Market Overview:
The global semiconductor grade encapsulants market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices from the automotive and consumer electronics industries. In addition, the growing demand for miniaturized and energy-efficient electronic devices is also contributing to the growth of this market. The global semiconductor grade encapsulants market can be segmented on the basis of type into one component and two component encapsulants. The two component encapsulants segment is expected to grow at a higher CAGR than the one component encapsulants segment during the forecast period from 2018 to 2030. This can be attributed to their superior properties such as thermal stability, chemical resistance, and electrical insulation which make them suitable for use in high-end applications such as automotive and consumer electronics industries. On the basis of application,the global semiconductor grade encapsulantsmarket can be divided into automotive,consumer electronics,and others segments.
Product Definition:
A semiconductor grade encapsulant is a material used to coat and protect semiconductor devices. It is important to use a semiconductor grade encapsulant because it prevents contamination and degradation of the device.
One Component:
One component (OC) encapsulants are used to package semiconductor devices in various types of packaging including leaded, ceramic, plastic and glass. The growth factor for the market is the increasing demand from end-use industries such as consumer electronics & mobile phones, solar industry and IT equipment manufacturing. One component encapsulants protect semiconductor devices from moisture which is a key factor driving growth for this market globally.
Two Component:
The two component and it's usage in semiconductor grade encapsulants market is expected to witness significant growth over the forecast period. The demand for such components is increasing owing to their ability of providing reliable performance at a low cost. Furthermore, they are also responsible for enhancing device reliability by lowering the failure rate of integrated circuits which is further expected to propel industry growth over the next seven years.
Application Insights:
The demand for semiconductor grade encapsulants in the automotive industry is expected to witness growth at a CAGR of XX% from 2018 to 2030 owing to the growing need for advanced safety features and increasing penetration of smart devices. The use of electronic equipment in automobiles has increased significantly over the past decade, with most cars now coming equipped with Bluetooth connectivity, navigation systems and entertainment systems. This trend is expected to continue over the forecast period, further driving market growth.
Consumer electronics was one of the largest application segments in 2017 and accounted for a revenue share of 33%. SGEEs are used as moisture barriers between integrated circuits (ICs), connectors and other components within electronic products such as mobile phones/handheld devices or home appliances such as refrigerators or washing machines among others.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing product demand from various end-use industries, such as consumer electronics and automotive. In addition, rising investments in R&D activities for semiconductor manufacturing are also anticipated to drive industry expansion over the next eight years.
The Asia Pacific region accounted for a revenue share of more than 30% in 2017 owing to high demand from key markets including China and India. The presence of numerous electronic manufacturers in these countries has resulted in increased consumption of encapsulants across all segments including mobile phones, tablets, personal computers (PCs), servers and storage systems etc., thereby driving market growth across this region since last few years (2016 & 2017). However, due to slowdown or shutdown of some manufacturing facilities due to lack or resources like energy etc.
Growth Factors:
- Increasing demand for semiconductor devices from consumer electronics and automotive industries
- Growing trend of miniaturization in semiconductor devices
- Proliferation of 3D printing technology in the semiconductor industry
- Rising demand for advanced packaging technologies in the semiconductor industry
- Growing popularity of organic light-emitting diode (OLED) displays
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Grade Encapsulants Market Research Report
By Type
One Component, Two Component
By Application
Automotive, Consumer Electronics, Others
By Companies
Henkel, M, Shin-Etsu MicroSi, Lord, Hitachi, Zymet, Epoxy, Nitto, Uninwell
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
232
Number of Tables & Figures
163
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Grade Encapsulants Market Report Segments:
The global Semiconductor Grade Encapsulants market is segmented on the basis of:
Types
One Component, Two Component
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automotive, Consumer Electronics, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Henkel
- M
- Shin-Etsu MicroSi
- Lord
- Hitachi
- Zymet
- Epoxy
- Nitto
- Uninwell
Highlights of The Semiconductor Grade Encapsulants Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- One Component
- Two Component
- By Application:
- Automotive
- Consumer Electronics
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Grade Encapsulants Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor grade encapsulants are used in electronic devices to protect the device from environmental and mechanical damage. The encapsulant material is a dielectric or metal oxide that forms a protective barrier around the device's circuitry.
Some of the major companies in the semiconductor grade encapsulants market are Henkel, M, Shin-Etsu MicroSi, Lord, Hitachi, Zymet, Epoxy, Nitto, Uninwell.
The semiconductor grade encapsulants market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Semiconductor Grade Encapsulants Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Semiconductor Grade Encapsulants Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Semiconductor Grade Encapsulants Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Semiconductor Grade Encapsulants Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Semiconductor Grade Encapsulants Market Size & Forecast, 2020-2028
4.5.1 Semiconductor Grade Encapsulants Market Size and Y-o-Y Growth
4.5.2 Semiconductor Grade Encapsulants Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 One Component
5.2.2 Two Component
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Automotive
6.2.2 Consumer Electronics
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Semiconductor Grade Encapsulants Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Semiconductor Grade Encapsulants Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 One Component
9.6.2 Two Component
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Automotive
9.10.2 Consumer Electronics
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 One Component
10.6.2 Two Component
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Automotive
10.10.2 Consumer Electronics
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 One Component
11.6.2 Two Component
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Automotive
11.10.2 Consumer Electronics
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 One Component
12.6.2 Two Component
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Automotive
12.10.2 Consumer Electronics
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 One Component
13.6.2 Two Component
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Automotive
13.10.2 Consumer Electronics
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Semiconductor Grade Encapsulants Market: Competitive Dashboard
14.2 Global Semiconductor Grade Encapsulants Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Henkel
14.3.2 M
14.3.3 Shin-Etsu MicroSi
14.3.4 Lord
14.3.5 Hitachi
14.3.6 Zymet
14.3.7 Epoxy
14.3.8 Nitto
14.3.9 Uninwell
