Market Overview:
The global registered dual in-line memory module market is expected to register a CAGR of 5.8% during the forecast period, 2018-2030. The market growth can be attributed to the increasing demand for advanced memory solutions in various applications such as computers, tablets, smartphones, and others. Additionally, the rising trend of miniaturization is also fueling the demand for registered dual in-line memory modules across different regions. On the basis of type, registered buffered memory (R-DIMM) held a major share of the global registered dual in-line memory module market in 2017 and is expected to maintain its dominance during the forecast period as well. This can be attributed to its high reliability and performance compared to other types of DIMMs available in the market.
Product Definition:
A registered dual in-line memory module (RDIMM) is a type of computer memory module that uses registers to control access to the DRAM chips on the module. This allows for greater reliability and higher performance than standard dual in-line memory modules (DIMMs).
Registered Buffered Memory (R-DIMM):
Registered DIMM (R-DIMM) is a type of computer memory which can be installed in the system by the OEMs or during the repair and maintenance. It has registered trademark symbol “R” attached to it. The R-DIMM comes with an integrated heat spreader, which helps in increasing its stability and reliability under high load conditions.
Fully Buffered DIMM (FB-DIMM):
A fully buffered DIMM (FB-DIMM) is a type of memory module that uses an integrated circuit and buffers to eliminate the need for separate power supply and input/output circuits. The integrated circuit in a fully buffered DIMM acts as both an input buffer and output driver, which eliminates the need for additional circuitry used to drive external devices.
Application Insights:
The memory chips application segment accounted for the largest revenue share of over 40% in 2017. The growth is attributed to the increasing demand for server and personal computers, which use a variety of DRAM modules. The growing popularity of cloud computing has led to an increased need for data storage across all platforms, including desktops, laptops, and mobile devices. This trend is expected to continue over the forecast period as more people opt for online storage services due to their high security features along with ease of access from any device with internet connectivity.
TV set application segment was valued at USD 536 million in 2017 owing to rising demand from various end-use industries such as IT & telecommunication and retail sectors among others that require large amounts of R-DIMM memory chips. In addition, technological advancements coupled with increasing consumer spending on advanced technologies are likely drive product adoption further driving market growth over the coming years.
Regional Analysis:
The Asia Pacific regional market accounted for the largest revenue share in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to increasing demand from end-use industries, such as IT & telecommunication, consumer electronics, industrial applications, and others.
Increasing demand for smartphones along with growing penetration of high-speed internet is anticipated to drive the product demand in this region. Furthermore, rising investments by key players in developing R&D facilities will augment industry growth over the next eight years. For instance; In May 2018; Micron Technology Inc., a U.S.-based memory chip manufacturer announced plans of investing USD X million at its Fab 28 plant located at Gopalpur village near Bangalore city in Karnataka state of India under “Make In India†initiative undertaken by Indian government (Micron Technology Inc.).
Growth Factors:
- Increasing demand for high-performance computing systems from data centers and enterprise organizations
- Growing popularity of big data and artificial intelligence applications
- Proliferation of cloud-based services and the need for more reliable memory solutions
- Emergence of new memory technologies that can improve performance or reduce costs
- Continued consolidation among OEMs and system builders, which is likely to increase demand for RDIMMs
Scope Of The Report
Report Attributes
Report Details
Report Title
Registered Dual In-line Memory Module Market Research Report
By Type
Registered Buffered Memory (R-DIMM), Fully Buffered DIMM (FB-DIMM), Load Reduced DIMM (LR-DIMM)
By Application
Memory Chips, TV Set, Computer, Tablet, Smart Phone, Radio, Other
By Companies
SK hynix, Samsung Electro-Mechanics, Micron technology, Nanya Technology, JEDEC, Intel, Panasonic, Elpida, Apacer, Kingston Technology, SK hynix, HUAWEI, IBM Microelectronics
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
170
Number of Tables & Figures
119
Customization Available
Yes, the report can be customized as per your need.
Global Registered Dual In-line Memory Module Market Report Segments:
The global Registered Dual In-line Memory Module market is segmented on the basis of:
Types
Registered Buffered Memory (R-DIMM), Fully Buffered DIMM (FB-DIMM), Load Reduced DIMM (LR-DIMM)
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Memory Chips, TV Set, Computer, Tablet, Smart Phone, Radio, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- SK hynix
- Samsung Electro-Mechanics
- Micron technology
- Nanya Technology
- JEDEC
- Intel
- Panasonic
- Elpida
- Apacer
- Kingston Technology
- SK hynix
- HUAWEI
- IBM Microelectronics
Highlights of The Registered Dual In-line Memory Module Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Registered Buffered Memory (R-DIMM)
- Fully Buffered DIMM (FB-DIMM)
- Load Reduced DIMM (LR-DIMM)
- By Application:
- Memory Chips
- TV Set
- Computer
- Tablet
- Smart Phone
- Radio
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Registered Dual In-line Memory Module Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A Registered Dual In-line Memory Module (RDIMM) is a type of memory module that uses two DIMMs per channel. This configuration allows for higher memory bandwidth and improved performance.
Some of the major companies in the registered dual in-line memory module market are SK hynix, Samsung Electro-Mechanics, Micron technology, Nanya Technology, JEDEC, Intel, Panasonic, Elpida, Apacer, Kingston Technology, SK hynix, HUAWEI, IBM Microelectronics.
The registered dual in-line memory module market is expected to register a CAGR of 5.8%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Registered Dual In-line Memory Module Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Registered Dual In-line Memory Module Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Registered Dual In-line Memory Module Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Registered Dual In-line Memory Module Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Registered Dual In-line Memory Module Market Size & Forecast, 2018-2028
4.5.1 Registered Dual In-line Memory Module Market Size and Y-o-Y Growth
4.5.2 Registered Dual In-line Memory Module Market Absolute $ Opportunity
Chapter 5 Global Registered Dual In-line Memory Module Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Registered Dual In-line Memory Module Market Size Forecast by Type
5.2.1 Registered Buffered Memory (R-DIMM)
5.2.2 Fully Buffered DIMM (FB-DIMM)
5.2.3 Load Reduced DIMM (LR-DIMM)
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Registered Dual In-line Memory Module Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Registered Dual In-line Memory Module Market Size Forecast by Applications
6.2.1 Memory Chips
6.2.2 TV Set
6.2.3 Computer
6.2.4 Tablet
6.2.5 Smart Phone
6.2.6 Radio
6.2.7 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Registered Dual In-line Memory Module Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Registered Dual In-line Memory Module Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Registered Dual In-line Memory Module Analysis and Forecast
9.1 Introduction
9.2 North America Registered Dual In-line Memory Module Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Registered Dual In-line Memory Module Market Size Forecast by Type
9.6.1 Registered Buffered Memory (R-DIMM)
9.6.2 Fully Buffered DIMM (FB-DIMM)
9.6.3 Load Reduced DIMM (LR-DIMM)
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Registered Dual In-line Memory Module Market Size Forecast by Applications
9.10.1 Memory Chips
9.10.2 TV Set
9.10.3 Computer
9.10.4 Tablet
9.10.5 Smart Phone
9.10.6 Radio
9.10.7 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Registered Dual In-line Memory Module Analysis and Forecast
10.1 Introduction
10.2 Europe Registered Dual In-line Memory Module Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Registered Dual In-line Memory Module Market Size Forecast by Type
10.6.1 Registered Buffered Memory (R-DIMM)
10.6.2 Fully Buffered DIMM (FB-DIMM)
10.6.3 Load Reduced DIMM (LR-DIMM)
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Registered Dual In-line Memory Module Market Size Forecast by Applications
10.10.1 Memory Chips
10.10.2 TV Set
10.10.3 Computer
10.10.4 Tablet
10.10.5 Smart Phone
10.10.6 Radio
10.10.7 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Registered Dual In-line Memory Module Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Registered Dual In-line Memory Module Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Registered Dual In-line Memory Module Market Size Forecast by Type
11.6.1 Registered Buffered Memory (R-DIMM)
11.6.2 Fully Buffered DIMM (FB-DIMM)
11.6.3 Load Reduced DIMM (LR-DIMM)
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Registered Dual In-line Memory Module Market Size Forecast by Applications
11.10.1 Memory Chips
11.10.2 TV Set
11.10.3 Computer
11.10.4 Tablet
11.10.5 Smart Phone
11.10.6 Radio
11.10.7 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Registered Dual In-line Memory Module Analysis and Forecast
12.1 Introduction
12.2 Latin America Registered Dual In-line Memory Module Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Registered Dual In-line Memory Module Market Size Forecast by Type
12.6.1 Registered Buffered Memory (R-DIMM)
12.6.2 Fully Buffered DIMM (FB-DIMM)
12.6.3 Load Reduced DIMM (LR-DIMM)
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Registered Dual In-line Memory Module Market Size Forecast by Applications
12.10.1 Memory Chips
12.10.2 TV Set
12.10.3 Computer
12.10.4 Tablet
12.10.5 Smart Phone
12.10.6 Radio
12.10.7 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Registered Dual In-line Memory Module Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Registered Dual In-line Memory Module Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Registered Dual In-line Memory Module Market Size Forecast by Type
13.6.1 Registered Buffered Memory (R-DIMM)
13.6.2 Fully Buffered DIMM (FB-DIMM)
13.6.3 Load Reduced DIMM (LR-DIMM)
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Registered Dual In-line Memory Module Market Size Forecast by Applications
13.10.1 Memory Chips
13.10.2 TV Set
13.10.3 Computer
13.10.4 Tablet
13.10.5 Smart Phone
13.10.6 Radio
13.10.7 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Registered Dual In-line Memory Module Market: Competitive Dashboard
14.2 Global Registered Dual In-line Memory Module Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 SK hynix
14.3.2 Samsung Electro-Mechanics
14.3.3 Micron technology
14.3.4 Nanya Technology
14.3.5 JEDEC
14.3.6 Intel
14.3.7 Panasonic
14.3.8 Elpida
14.3.9 Apacer
14.3.10 Kingston Technology
14.3.11 SK hynix
14.3.12 HUAWEI
14.3.13 IBM Microelectronics
