Market Overview:
The global semiconductor bonding equipment market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices from various end-use industries, such as automotive, consumer electronics, and telecommunications. In addition, the growing trend of miniaturization and increased adoption of advanced packaging technologies are also contributing to the growth of this market. Based on type, the global semiconductor bonding equipment market is segmented into wire bonders and die bonders. The wire bonders segment is expected to account for a larger share of the global semiconductor bonding equipment market than the die bonders segment during the forecast period. This can be attributed to their higher adoption in applications such as integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSATs). Based on application,the global semiconductor bonding equipmentmarket is divided into three segments: IDMs, OSATs,and other applications.ontheotherhand,.
Product Definition:
Semiconductor Bonding Equipment is a device used to connect semiconductor devices to each other. The importance of Semiconductor Bonding Equipment is that it allows for the creation of circuits and components from individual semiconductor devices.
Wire Bonder:
Wire bonder is a device used in semiconductor bonding equipment to join two or more wires together. It can be used for both single and multi-strand wire bonding. The major applications include PCB laminates, internal & external power supply cables, memory modules, hard disk drives cable among others.
The key drivers of the wire bonder market include increasing demand for electronic devices with compact size.
Die Bonder:
Die bonder is a device used to bond semiconductor chips and electronic devices. It helps in minimizing the number of wires between components which reduces the chances of failure during assembly. The die bander also provides mechanical stability to circuits by making them immune to environmental effects such as temperature, pressure, and humidity.
The global die bonder market size was valued at USD 856.1 million in 2016.
Application Insights:
The global demand for integrated device manufacturer (IDM) is expected to exhibit a CAGR of XX% from 2018 to 2030 owing to the growing semiconductor industry in countries, such as China, India and Japan. The growth of the semiconductor industry in these regions is directly related to IDMs growth. Outsourced semiconductor assembly and test (OSAT) segment held a significant share in 2017 and is projected to continue its dominance over the forecast period.
The equipment used for OSATs are different from those used for IC packaging; they include soldering irons with specific characteristics that make them ideal for assembling chips into various electronic devices including computers, mobile phones etc. Soldering bonders are also used during final testing & packaging of products before they are shipped out from production facilities.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for electronic products in countries, such as China and India. In 2016, Asia Pacific accounted for a revenue share of more than 30% in global semiconductor industry owing to low labor cost and high manufacturing efficiency. Moreover, rising disposable income levels are anticipated to fuel product demand further over the next eight years.
The Latin American market is also estimated to witness significant growth during the same period due to rapid economic development coupled with increasing government support for innovation and technology advancement in Brazil.
Growth Factors:
- Increasing demand for semiconductor devices from the consumer electronics and automotive industries
- Rising demand for semiconductor packaging and assembly services
- Growing popularity of 3D integrated circuits (ICs)
- Proliferation of advanced packaging technologies, such as wafer-level packaging (WLP), fan-out wafer-level package (FOWLP), and 2.5D/3D ICs
- Rapid expansion of the Internet of Things (IoT) market
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Bonding Equipment Market Research Report
By Type
Wire Bonder, Die Bonder
By Application
Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Test (OSATs)
By Companies
Besi, ASM Pacific Technology, Kulicke& Soffa, Palomar Technologies, DIAS Automation, F&K Delvotec Bondtechnik, Hesse, Hybond, SHINKAWA Electric, Toray Engineering, Besi, FASFORD TECHNOLOGY, West-Bond
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
223
Number of Tables & Figures
157
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Bonding Equipment Market Report Segments:
The global Semiconductor Bonding Equipment market is segmented on the basis of:
Types
Wire Bonder, Die Bonder
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Integrated Device Manufacturer (IDMs), Outsourced Semiconductor Assembly and Test (OSATs)
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Besi
- ASM Pacific Technology
- Kulicke& Soffa
- Palomar Technologies
- DIAS Automation
- F&K Delvotec Bondtechnik
- Hesse
- Hybond
- SHINKAWA Electric
- Toray Engineering
- Besi
- FASFORD TECHNOLOGY
- West-Bond
Highlights of The Semiconductor Bonding Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Wire Bonder
- Die Bonder
- By Application:
- Integrated Device Manufacturer (IDMs)
- Outsourced Semiconductor Assembly and Test (OSATs)
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Bonding Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor bonding equipment is used to bond semiconductor materials together. This equipment can be used to create integrated circuits, or other electronic devices.
Some of the major players in the semiconductor bonding equipment market are Besi, ASM Pacific Technology, Kulicke& Soffa, Palomar Technologies, DIAS Automation, F&K Delvotec Bondtechnik, Hesse, Hybond, SHINKAWA Electric, Toray Engineering, Besi, FASFORD TECHNOLOGY, West-Bond.
The semiconductor bonding equipment market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Semiconductor Bonding Equipment Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Semiconductor Bonding Equipment Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Semiconductor Bonding Equipment Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Semiconductor Bonding Equipment Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Semiconductor Bonding Equipment Market Size & Forecast, 2018-2028
4.5.1 Semiconductor Bonding Equipment Market Size and Y-o-Y Growth
4.5.2 Semiconductor Bonding Equipment Market Absolute $ Opportunity
Chapter 5 Global Semiconductor Bonding Equipment Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Semiconductor Bonding Equipment Market Size Forecast by Type
5.2.1 Wire Bonder
5.2.2 Die Bonder
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Semiconductor Bonding Equipment Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Semiconductor Bonding Equipment Market Size Forecast by Applications
6.2.1 Integrated Device Manufacturer (IDMs)
6.2.2 Outsourced Semiconductor Assembly and Test (OSATs)
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Semiconductor Bonding Equipment Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Semiconductor Bonding Equipment Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Semiconductor Bonding Equipment Analysis and Forecast
9.1 Introduction
9.2 North America Semiconductor Bonding Equipment Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Semiconductor Bonding Equipment Market Size Forecast by Type
9.6.1 Wire Bonder
9.6.2 Die Bonder
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Semiconductor Bonding Equipment Market Size Forecast by Applications
9.10.1 Integrated Device Manufacturer (IDMs)
9.10.2 Outsourced Semiconductor Assembly and Test (OSATs)
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Semiconductor Bonding Equipment Analysis and Forecast
10.1 Introduction
10.2 Europe Semiconductor Bonding Equipment Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Semiconductor Bonding Equipment Market Size Forecast by Type
10.6.1 Wire Bonder
10.6.2 Die Bonder
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Semiconductor Bonding Equipment Market Size Forecast by Applications
10.10.1 Integrated Device Manufacturer (IDMs)
10.10.2 Outsourced Semiconductor Assembly and Test (OSATs)
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Semiconductor Bonding Equipment Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Semiconductor Bonding Equipment Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Semiconductor Bonding Equipment Market Size Forecast by Type
11.6.1 Wire Bonder
11.6.2 Die Bonder
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Semiconductor Bonding Equipment Market Size Forecast by Applications
11.10.1 Integrated Device Manufacturer (IDMs)
11.10.2 Outsourced Semiconductor Assembly and Test (OSATs)
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Semiconductor Bonding Equipment Analysis and Forecast
12.1 Introduction
12.2 Latin America Semiconductor Bonding Equipment Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Semiconductor Bonding Equipment Market Size Forecast by Type
12.6.1 Wire Bonder
12.6.2 Die Bonder
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Semiconductor Bonding Equipment Market Size Forecast by Applications
12.10.1 Integrated Device Manufacturer (IDMs)
12.10.2 Outsourced Semiconductor Assembly and Test (OSATs)
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Semiconductor Bonding Equipment Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Semiconductor Bonding Equipment Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Semiconductor Bonding Equipment Market Size Forecast by Type
13.6.1 Wire Bonder
13.6.2 Die Bonder
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Semiconductor Bonding Equipment Market Size Forecast by Applications
13.10.1 Integrated Device Manufacturer (IDMs)
13.10.2 Outsourced Semiconductor Assembly and Test (OSATs)
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Semiconductor Bonding Equipment Market: Competitive Dashboard
14.2 Global Semiconductor Bonding Equipment Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Besi
14.3.2 ASM Pacific Technology
14.3.3 Kulicke& Soffa
14.3.4 Palomar Technologies
14.3.5 DIAS Automation
14.3.6 F&K Delvotec Bondtechnik
14.3.7 Hesse
14.3.8 Hybond
14.3.9 SHINKAWA Electric
14.3.10 Toray Engineering
14.3.11 Besi
14.3.12 FASFORD TECHNOLOGY
14.3.13 West-Bond
