Market Overview:
The global semiconductor sputtering targets market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices from various end-use industries, such as automotive, consumer electronics, and telecommunications. In addition, the growing demand for miniaturized and energy-efficient devices is also contributing to the growth of this market. The global semiconductor sputtering targets market by type is segmented into titanium target, aluminum target, tantalum target, copper target and others. The titanium target segment is expected to hold the largest share of the global semiconductor sputtering targets market by type during the forecast period from 2018 to 2030. This can be attributed to its high durability and resistance against wear and tear as compared with other types of targets available in this market. The global semiconductor sputtering targets market by application is segmented into wafer manufacturing, packaging and testing segments respectively.
Product Definition:
A semiconductor sputtering target is a material that is used to produce thin films by the sputter deposition process. Semiconductor devices are manufactured using thin films of various materials, and the most common material used for these devices is silicon. Silicon can be deposited by either thermal or plasma-enhanced chemical vapor deposition (CVD), but both of these methods require high temperatures, which can damage or destroy the underlying substrate.
Titanium Target:
Titanium target is a metal with an outer electron shell that has six times the binding energy of gold. It can be used in sputtering targets for semiconductor devices and as a catalyst in chemical reactions.
Aluminum Target:
Aluminum target is a material made of aluminum and it's used in semiconductor, solar cell and insulator industries for the production of thin films. It has wide applications in the electronics industry as an insulating layer ortargeting layerin various devices including MEMS, NAND flash memory, DRAMs (Dynamic Random Access Memory), PC Cards (PCI Express), ICs (Integrated Circuit)and photovoltaic cells.
Application Insights:
The packaging and testing application segment accounted for the largest revenue share in 2017. The demand for sputtering targets is expected to increase significantly owing to rising applications in various packaging and testing activities such as inspection of circuit boards, test-of-warranty, surface mount devices (SMDs), BGA packages, QSOP packages and others.
The sputtering target market is anticipated to witness significant growth over the forecast period due to increasing demand from end users including semiconductor companies for manufacturing high quality products at low costs. Factors such as growing electronics industry along with rapid technological advancements are anticipated to boost product consumption over the forecast period.
Regional Analysis:
North America accounted for the largest market share in 2017. The growth is attributed to the presence of a large number of semiconductor manufacturers, which are using sputtering targets for various applications such as patterning and coating of semiconductors, wafer processing and testing. Europe is expected to be the second-largest regional market over the forecast period owing to rapid technological advancements in microelectronics that have resulted in increased demand for sputtering targets from research institutes and universities. Asia Pacific region is anticipated to grow at a lucrative rate over the forecast period due to increasing investments by foreign players such as Toyota Tsusho (Japan), Nippon Steel & Sumitomo Metal Corporation (Japan) along with domestic players like WEG Limited (India). These factors are expected contribute toward industry growth during the forecast period.
Latin America also has potential growth opportunities due to growing demand from end-use industries including electronics, automotive, energy storage etc.
Growth Factors:
- Increasing demand for semiconductor sputtering targets from the electronics and automotive industries
- Growing popularity of nanotechnology and its applications in various end-use industries
- Rising demand for thin film coatings across different industrial sectors
- Proliferation of advanced deposition technologies that require high-quality semiconductor sputtering targets
- Stringent government regulations pertaining to environmental protection and energy conservation
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Sputtering Targets Market Research Report
By Type
Titanium Target, Aluminum Target, Tantalum Target, Copper Target, Others
By Application
Wafer Manufacturing, Packaging and Testing
By Companies
JX Nippon Mining & Metals Corporation, Praxair, Hitachi Metals, Honeywell, Sumitomo Chemical, ULVAC, Materion (Heraeus), GRIKIN Advanced Material Co., Ltd., TOSOH, Ningbo Jiangfeng, JX Nippon Mining & Metals Corporation, Advantec, Angstrom Sciences, Umicore Thin Film Products
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
227
Number of Tables & Figures
159
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Sputtering Targets Market Report Segments:
The global Semiconductor Sputtering Targets market is segmented on the basis of:
Types
Titanium Target, Aluminum Target, Tantalum Target, Copper Target, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Wafer Manufacturing, Packaging and Testing
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- JX Nippon Mining & Metals Corporation
- Praxair
- Hitachi Metals
- Honeywell
- Sumitomo Chemical
- ULVAC
- Materion (Heraeus)
- GRIKIN Advanced Material Co., Ltd.
- TOSOH
- Ningbo Jiangfeng
- JX Nippon Mining & Metals Corporation
- Advantec
- Angstrom Sciences
- Umicore Thin Film Products
Highlights of The Semiconductor Sputtering Targets Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Titanium Target
- Aluminum Target
- Tantalum Target
- Copper Target
- Others
- By Application:
- Wafer Manufacturing
- Packaging and Testing
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Sputtering Targets Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
- Market Entry Strategies
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- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor sputtering targets are used in semiconductor fabrication to deposit thin films of materials onto a substrate.
Some of the key players operating in the semiconductor sputtering targets market are JX Nippon Mining & Metals Corporation, Praxair, Hitachi Metals, Honeywell, Sumitomo Chemical, ULVAC, Materion (Heraeus), GRIKIN Advanced Material Co., Ltd., TOSOH, Ningbo Jiangfeng, JX Nippon Mining & Metals Corporation, Advantec, Angstrom Sciences, Umicore Thin Film Products.
The semiconductor sputtering targets market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Semiconductor Sputtering Targets Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Semiconductor Sputtering Targets Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Semiconductor Sputtering Targets Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Semiconductor Sputtering Targets Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Semiconductor Sputtering Targets Market Size & Forecast, 2018-2028
4.5.1 Semiconductor Sputtering Targets Market Size and Y-o-Y Growth
4.5.2 Semiconductor Sputtering Targets Market Absolute $ Opportunity
Chapter 5 Global Semiconductor Sputtering Targets Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Semiconductor Sputtering Targets Market Size Forecast by Type
5.2.1 Titanium Target
5.2.2 Aluminum Target
5.2.3 Tantalum Target
5.2.4 Copper Target
5.2.5 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Semiconductor Sputtering Targets Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Semiconductor Sputtering Targets Market Size Forecast by Applications
6.2.1 Wafer Manufacturing
6.2.2 Packaging and Testing
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Semiconductor Sputtering Targets Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Semiconductor Sputtering Targets Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Semiconductor Sputtering Targets Analysis and Forecast
9.1 Introduction
9.2 North America Semiconductor Sputtering Targets Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Semiconductor Sputtering Targets Market Size Forecast by Type
9.6.1 Titanium Target
9.6.2 Aluminum Target
9.6.3 Tantalum Target
9.6.4 Copper Target
9.6.5 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Semiconductor Sputtering Targets Market Size Forecast by Applications
9.10.1 Wafer Manufacturing
9.10.2 Packaging and Testing
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Semiconductor Sputtering Targets Analysis and Forecast
10.1 Introduction
10.2 Europe Semiconductor Sputtering Targets Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Semiconductor Sputtering Targets Market Size Forecast by Type
10.6.1 Titanium Target
10.6.2 Aluminum Target
10.6.3 Tantalum Target
10.6.4 Copper Target
10.6.5 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Semiconductor Sputtering Targets Market Size Forecast by Applications
10.10.1 Wafer Manufacturing
10.10.2 Packaging and Testing
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Semiconductor Sputtering Targets Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Semiconductor Sputtering Targets Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Semiconductor Sputtering Targets Market Size Forecast by Type
11.6.1 Titanium Target
11.6.2 Aluminum Target
11.6.3 Tantalum Target
11.6.4 Copper Target
11.6.5 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Semiconductor Sputtering Targets Market Size Forecast by Applications
11.10.1 Wafer Manufacturing
11.10.2 Packaging and Testing
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Semiconductor Sputtering Targets Analysis and Forecast
12.1 Introduction
12.2 Latin America Semiconductor Sputtering Targets Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Semiconductor Sputtering Targets Market Size Forecast by Type
12.6.1 Titanium Target
12.6.2 Aluminum Target
12.6.3 Tantalum Target
12.6.4 Copper Target
12.6.5 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Semiconductor Sputtering Targets Market Size Forecast by Applications
12.10.1 Wafer Manufacturing
12.10.2 Packaging and Testing
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Semiconductor Sputtering Targets Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Semiconductor Sputtering Targets Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Semiconductor Sputtering Targets Market Size Forecast by Type
13.6.1 Titanium Target
13.6.2 Aluminum Target
13.6.3 Tantalum Target
13.6.4 Copper Target
13.6.5 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Semiconductor Sputtering Targets Market Size Forecast by Applications
13.10.1 Wafer Manufacturing
13.10.2 Packaging and Testing
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Semiconductor Sputtering Targets Market: Competitive Dashboard
14.2 Global Semiconductor Sputtering Targets Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 JX Nippon Mining & Metals Corporation
14.3.2 Praxair
14.3.3 Hitachi Metals
14.3.4 Honeywell
14.3.5 Sumitomo Chemical
14.3.6 ULVAC
14.3.7 Materion (Heraeus)
14.3.8 GRIKIN Advanced Material Co., Ltd.
14.3.9 TOSOH
14.3.10 Ningbo Jiangfeng
14.3.11 JX Nippon Mining & Metals Corporation
14.3.12 Advantec
14.3.13 Angstrom Sciences
14.3.14 Umicore Thin Film Products
