Market Overview:
The global semiconductor assembly and packaging services market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices from various end-use industries, such as telecommunications, automotive, aerospace and defense, medical devices, consumer electronics, and others. In addition, the growing trend of miniaturization of electronic devices is also contributing to the growth of this market. The global semiconductor assembly and packaging services market can be segmented on the basis of type into assembly services and packaging services. The assembly services segment is further sub-segmented into surface mount technology (SMT) assembly service and through-hole (TH) assembly service. The packaging services segment is further sub-segmented into leadframe based package service and chip scale package (CSP) service. Among these regions,.
Product Definition:
Semiconductor assembly and packaging services are the processes that are used to put together and package semiconductors. The importance of these services is that they help to ensure that semiconductors are able to function properly and meet the needs of their users.
Assembly Services:
As the semiconductor industry is growing at a rapid rate, there is an increasing demand for assembly and packaging services. The growth of this industry has led to the expansion of service offerings by original design manufacturers (ODMs). ODM companies are offering end-to-end services from designing chips to finished products. This trend has given rise to new opportunities in terms of revenue generation as well as market penetration for assembly and packaging services providers.
Packaging Services:
Packaging services are used in semiconductor assembly and packaging to protect the devices from physical damage, environmental stress, and electrical interference. Packaging includes various processes such as surface treatment (coating), case preparation (cleaning of wafers/devices), wafer handling, die-cutting/packaging, assembly & testing followed by sealing etc.
Application Insights:
The global semiconductor assembly and packaging services market has been segmented into telecommunications, automotive, aerospace and defense, medical devices, consumer electronics, other applications. The consumer electronics application segment is anticipated to witness the fastest growth over the forecast period owing to an increase in demand for electronic products across the globe. Other applications include industrial machinery and equipment as well as IT infrastructure.
Global semiconductor assembly.
Telecommunications was estimated as the largest application segment in 2017 with a share of over 40% in terms of revenue generation. The growth can be attributed to an increase in demand for smartphones coupled with rising investments by telecom operators worldwide.
Regional Analysis:
The Asia Pacific region accounted for the largest revenue share in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to increasing demand from end-use industries such as consumer electronics, automotive, aerospace and defense, etc. In addition, favorable government policies promoting investments in manufacturing facilities are anticipated to drive regional market growth over the forecast period.
North America is projected to witness significant growth during the forecast years owing to rising demand for high-quality products with reduced pricing compared with Asian counterparts. Furthermore, growing penetration of global players into emerging markets coupled with their efforts towards capacity expansion are likely boost regional market development during the estimated time span.
Europe has been one of key regions that have witnessed a steady increase in production volumes year on year since 2016 due to an upsurge in product launches by various semiconductor manufacturers across major European countries along with Germany.
Growth Factors:
- Increasing demand for semiconductor assembly and packaging services from the electronics industry as a result of the growth in the number of electronic devices and systems.
- The increasing trend of miniaturization in semiconductor devices, which is driving the need for advanced assembly and packaging technologies and services.
- Growing demand for semiconductor assembly and packaging services from emerging markets, such as China, India, Brazil, etc., due to their high population growth rates and rising levels of economic development.
- Proliferation of new applications for semiconductors in areas such as automotive electronics, medical implants & diagnostics equipment, smart energy management systems etc., which is fueling demand for advanced assembly & packaging technologies & services . 5) The increasing use of contract manufacturing by semiconductor companies to outsource production to specialized service providers to reduce costs and improve time-to-market
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Assembly and Packaging Services Market Research Report
By Type
Assembly Services, Packaging Services
By Application
Telecommunications, Automotive, Aerospace and Defense, Medical Devices, Consumer Electronics, Other
By Companies
Advanced Semiconductor Engineering(ASE), Amkor Technology, Intel, Samsung Electronics, SPIL, TSMC
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
141
Number of Tables & Figures
99
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Assembly and Packaging Services Market Report Segments:
The global Semiconductor Assembly and Packaging Services market is segmented on the basis of:
Types
Assembly Services, Packaging Services
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Telecommunications, Automotive, Aerospace and Defense, Medical Devices, Consumer Electronics, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Advanced Semiconductor Engineering(ASE)
- Amkor Technology
- Intel
- Samsung Electronics
- SPIL
- TSMC
Highlights of The Semiconductor Assembly and Packaging Services Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Assembly Services
- Packaging Services
- By Application:
- Telecommunications
- Automotive
- Aerospace and Defense
- Medical Devices
- Consumer Electronics
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Assembly and Packaging Services Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor Assembly and Packaging Services is a business that provides services related to the assembly and packaging of semiconductors. These services may include the placement of chips into packages, the testing and validation of these packages, as well as the manufacturing of these packages.
Some of the major players in the semiconductor assembly and packaging services market are Advanced Semiconductor Engineering(ASE), Amkor Technology, Intel, Samsung Electronics, SPIL, TSMC.
The semiconductor assembly and packaging services market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Semiconductor Assembly and Packaging Services Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Semiconductor Assembly and Packaging Services Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Semiconductor Assembly and Packaging Services Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Semiconductor Assembly and Packaging Services Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Semiconductor Assembly and Packaging Services Market Size & Forecast, 2020-2028
4.5.1 Semiconductor Assembly and Packaging Services Market Size and Y-o-Y Growth
4.5.2 Semiconductor Assembly and Packaging Services Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Assembly Services
5.2.2 Packaging Services
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Telecommunications
6.2.2 Automotive
6.2.3 Aerospace and Defense
6.2.4 Medical Devices
6.2.5 Consumer Electronics
6.2.6 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Semiconductor Assembly and Packaging Services Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Semiconductor Assembly and Packaging Services Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Assembly Services
9.6.2 Packaging Services
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Telecommunications
9.10.2 Automotive
9.10.3 Aerospace and Defense
9.10.4 Medical Devices
9.10.5 Consumer Electronics
9.10.6 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Assembly Services
10.6.2 Packaging Services
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Telecommunications
10.10.2 Automotive
10.10.3 Aerospace and Defense
10.10.4 Medical Devices
10.10.5 Consumer Electronics
10.10.6 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Assembly Services
11.6.2 Packaging Services
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Telecommunications
11.10.2 Automotive
11.10.3 Aerospace and Defense
11.10.4 Medical Devices
11.10.5 Consumer Electronics
11.10.6 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Assembly Services
12.6.2 Packaging Services
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Telecommunications
12.10.2 Automotive
12.10.3 Aerospace and Defense
12.10.4 Medical Devices
12.10.5 Consumer Electronics
12.10.6 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Assembly Services
13.6.2 Packaging Services
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Telecommunications
13.10.2 Automotive
13.10.3 Aerospace and Defense
13.10.4 Medical Devices
13.10.5 Consumer Electronics
13.10.6 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Semiconductor Assembly and Packaging Services Market: Competitive Dashboard
14.2 Global Semiconductor Assembly and Packaging Services Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Advanced Semiconductor Engineering(ASE)
14.3.2 Amkor Technology
14.3.3 Intel
14.3.4 Samsung Electronics
14.3.5 SPIL
14.3.6 TSMC
