Market Overview:
The global semiconductor assembly process equipment market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductors across various applications, and the growing trend of miniaturization in electronics devices. In addition, the increasing demand for advanced packaging technologies is also contributing to the growth of this market. On the basis of type, die bonders accounted for the largest share of the global semiconductor assembly process equipment market in 2017. This segment is expected to continue its dominance duringthe forecast period due tothe increasing demand for flip-chip technology and 3D ICs.
Product Definition:
The semiconductor assembly process equipment is used to place the integrated circuits on the printed circuit boards. It is important because it helps to create the electronic devices that we use every day.
Die Bonders:
Die bonders are equipment used to apply a dielectric medium between two substrates in order to establish electrical connections. The process is carried out by using high-frequency AC and low DC current which helps in minimizing the chances of failure and also increases efficiency.
The growth factor for die bonders market is determined by various factors such as increasing demand for electronic devices, miniaturization of components, growing use of plastic electronics among others.
Wire Bonders:
Wire bonders are used in the assembly of semiconductor devices. They are also known as wire-wrapping machines. These machines wrap a single or multiple wires around a cylindrical object to secure it in place during the manufacturing process of semiconductors. The most commonly used bonding machine is called BODA (Bonded Olefin Dielectric Assembly).
The major application areas for wire bonders include packaging.
Application Insights:
IDM was the largest application segment in 2016 and accounted for over 40% of the global market. The increasing demand for semiconductor assembly equipment to pack various components such as microcontrollers, programmable timer, digital signal processors, flash memory and other peripheral devices into a single chip is expected to drive the industry growth over the forecast period.
OSAT is estimated to be one of the fastest-growing application segments during the forecast period owing to growing demand from telecom companies for assembling customized chips designed in their laboratories. These companies are increasingly using OSATs as they offer flexibility in terms of designating tasks among different departments within an organization thereby enhancing overall efficiency.
The use of OSATs has increased significantly across all major regions including North America.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for high-quality electronic products in countries, such as China and India. In addition, rising investments by governments of various countries in developing semiconductor manufacturing facilities will drive industry expansion over the next eight years.
The Asia Pacific region accounted for a revenue share of more than 30% in 2017 owing to its dominant position in global electronics production coupled with rapid industrialization and urbanization resulting into growing consumer electronics demand across this region since last few years. This trend is anticipated to continue over the forecast period due to which APAC market will witness significant growth during the estimated time frame from 2018 till 2030 ending on a sweet note for Semiconductors & Electronics Industry globally speaking!.
North America was valued at USD X million (Rs 29,946 crores)in 2017.
Growth Factors:
- Increasing demand for semiconductor assembly process equipment from the electronics and automotive industries
- Growing demand for miniaturized and high-performance semiconductors
- Proliferation of 3D printing technology in the semiconductor industry
- Rising demand for advanced packaging technologies, such as 2.5D and 3D ICs
- Emergence of new applications that require advanced semiconductor assembly process equipment
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Assembly Process Equipment Market Research Report
By Type
Die Bonders, Wire Bonders, Packaging Equipment, Others
By Application
IDMs, OSAT
By Companies
ASM Pacific Technology, Kulicke & Soffa Industries, Besi, Accrutech, Shinkawa, Palomar Technologies, Hesse Mechatronics, Toray Engineering, West Bond, HYBOND, DIAS Automation
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
180
Number of Tables & Figures
126
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Assembly Process Equipment Market Report Segments:
The global Semiconductor Assembly Process Equipment market is segmented on the basis of:
Types
Die Bonders, Wire Bonders, Packaging Equipment, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
IDMs, OSAT
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ASM Pacific Technology
- Kulicke & Soffa Industries
- Besi
- Accrutech
- Shinkawa
- Palomar Technologies
- Hesse Mechatronics
- Toray Engineering
- West Bond
- HYBOND
- DIAS Automation
Highlights of The Semiconductor Assembly Process Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Die Bonders
- Wire Bonders
- Packaging Equipment
- Others
- By Application:
- IDMs
- OSAT
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Assembly Process Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
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- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor assembly process equipment is used to assemble semiconductors on a large scale. This equipment includes tools and machines that help workers place the individual chips into plastic or metal casings.
Some of the key players operating in the semiconductor assembly process equipment market are ASM Pacific Technology, Kulicke & Soffa Industries, Besi, Accrutech, Shinkawa, Palomar Technologies, Hesse Mechatronics, Toray Engineering, West Bond, HYBOND, DIAS Automation.
The semiconductor assembly process equipment market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Semiconductor Assembly Process Equipment Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Semiconductor Assembly Process Equipment Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Semiconductor Assembly Process Equipment Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Semiconductor Assembly Process Equipment Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Semiconductor Assembly Process Equipment Market Size & Forecast, 2018-2028
4.5.1 Semiconductor Assembly Process Equipment Market Size and Y-o-Y Growth
4.5.2 Semiconductor Assembly Process Equipment Market Absolute $ Opportunity
Chapter 5 Global Semiconductor Assembly Process Equipment Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Semiconductor Assembly Process Equipment Market Size Forecast by Type
5.2.1 Die Bonders
5.2.2 Wire Bonders
5.2.3 Packaging Equipment
5.2.4 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Semiconductor Assembly Process Equipment Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Semiconductor Assembly Process Equipment Market Size Forecast by Applications
6.2.1 IDMs
6.2.2 OSAT
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Semiconductor Assembly Process Equipment Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Semiconductor Assembly Process Equipment Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Semiconductor Assembly Process Equipment Analysis and Forecast
9.1 Introduction
9.2 North America Semiconductor Assembly Process Equipment Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Semiconductor Assembly Process Equipment Market Size Forecast by Type
9.6.1 Die Bonders
9.6.2 Wire Bonders
9.6.3 Packaging Equipment
9.6.4 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Semiconductor Assembly Process Equipment Market Size Forecast by Applications
9.10.1 IDMs
9.10.2 OSAT
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Semiconductor Assembly Process Equipment Analysis and Forecast
10.1 Introduction
10.2 Europe Semiconductor Assembly Process Equipment Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Semiconductor Assembly Process Equipment Market Size Forecast by Type
10.6.1 Die Bonders
10.6.2 Wire Bonders
10.6.3 Packaging Equipment
10.6.4 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Semiconductor Assembly Process Equipment Market Size Forecast by Applications
10.10.1 IDMs
10.10.2 OSAT
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Semiconductor Assembly Process Equipment Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Semiconductor Assembly Process Equipment Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Semiconductor Assembly Process Equipment Market Size Forecast by Type
11.6.1 Die Bonders
11.6.2 Wire Bonders
11.6.3 Packaging Equipment
11.6.4 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Semiconductor Assembly Process Equipment Market Size Forecast by Applications
11.10.1 IDMs
11.10.2 OSAT
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Semiconductor Assembly Process Equipment Analysis and Forecast
12.1 Introduction
12.2 Latin America Semiconductor Assembly Process Equipment Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Semiconductor Assembly Process Equipment Market Size Forecast by Type
12.6.1 Die Bonders
12.6.2 Wire Bonders
12.6.3 Packaging Equipment
12.6.4 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Semiconductor Assembly Process Equipment Market Size Forecast by Applications
12.10.1 IDMs
12.10.2 OSAT
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Semiconductor Assembly Process Equipment Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Semiconductor Assembly Process Equipment Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Semiconductor Assembly Process Equipment Market Size Forecast by Type
13.6.1 Die Bonders
13.6.2 Wire Bonders
13.6.3 Packaging Equipment
13.6.4 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Semiconductor Assembly Process Equipment Market Size Forecast by Applications
13.10.1 IDMs
13.10.2 OSAT
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Semiconductor Assembly Process Equipment Market: Competitive Dashboard
14.2 Global Semiconductor Assembly Process Equipment Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ASM Pacific Technology
14.3.2 Kulicke & Soffa Industries
14.3.3 Besi
14.3.4 Accrutech
14.3.5 Shinkawa
14.3.6 Palomar Technologies
14.3.7 Hesse Mechatronics
14.3.8 Toray Engineering
14.3.9 West Bond
14.3.10 HYBOND
14.3.11 DIAS Automation
