Market Overview:
The global PCB e-scrap market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for precious metals and metals from various applications, such as telecommunications, TV & monitor, PC & laptop, smartphones, and others. In terms of type, the telecommunications segment is expected to hold the largest share of the PCB e-scrap market during the forecast period. This can be attributed to increased use of electronic devices in telecom applications and rising demand for recycled materials from this segment.
 E-Scrap Industry Outlook.svg)
Product Definition:
A Printed Circuit Board (PCB) is a piece of hardware that holds electronic components in place. PCBs are used in a variety of electronics, from computers and cell phones to medical devices and industrial equipment.
E-Scrap is the term for discarded electronic devices and their components. Printed Circuit Board (PCB) E-Scrap is specifically refers to the boards, wiring, and other components that make up these devices.
The importance of Printed Circuit Board (PCB) E-Scrap lies in its valuable materials content. PCBs are made up of metals like gold, silver, copper, and platinum, as well as plastics and other materials that can be recycled or reused.
Telecommunications:
Telecommunications is the set of rules and protocols that enable the transmission of information over telecommunication networks with the help of modulated waves. It offers benefits such as increased efficiency, speed, and convenience in exchange for a fee. The global market for telecommunications services is expected to grow at a CAGR (Compound Annual Growth Rate) exceeding 5% from 2018 to 2025 owing to increasing demand from end-use industries such as automotive, healthcare & life sciences, IT & telecomms.
TV & Monitor:
TV & Monitor and it's usage in Printed Circuit Board (PCB) E-Scrap market is a service by which unwanted TV & monitors are collected from residential as well as commercial places and then processed for reuse. The scrap items are ferried to the processing units where they are cut into small pieces, washed, crushed, melted and then formed into a new component with different shapes.
Application Insights:
PCB e-scrap is widely used in precious metals applications owing to its high electrical conductivity. The precious metal industry has been witnessing a steady growth on account of increasing demand for jewelry, ornaments and investments. The growth can be attributed to the growing middle-class population across the globe, which has resulted in an increased demand for gold and silver products including jewelry, ornaments and investments. This trend is expected to continue over the forecast period thus driving PCB e-scrap usage in precious metals applications.
The electronics industry mainly consists of two sectors namely telecom & IT and consumer electronics which includes smartphones, smartwatches & wearables devices among others.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The region offers a huge opportunity for electronic scrap dealers as there is a high production of e-waste in countries, such as China, South Korea, Japan, and India. These countries are among the top five producers of e-waste across the globe.
The growing manufacturing sector coupled with rising investments from foreign companies to establish their businesses in Asia Pacific has led to an increase in telecommunication PCBs being generated thereby driving up overall demand for printed circuit boards scrap globally. However, strict government policies regarding waste management may hinder growth during the forecast period.
Growth Factors:
- Increasing demand for PCBs in the electronics industry
- Rapid technological advancements and miniaturization of electronic devices
- Growing popularity of disposable and single-use electronic devices
- Proliferation of e-waste recycling facilities worldwide
- Stringent government regulations on e-waste disposal
Scope Of The Report
Report Attributes
Report Details
Report Title
Printed Circuit Board (PCB) E-Scrap Market Research Report
By Type
Telecommunications, TV & Monitor, PC & Laptop, Smartphones, Others
By Application
Precious Metals (Gold, Silver, Palladium), Metals (Copper, Aluminum, Tin), Others
By Companies
Boliden, Umicore, Aurubis, Mitsubishi Materials Corporation, Asahi Holdings, Glencore(Canada), LS-Nikko Copper, Dowa Holdings, Mitsui Mining & Smelting, JX Nippon Mining & Metals, GEM Co.,Ltd.
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
181
Number of Tables & Figures
127
Customization Available
Yes, the report can be customized as per your need.
Global Printed Circuit Board (PCB) E-Scrap Market Report Segments:
The global Printed Circuit Board (PCB) E-Scrap market is segmented on the basis of:
Types
Telecommunications, TV & Monitor, PC & Laptop, Smartphones, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Precious Metals (Gold, Silver, Palladium), Metals (Copper, Aluminum, Tin), Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Boliden
- Umicore
- Aurubis
- Mitsubishi Materials Corporation
- Asahi Holdings
- Glencore(Canada)
- LS-Nikko Copper
- Dowa Holdings
- Mitsui Mining & Smelting
- JX Nippon Mining & Metals
- GEM Co.,Ltd.
 E-Scrap Market Overview.svg)
Highlights of The Printed Circuit Board (PCB) E-Scrap Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Telecommunications
- TV & Monitor
- PC & Laptop
- Smartphones
- Others
- By Application:
- Precious Metals (Gold, Silver, Palladium)
- Metals (Copper, Aluminum, Tin)
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Printed Circuit Board (PCB) E-Scrap Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 E-Scrap Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Printed Circuit Board (PCB) E-Scrap is a material that is made up of discarded printed circuit boards. PCBs are used in electronic devices and can be recycled into new boards.
Some of the key players operating in the printed circuit board (pcb) e-scrap market are Boliden, Umicore, Aurubis, Mitsubishi Materials Corporation, Asahi Holdings, Glencore(Canada), LS-Nikko Copper, Dowa Holdings, Mitsui Mining & Smelting, JX Nippon Mining & Metals, GEM Co.,Ltd..
The printed circuit board (pcb) e-scrap market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Printed Circuit Board (PCB) E-Scrap Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Printed Circuit Board (PCB) E-Scrap Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Printed Circuit Board (PCB) E-Scrap Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Printed Circuit Board (PCB) E-Scrap Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Printed Circuit Board (PCB) E-Scrap Market Size & Forecast, 2020-2028
4.5.1 Printed Circuit Board (PCB) E-Scrap Market Size and Y-o-Y Growth
4.5.2 Printed Circuit Board (PCB) E-Scrap Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Telecommunications
5.2.2 TV & Monitor
5.2.3 PC & Laptop
5.2.4 Smartphones
5.2.5 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Precious Metals (Gold
6.2.2 Silver
6.2.3 Palladium)
6.2.4 Metals (Copper
6.2.5 Aluminum
6.2.6 Tin)
6.2.7 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Printed Circuit Board (PCB) E-Scrap Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Printed Circuit Board (PCB) E-Scrap Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Telecommunications
9.6.2 TV & Monitor
9.6.3 PC & Laptop
9.6.4 Smartphones
9.6.5 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Precious Metals (Gold
9.10.2 Silver
9.10.3 Palladium)
9.10.4 Metals (Copper
9.10.5 Aluminum
9.10.6 Tin)
9.10.7 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Telecommunications
10.6.2 TV & Monitor
10.6.3 PC & Laptop
10.6.4 Smartphones
10.6.5 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Precious Metals (Gold
10.10.2 Silver
10.10.3 Palladium)
10.10.4 Metals (Copper
10.10.5 Aluminum
10.10.6 Tin)
10.10.7 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Telecommunications
11.6.2 TV & Monitor
11.6.3 PC & Laptop
11.6.4 Smartphones
11.6.5 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Precious Metals (Gold
11.10.2 Silver
11.10.3 Palladium)
11.10.4 Metals (Copper
11.10.5 Aluminum
11.10.6 Tin)
11.10.7 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Telecommunications
12.6.2 TV & Monitor
12.6.3 PC & Laptop
12.6.4 Smartphones
12.6.5 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Precious Metals (Gold
12.10.2 Silver
12.10.3 Palladium)
12.10.4 Metals (Copper
12.10.5 Aluminum
12.10.6 Tin)
12.10.7 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Telecommunications
13.6.2 TV & Monitor
13.6.3 PC & Laptop
13.6.4 Smartphones
13.6.5 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Precious Metals (Gold
13.10.2 Silver
13.10.3 Palladium)
13.10.4 Metals (Copper
13.10.5 Aluminum
13.10.6 Tin)
13.10.7 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Printed Circuit Board (PCB) E-Scrap Market: Competitive Dashboard
14.2 Global Printed Circuit Board (PCB) E-Scrap Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Boliden
14.3.2 Umicore
14.3.3 Aurubis
14.3.4 Mitsubishi Materials Corporation
14.3.5 Asahi Holdings
14.3.6 Glencore(Canada)
14.3.7 LS-Nikko Copper
14.3.8 Dowa Holdings
14.3.9 Mitsui Mining & Smelting
14.3.10 JX Nippon Mining & Metals
14.3.11 GEM Co.,Ltd.
