Market Overview:
The global semiconductor wafer-level and advanced packaging inspection systems market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices across different applications, such as consumer electronics, automotive electronics, industrial, healthcare and others. Additionally, the growing trend of miniaturization in electronic devices is also fueling the demand for semiconductor wafer-level and advanced packaging inspection systems. Based on type, the global semiconductor wafer-level and advanced packaging inspection systems market can be segmented into optical based and infrared type. The optical based segment is expected to hold a major share of the global market during the forecast period owing to its high accuracy levels and ability to detect even minor defects on a wafer or package surface. Based on application, the global semiconductor wafer-level and advanced packaging inspection systems market can be divided into consumer electronics, automotive electronics industrial healthcareand others segments.
Product Definition:
A semiconductor wafer-level and advanced packaging inspection system is a type of machine that is used to inspect semiconductor wafers and advanced packaging structures. These systems are important because they help to ensure the quality of the products that are produced.
Optical Based:
Optical-based technology is used in wafer-level and advanced packaging inspection systems for noninvasive detection of defects such as surface contamination, impurities, and other microstructural issues. The technology provides high speed, sensitivity, and accuracy in detecting defects on semiconductor wafers during the manufacturing process.
Infrared Type:
Infrared type is a non-contact method for temperature measurement. It generates infrared light and measures the reflected light from the target object. The technology has been around for more than three decades, but only recently has it started to gain widespread acceptance in packaging applications across various industry verticals such as consumer goods, automotive & transportation, electronics & semiconductors, and food processing among others.
Application Insights:
The global semiconductor wafer-level and advanced packaging inspection systems market by application is segmented into consumer electronics, automotive electronics, industrial, healthcare, and other applications. The consumer electronics segment accounted for the largest share in 2017 owing to increasing demand for smartphones from developing countries such as India and China. Moreover, rapid growth of the IoT industry is expected to increase the need for microcontrollers over the forecast period which will further fuel product demand.
Automotive electronics also held a significant share in 2017 due to growing usage of electronic stability controls that are integrated with safety mechanisms such as antiskid brake/traction control system on account of improving vehicle safety features along with comfort features including air conditioner/heater control system on account of gaining customer satisfaction. Furthermore rising use cases such as infotainment systems that provide navigation information along with entertainment content are anticipated to boost product penetration over the forecast period thereby driving its demand across various end-use industries globally.
Regional Analysis:
Asia Pacific region accounted for the largest market share in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to increasing demand for electronic products, such as smartphones and tablets, in emerging economies of Asia Pacific including China, India, Indonesia, Vietnam and Thailand. In addition to this trend of high-growth markets such as Indonesia or Vietnam where consumer electronics are witnessing a significant demand owing to rising disposable income coupled with growing population is expected drive regional market growth over the forecast period.
The Latin American region is also anticipated witness substantial growth due to rapid industrialization along with increasing investments from foreign players in countries like Brazil and Mexico which has led towards an increased production capacity of semiconductor devices on a large scale.
Growth Factors:
- Increasing demand for semiconductor devices from consumer electronics and automotive industries
- Growing trend of miniaturization in semiconductor devices
- Proliferation of 3D ICs and TSV technology
- Rising demand for advanced packaging technologies such as 2.5D/3D packaging and wafer-level packaging
- Emergence of new applications such as Internet of Things (IoT) and 5G
Scope Of The Report
Report Attributes
Report Details
Report Title
Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Research Report
By Type
Optical Based, Infrared Type
By Application
Consumer Electronics, Automotive Electronics, Industrial, Healthcare, Others
By Companies
KLA-Tencor, Rudolph Technologies (Onto Innovation), Semiconductor Technologies & Instruments (STI), Cohu, Camtek, KLA-Tencor
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
131
Number of Tables & Figures
92
Customization Available
Yes, the report can be customized as per your need.
Global Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Report Segments:
The global Semiconductor Wafer-level and Advanced Packaging Inspection Systems market is segmented on the basis of:
Types
Optical Based, Infrared Type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Automotive Electronics, Industrial, Healthcare, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- KLA-Tencor
- Rudolph Technologies (Onto Innovation)
- Semiconductor Technologies & Instruments (STI)
- Cohu
- Camtek
- KLA-Tencor
Highlights of The Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Optical Based
- Infrared Type
- By Application:
- Consumer Electronics
- Automotive Electronics
- Industrial
- Healthcare
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Semiconductor wafer-level and advanced packaging inspection systems are used to inspect semiconductor devices, packages, and assemblies at the wafer level.
Some of the major players in the semiconductor wafer-level and advanced packaging inspection systems market are KLA-Tencor, Rudolph Technologies (Onto Innovation), Semiconductor Technologies & Instruments (STI), Cohu, Camtek, KLA-Tencor.
The semiconductor wafer-level and advanced packaging inspection systems market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size & Forecast, 2018-2028 4.5.1 Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size and Y-o-Y Growth 4.5.2 Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Absolute $ Opportunity
Chapter 5 Global Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Type
5.2.1 Optical Based
5.2.2 Infrared Type
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Automotive Electronics
6.2.3 Industrial
6.2.4 Healthcare
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Semiconductor Wafer-level and Advanced Packaging Inspection Systems Analysis and Forecast
9.1 Introduction
9.2 North America Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Type
9.6.1 Optical Based
9.6.2 Infrared Type
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Automotive Electronics
9.10.3 Industrial
9.10.4 Healthcare
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Semiconductor Wafer-level and Advanced Packaging Inspection Systems Analysis and Forecast
10.1 Introduction
10.2 Europe Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Type
10.6.1 Optical Based
10.6.2 Infrared Type
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Automotive Electronics
10.10.3 Industrial
10.10.4 Healthcare
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Semiconductor Wafer-level and Advanced Packaging Inspection Systems Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Type
11.6.1 Optical Based
11.6.2 Infrared Type
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Automotive Electronics
11.10.3 Industrial
11.10.4 Healthcare
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Semiconductor Wafer-level and Advanced Packaging Inspection Systems Analysis and Forecast
12.1 Introduction
12.2 Latin America Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Type
12.6.1 Optical Based
12.6.2 Infrared Type
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Automotive Electronics
12.10.3 Industrial
12.10.4 Healthcare
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Semiconductor Wafer-level and Advanced Packaging Inspection Systems Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Type
13.6.1 Optical Based
13.6.2 Infrared Type
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Automotive Electronics
13.10.3 Industrial
13.10.4 Healthcare
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market: Competitive Dashboard
14.2 Global Semiconductor Wafer-level and Advanced Packaging Inspection Systems Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 KLA-Tencor
14.3.2 Rudolph Technologies (Onto Innovation)
14.3.3 Semiconductor Technologies & Instruments (STI)
14.3.4 Cohu
14.3.5 Camtek
14.3.6 KLA-Tencor