Market Overview:
The global semiconductor process tapes market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductors from various end-use industries, such as automotive, consumer electronics, and telecommunications. In addition, the growing demand for miniaturization and higher performance in electronic devices is also driving the growth of this market. The global semiconductor process tapes market can be segmented on the basis of type into UV tape and non-UV tape. The UV tape segment is expected to grow at a higher CAGR than the non-UV tape segment during the forecast period from 2018 to 2030. This growth can be attributed to its superior properties such as high adhesion strength and chemical resistance as compared with other types of tapes available in the market. On the basis of application,the global semiconductor process tapesmarket can be divided into back-grinding and cutting applications.
Product Definition:
A semiconductor process tape (SPT) is a thin, flexible strip of material coated with a layer of metal or other semiconductor material. The tape can be used to create electrical circuits on surfaces such as silicon wafers.
UV Tape:
UV tape, also known as UV sensitive (or light-sensitive) paper or plastic is a type of polyester film that can be processed like any other polymer film. It is manufactured by the addition of bromine (IBr) to chloroprene in the presence of calcium (Ca2+) and an alkali catalyst at high temperature.
Non-UV Tape:
Non-UV tape is a special type of electronic tape that is used in the packaging and transportation of semiconductor devices. It helps to protect these devices from any kind of damage due to exposure to UV light, which has a potential to destroy the information stored on tapes. The product also finds its usage in other applications such as bonding, masking, and others.
Application Insights:
The process tapes are used for back-grinding and cutting applications in the global semiconductor industry. Back-grinding is a critical step in the production of chips and other small pieces of electronic devices, which involves sharp edges or corners that need to be ground. Process tapes are used for this purpose as they offer enhanced grinding capabilities while reducing heat generation and energy consumption.
Processing of various materials such as silicon, gallium arsenide, aluminum nitride, sapphire glass using CEMs (Ceramic Electromagnetic Machines) requires complex processes involving multiple steps such as polishing & grinding followed by an etch process to get smooth surfaces ready for further processing using microelectronics technology at ultra-high frequencies.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for electronic products in countries, such as China and India. In addition, growing semiconductor industry in these countries will drive the market further. For instance, according to a research paper published by International Semiconductor Association (ISA), titled “The Chinese Electronics Industry Report 2015â€, it was estimated that sales of electronics products in China grew at a rate of 16% from 2010 to 2014.
North America is also likely to witness significant growth over the coming years owing bothto increased demand for back-grinding machines as well as UV tape used for masking processes during chip manufacturing processes.
Growth Factors:
- Increasing demand for semiconductor devices from the consumer electronics and automotive industries
- Rising demand for miniaturized and energy-efficient semiconductor devices
- Proliferation of 3D printing technology in the semiconductor industry
- Growing popularity of advanced packaging technologies, such as 2.5D and 3D ICs
- Emergence of new applications for semiconductors, such as the Internet of Things (IoT)
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Process Tapes Market Research Report
By Type
UV Tape, Non-UV Tape
By Application
Back-grinding, Cutting
By Companies
Mitsui Chemicals Tohcello, Lintec, Denka, Nitto, Furukawa Electric, D&X, AI Technology, Taicang ZHANXIN Adhesive Materials Co, Shanghai Jingshen (Fine Coating) New Material Co, Shanghai Guk Tape Technology Co, Suzhou Boyan Jingjin Photoelectric Co, Kunshan Boyi Xincheng Polymer Material Co
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
242
Number of Tables & Figures
170
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Process Tapes Market Report Segments:
The global Semiconductor Process Tapes market is segmented on the basis of:
Types
UV Tape, Non-UV Tape
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Back-grinding, Cutting
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Mitsui Chemicals Tohcello
- Lintec
- Denka
- Nitto
- Furukawa Electric
- D&X
- AI Technology
- Taicang ZHANXIN Adhesive Materials Co
- Shanghai Jingshen (Fine Coating) New Material Co
- Shanghai Guk Tape Technology Co
- Suzhou Boyan Jingjin Photoelectric Co
- Kunshan Boyi Xincheng Polymer Material Co
Highlights of The Semiconductor Process Tapes Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- UV Tape
- Non-UV Tape
- By Application:
- Back-grinding
- Cutting
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Process Tapes Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor process tapes are a type of manufacturing tape used to create semiconductor wafers. They are made from a thin, transparent plastic film that is coated with a layer of metal. The metal layer acts as an etching mask and helps remove unwanted material from the surface of the wafer.
Some of the key players operating in the semiconductor process tapes market are Mitsui Chemicals Tohcello, Lintec, Denka, Nitto, Furukawa Electric, D&X, AI Technology, Taicang ZHANXIN Adhesive Materials Co, Shanghai Jingshen (Fine Coating) New Material Co, Shanghai Guk Tape Technology Co, Suzhou Boyan Jingjin Photoelectric Co, Kunshan Boyi Xincheng Polymer Material Co.
The semiconductor process tapes market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Semiconductor Process Tapes Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Semiconductor Process Tapes Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Semiconductor Process Tapes Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Semiconductor Process Tapes Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Semiconductor Process Tapes Market Size & Forecast, 2020-2028
4.5.1 Semiconductor Process Tapes Market Size and Y-o-Y Growth
4.5.2 Semiconductor Process Tapes Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 UV Tape
5.2.2 Non-UV Tape
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Back-grinding
6.2.2 Cutting
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Semiconductor Process Tapes Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Semiconductor Process Tapes Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 UV Tape
9.6.2 Non-UV Tape
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Back-grinding
9.10.2 Cutting
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 UV Tape
10.6.2 Non-UV Tape
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Back-grinding
10.10.2 Cutting
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 UV Tape
11.6.2 Non-UV Tape
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Back-grinding
11.10.2 Cutting
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 UV Tape
12.6.2 Non-UV Tape
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Back-grinding
12.10.2 Cutting
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 UV Tape
13.6.2 Non-UV Tape
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Back-grinding
13.10.2 Cutting
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Semiconductor Process Tapes Market: Competitive Dashboard
14.2 Global Semiconductor Process Tapes Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Mitsui Chemicals Tohcello
14.3.2 Lintec
14.3.3 Denka
14.3.4 Nitto
14.3.5 Furukawa Electric
14.3.6 D&X
14.3.7 AI Technology
14.3.8 Taicang ZHANXIN Adhesive Materials Co
14.3.9 Shanghai Jingshen (Fine Coating) New Material Co
14.3.10 Shanghai Guk Tape Technology Co
14.3.11 Suzhou Boyan Jingjin Photoelectric Co
14.3.12 Kunshan Boyi Xincheng Polymer Material Co
