14.3.3 Amkor Technology
14.3.4 TDK Corporation
14.3.5 Panasonic
14.3.6 Bel Fuse Inc.
14.3.7 Jiangsu Changjiang Electronics Technology
14.3.8 Texas Instruments Incorporated
14.3.9 ON Semiconductor
14.3.10 Vicor Corporation
