Market Overview:
The global semiconductor bonding wax market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductors and MEMS devices across the globe. In terms of type, the solid segment is expected to hold a major share of the global semiconductor bonding wax market during the forecast period. This can be attributed to its properties such as high thermal stability and low reactivity with other materials. In terms of application, the semiconductor segment is expected to hold a major share of the global semiconductor bonding wax market duringthe forecast period.
Product Definition:
The definition of a semiconductor bonding wax is a material that is used to create and attach semiconductor devices to each other. The importance of using a semiconductor bonding wax is that it ensures the devices are properly connected and will function correctly.
Solid:
Solid is a wax-based compound, which has high melting point and solidifies into an amorphous mass at room temperature. It is also called as paraffin wax or stearic acid (C16H34) base. It has the ability to be easily processed by molding, cutting, and drilling.
Liquid:
Liquid is a transparent, odorless, and tasteless substance that is used in the semiconductor bonding wax market. It has high thermal stability and low volatility which helps in retaining its properties for a longer time span. The liquid acts as an adhesive when it comes across metal surfaces thus making good electrical contact between the two components of an electronic device.
Application Insights:
The global demand for the semiconductor segment was valued at USD 281.0 million in 2017 and is expected to ascend at a CAGR of XX% from 2018 to 2030, while registering a growth halt in the MEMS application segment over the forecast period owing to high penetration levels globally. The waxes are used as an adhesive agent for attaching components such as capacitors, resistors and inductors on integrated circuits during manufacturing of semiconductors.
Solid state waxes have been witnessing increased adoption across various end-use industries due to properties such as low melting point along with excellent adhesion and binding capabilities with substrates like plastic, glass fiber reinforced materials & metals among others making it ideal for use in electronic devices & sensors where low temperature resistance is not required but electrical insulation is mandatory between components on an integrated circuit or microchip.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing region over the forecast period. The growth can be attributed to increasing production and consumption of electronics in this region. In 2017, Asia Pacific accounted for a market share of more than 30% in terms of volume owing to large-scale production and assembly of electronic products in China, India, South Korea, Japan among other countries.
The demand for semiconductor bonding wax is expected to grow significantly due to its use as an interface material between different semiconductors during manufacturing processes such as IC fabrication and testing equipment among others. The growing demand has led major players including Taiwan Semiconductor Manufacturing Company (TSMC), UMC Holdings Inc., Samsung Electronics Co., Ltd., Infineon Technologies AG among others are investing huge amounts in IC fabrication plants across Asia Pacific thus fueling regional growth over the next eight years.
Growth Factors:
- Increasing demand for semiconductor devices from the consumer electronics and automotive industries
- Growing popularity of miniaturized and low-power semiconductor devices
- Proliferation of 3D printing technology in the manufacturing sector
- Rising demand for advanced packaging technologies in the semiconductor industry
- Growing investments in research and development activities for advanced bonding waxes
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Bonding Wax Market Research Report
By Type
Solid, Liquid
By Application
Semiconductor, MEMS
By Companies
Valtech Corporation, AI Technology, Aremco, Kayaku, Nikka Seiko, Logitech
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
229
Number of Tables & Figures
161
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Bonding Wax Market Report Segments:
The global Semiconductor Bonding Wax market is segmented on the basis of:
Types
Solid, Liquid
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Semiconductor, MEMS
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Valtech Corporation
- AI Technology
- Aremco
- Kayaku
- Nikka Seiko
- Logitech
Highlights of The Semiconductor Bonding Wax Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Solid
- Liquid
- By Application:
- Semiconductor
- MEMS
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Bonding Wax Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor Bonding Wax is a wax-based adhesive used to bond semiconductor materials together. It is typically used in the manufacturing of electronic devices, such as microchips and solar cells.
Some of the major players in the semiconductor bonding wax market are Valtech Corporation, AI Technology, Aremco, Kayaku, Nikka Seiko, Logitech.
The semiconductor bonding wax market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Semiconductor Bonding Wax Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Semiconductor Bonding Wax Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Semiconductor Bonding Wax Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Semiconductor Bonding Wax Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Semiconductor Bonding Wax Market Size & Forecast, 2020-2028
4.5.1 Semiconductor Bonding Wax Market Size and Y-o-Y Growth
4.5.2 Semiconductor Bonding Wax Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Solid
5.2.2 Liquid
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Semiconductor
6.2.2 MEMS
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Semiconductor Bonding Wax Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Semiconductor Bonding Wax Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Solid
9.6.2 Liquid
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Semiconductor
9.10.2 MEMS
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Solid
10.6.2 Liquid
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Semiconductor
10.10.2 MEMS
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Solid
11.6.2 Liquid
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Semiconductor
11.10.2 MEMS
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Solid
12.6.2 Liquid
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Semiconductor
12.10.2 MEMS
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Solid
13.6.2 Liquid
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Semiconductor
13.10.2 MEMS
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Semiconductor Bonding Wax Market: Competitive Dashboard
14.2 Global Semiconductor Bonding Wax Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Valtech Corporation
14.3.2 AI Technology
14.3.3 Aremco
14.3.4 Kayaku
14.3.5 Nikka Seiko
14.3.6 Logitech
