Industry Growth Insights published a new data on “PUR Adhesive in Electronics Market”. The research report is titled “PUR Adhesive in Electronics Market research by Types (Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curing Adhesives, Other), By Applications (Surface Mounting, Conformal Coatings, Wire Tacking, Potting, Encapsulation, Other), By Players/Companies BASF, DowDuPont, Shin-Etsu Chemical, Henkel, Laird Technologies, Croda International, Datum Phase Change, Kaplan Energy, AI Technology, Phase Change Products, Phase Change Energy Solutions, Shenzhen Aochuan Technology”.
Scope Of The Report
Report Attributes
Report Details
Report Title
PUR Adhesive in Electronics Market Research Report
By Type
Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curing Adhesives, Other
By Application
Surface Mounting, Conformal Coatings, Wire Tacking, Potting, Encapsulation, Other
By Companies
BASF, DowDuPont, Shin-Etsu Chemical, Henkel, Laird Technologies, Croda International, Datum Phase Change, Kaplan Energy, AI Technology, Phase Change Products, Phase Change Energy Solutions, Shenzhen Aochuan Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
246
Number of Tables & Figures
173
Customization Available
Yes, the report can be customized as per your need.
Global PUR Adhesive in Electronics Market Report Segments:
The global PUR Adhesive in Electronics market is segmented on the basis of:
Types
Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curing Adhesives, Other
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Surface Mounting, Conformal Coatings, Wire Tacking, Potting, Encapsulation, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- BASF
- DowDuPont
- Shin-Etsu Chemical
- Henkel
- Laird Technologies
- Croda International
- Datum Phase Change
- Kaplan Energy
- AI Technology
- Phase Change Products
- Phase Change Energy Solutions
- Shenzhen Aochuan Technology
Highlights of The PUR Adhesive in Electronics Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Electrically Conductive Adhesives
- Thermally Conductive Adhesives
- UV Curing Adhesives
- Other
- By Application:
- Surface Mounting
- Conformal Coatings
- Wire Tacking
- Potting
- Encapsulation
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the PUR Adhesive in Electronics Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
PUR adhesive is a type of adhesive used in electronics. It is a strong, water-resistant adhesive that can be used to attach parts together. PUR adhesives are often used in the manufacturing of electronic devices, as they are resistant to moisture and heat.
Some of the major players in the pur adhesive in electronics market are BASF, DowDuPont, Shin-Etsu Chemical, Henkel, Laird Technologies, Croda International, Datum Phase Change, Kaplan Energy, AI Technology, Phase Change Products, Phase Change Energy Solutions, Shenzhen Aochuan Technology.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 PUR Adhesive in Electronics Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 PUR Adhesive in Electronics Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 PUR Adhesive in Electronics Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the PUR Adhesive in Electronics Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global PUR Adhesive in Electronics Market Size & Forecast, 2018-2028
4.5.1 PUR Adhesive in Electronics Market Size and Y-o-Y Growth
4.5.2 PUR Adhesive in Electronics Market Absolute $ Opportunity
Chapter 5 Global PUR Adhesive in Electronics Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 PUR Adhesive in Electronics Market Size Forecast by Type
5.2.1 Electrically Conductive Adhesives
5.2.2 Thermally Conductive Adhesives
5.2.3 UV Curing Adhesives
5.2.4 Other
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global PUR Adhesive in Electronics Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 PUR Adhesive in Electronics Market Size Forecast by Applications
6.2.1 Surface Mounting
6.2.2 Conformal Coatings
6.2.3 Wire Tacking
6.2.4 Potting
6.2.5 Encapsulation
6.2.6 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global PUR Adhesive in Electronics Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 PUR Adhesive in Electronics Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America PUR Adhesive in Electronics Analysis and Forecast
9.1 Introduction
9.2 North America PUR Adhesive in Electronics Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America PUR Adhesive in Electronics Market Size Forecast by Type
9.6.1 Electrically Conductive Adhesives
9.6.2 Thermally Conductive Adhesives
9.6.3 UV Curing Adhesives
9.6.4 Other
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America PUR Adhesive in Electronics Market Size Forecast by Applications
9.10.1 Surface Mounting
9.10.2 Conformal Coatings
9.10.3 Wire Tacking
9.10.4 Potting
9.10.5 Encapsulation
9.10.6 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe PUR Adhesive in Electronics Analysis and Forecast
10.1 Introduction
10.2 Europe PUR Adhesive in Electronics Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe PUR Adhesive in Electronics Market Size Forecast by Type
10.6.1 Electrically Conductive Adhesives
10.6.2 Thermally Conductive Adhesives
10.6.3 UV Curing Adhesives
10.6.4 Other
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe PUR Adhesive in Electronics Market Size Forecast by Applications
10.10.1 Surface Mounting
10.10.2 Conformal Coatings
10.10.3 Wire Tacking
10.10.4 Potting
10.10.5 Encapsulation
10.10.6 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific PUR Adhesive in Electronics Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific PUR Adhesive in Electronics Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific PUR Adhesive in Electronics Market Size Forecast by Type
11.6.1 Electrically Conductive Adhesives
11.6.2 Thermally Conductive Adhesives
11.6.3 UV Curing Adhesives
11.6.4 Other
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific PUR Adhesive in Electronics Market Size Forecast by Applications
11.10.1 Surface Mounting
11.10.2 Conformal Coatings
11.10.3 Wire Tacking
11.10.4 Potting
11.10.5 Encapsulation
11.10.6 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America PUR Adhesive in Electronics Analysis and Forecast
12.1 Introduction
12.2 Latin America PUR Adhesive in Electronics Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America PUR Adhesive in Electronics Market Size Forecast by Type
12.6.1 Electrically Conductive Adhesives
12.6.2 Thermally Conductive Adhesives
12.6.3 UV Curing Adhesives
12.6.4 Other
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America PUR Adhesive in Electronics Market Size Forecast by Applications
12.10.1 Surface Mounting
12.10.2 Conformal Coatings
12.10.3 Wire Tacking
12.10.4 Potting
12.10.5 Encapsulation
12.10.6 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) PUR Adhesive in Electronics Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) PUR Adhesive in Electronics Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) PUR Adhesive in Electronics Market Size Forecast by Type
13.6.1 Electrically Conductive Adhesives
13.6.2 Thermally Conductive Adhesives
13.6.3 UV Curing Adhesives
13.6.4 Other
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) PUR Adhesive in Electronics Market Size Forecast by Applications
13.10.1 Surface Mounting
13.10.2 Conformal Coatings
13.10.3 Wire Tacking
13.10.4 Potting
13.10.5 Encapsulation
13.10.6 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 PUR Adhesive in Electronics Market: Competitive Dashboard
14.2 Global PUR Adhesive in Electronics Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 BASF
14.3.2 DowDuPont
14.3.3 Shin-Etsu Chemical
14.3.4 Henkel
14.3.5 Laird Technologies
14.3.6 Croda International
14.3.7 Datum Phase Change
14.3.8 Kaplan Energy
14.3.9 AI Technology
14.3.10 Phase Change Products
14.3.11 Phase Change Energy Solutions
14.3.12 Shenzhen Aochuan Technology
