Market Overview:
The global semiconductor and IC packaging materials market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductors and ICs in various applications, such as automobiles, electronics, communication, and others. In addition, the growing demand for miniaturized and advanced packages is also contributing to the growth of this market. The global semiconductor and IC packaging materials market can be segmented on the basis of type into organic substrates, bonding wires, lead frames, and ceramic packages. The organic substrates segment is expected to grow at a CAGR of 7% during the forecast period from 2018 to 2030. This growth can be attributed to the increasing demand for advanced packaging technologies that use organic substrates.
Product Definition:
A semiconductor is a material that can connect and conduct electricity and heat. They are made of materials like carbon, silicon, germanium, and silicon-germanium, and are found in computer chips, solar energy cells and LED lights. Semiconductors can be either doped or undoped. Doping means adding impurities to the material to change its electrical properties.
Organic Substrates:
Organic substrates, it's usage and growth factor in semiconductor & IC packaging materials market? Organic substrates are the materials that are used for the fabrication of printed circuit boards (PCB). The substrate is an essential part of electronic devices; without it, a device cannot function. It has important functions such as providing mechanical support to components on its surface and also provides a conducting channel for electrical signals to flow between components.
Bonding Wires:
Bonding wires are used in semiconductor & integrated circuit packaging materials for the purpose of increasing the thermal stability and mechanical strength of packaged devices. They also provide a conductive path from one side of a package to the other, thereby preventing short circuits and electrical connections from occurring within packages.
Application Insights:
The electronics industry accounted for the largest market share in 2017 and is projected to expand at a CAGR of XX% over the forecast period. The growth can be attributed to increasing demand for semiconductors from various application industries such as consumer electronics, telecommunication, automotive and other sectors.
Automotive applications are anticipated to witness significant growth over the forecast period owing to rising demand for electronic systems in vehicles which include navigation systems, entertainment systems and safety features among others. In addition, stringent regulations regarding energy efficiency along with growing concerns regarding global warming due to increased carbon emissions are expected drive the segment further.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to rising investments in IC packaging by companies such as Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC) and others. In addition, increasing demand for smartphones, rapid industrialization along with growing consumer electronics industry are anticipated to drive the regional market growth.
The Asia Pacific region accounted for a revenue share of more than 30% in 2017 owing to high demand from end-use industries such as Automotive & Transportation and Consumer Electronics. Increasing use of ceramic packages in automotive applications on account of their advantages such as low cost and better heat dissipation properties is likely to augment market growth over the forecast period.
Europe was estimated at USD X million in 2017 owing both volume consumption patterns across various application segments coupled with technological advancements witnessed since last few years within microelectronics industry especially within Germany which accounts for maximum share followed by UK.
Growth Factors:
- Increasing demand for semiconductor and IC packaging materials from the electronics industry as a result of the growing trend of miniaturization and integration in electronic devices.
- Rising demand for semiconductor and IC packaging materials in automotive applications due to increasing use of electronics in vehicles.
- Growing demand for semiconductor and IC packaging materials from the medical device industry as a result of increasing use of advanced medical technologies.
- Increasing penetration of semiconductor and IC packaging materials in renewable energy applications such as solar photovoltaics (PV) and wind turbines owing to their high efficiency levels compared to traditional energy sources such as fossil fuels .
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor & IC Packaging Materials Market Research Report
By Type
Organic Substrates, Bonding Wires, Lead Frames, Ceramic Packages
By Application
Automobile Industry, Electronics Industry, Communication, Other
By Companies
Alent, Hitachi Chemical, Kyocera Chemical, LG Chemical, Sumitomo Chemical, BASF SE, Mitsui High-tec, Henkel AG & Company, Toray Industries Corporation, TANAKA HOLDINGS, Alent
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
239
Number of Tables & Figures
168
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor & IC Packaging Materials Market Report Segments:
The global Semiconductor & IC Packaging Materials market is segmented on the basis of:
Types
Organic Substrates, Bonding Wires, Lead Frames, Ceramic Packages
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Automobile Industry, Electronics Industry, Communication, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Alent
- Hitachi Chemical
- Kyocera Chemical
- LG Chemical
- Sumitomo Chemical
- BASF SE
- Mitsui High-tec
- Henkel AG & Company
- Toray Industries Corporation
- TANAKA HOLDINGS
- Alent
Highlights of The Semiconductor & IC Packaging Materials Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Organic Substrates
- Bonding Wires
- Lead Frames
- Ceramic Packages
- By Application:
- Automobile Industry
- Electronics Industry
- Communication
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor & IC Packaging Materials Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor and IC packaging materials are used to protect the electronic components within a package. These materials can include plastic, metal, and ceramic material.
Some of the major players in the semiconductor & ic packaging materials market are Alent, Hitachi Chemical, Kyocera Chemical, LG Chemical, Sumitomo Chemical, BASF SE, Mitsui High-tec, Henkel AG & Company, Toray Industries Corporation, TANAKA HOLDINGS, Alent.
The semiconductor & ic packaging materials market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Semiconductor & IC Packaging Materials Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Semiconductor & IC Packaging Materials Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Semiconductor & IC Packaging Materials Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Semiconductor & IC Packaging Materials Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Semiconductor & IC Packaging Materials Market Size & Forecast, 2020-2028
4.5.1 Semiconductor & IC Packaging Materials Market Size and Y-o-Y Growth
4.5.2 Semiconductor & IC Packaging Materials Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Organic Substrates
5.2.2 Bonding Wires
5.2.3 Lead Frames
5.2.4 Ceramic Packages
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Automobile Industry
6.2.2 Electronics Industry
6.2.3 Communication
6.2.4 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Semiconductor & IC Packaging Materials Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Semiconductor & IC Packaging Materials Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Organic Substrates
9.6.2 Bonding Wires
9.6.3 Lead Frames
9.6.4 Ceramic Packages
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Automobile Industry
9.10.2 Electronics Industry
9.10.3 Communication
9.10.4 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Organic Substrates
10.6.2 Bonding Wires
10.6.3 Lead Frames
10.6.4 Ceramic Packages
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Automobile Industry
10.10.2 Electronics Industry
10.10.3 Communication
10.10.4 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Organic Substrates
11.6.2 Bonding Wires
11.6.3 Lead Frames
11.6.4 Ceramic Packages
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Automobile Industry
11.10.2 Electronics Industry
11.10.3 Communication
11.10.4 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Organic Substrates
12.6.2 Bonding Wires
12.6.3 Lead Frames
12.6.4 Ceramic Packages
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Automobile Industry
12.10.2 Electronics Industry
12.10.3 Communication
12.10.4 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Organic Substrates
13.6.2 Bonding Wires
13.6.3 Lead Frames
13.6.4 Ceramic Packages
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Automobile Industry
13.10.2 Electronics Industry
13.10.3 Communication
13.10.4 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Semiconductor & IC Packaging Materials Market: Competitive Dashboard
14.2 Global Semiconductor & IC Packaging Materials Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Alent
14.3.2 Hitachi Chemical
14.3.3 Kyocera Chemical
14.3.4 LG Chemical
14.3.5 Sumitomo Chemical
14.3.6 BASF SE
14.3.7 Mitsui High-tec
14.3.8 Henkel AG & Company
14.3.9 Toray Industries Corporation
14.3.10 TANAKA HOLDINGS
14.3.11 Alent
