Market Overview:
The global shingled conductive adhesive market is expected to grow at a CAGR of XX% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for solar energy across the globe. In addition, the growing awareness about climate change and its impact on environment is also driving the demand for solar energy, which in turn is boosting the demand for shingled conductive adhesive. Regionally, themarketcanbe divided into North America, Latin America, Europe Asia Pacificand Middle East & Africa .
Product Definition:
Shingled Conductive Adhesive is a type of adhesive that has been specifically designed to be used in conjunction with electronic components. It is important because it helps to create a strong and secure bond between the component and the surface it is being attached to, which helps to ensure that there is no interference or shorting between the two.
Acrylic Conductive Adhesive:
Acrylic conductive adhesive is a two-part epoxy system that contains an electrically conductive polymer and an acrylic resin. The product finds application in various end-use industries including electrical & electronics, automotive, construction, general industrial and medical devices. It offers superior performance as compared to its substitutes due to the presence of high purity raw materials coupled with advanced processing techniques used for manufacturing it.
Epoxy Conductive Adhesive:
Epoxy conductive adhesive is a two-part system consisting of an epoxy resin and a copper or aluminum foil. The system reacts when brought in contact with an electric field. The reaction causes the release of heat, which melts the foil to form a liquid bond between them.
The product finds application in various end-use industries including electronics, automotive & transportation, aerospace & defense and building & construction among others where high thermal resistance is required.
Application Insights:
Shingled single-sided module was the largest application segment in 2017 and is expected to continue its dominance over the forecast period. Shingled single-sided modules are used for various applications such as solar shingles, wind turbines, automotive body panels, and consumer electronics. The growing demand for electric vehicles is expected to drive product demand in this application segment over the forecast period.
The others segment includes shingled dual-sided modules, unshingled conductive adhesive sheets and other products such as metalized polymer films and textiles with embedded electricity generating cells among others. Growing urbanization along with increasing investments in renewable energy sources have led to an increase in installations of photovoltaic (PV) panels across the globe which has resulted in increased product consumption globally over recent years.
Regional Analysis:
The Asia Pacific region dominated the global market in 2017. The growing demand for solar cells and increasing investments in R&D are expected to drive the regional market over the forecast period. China is projected to remain a key consumer of shingled conductive adhesives owing to its large-scale adoption of solar energy as an alternative source of power generation, along with India's continued focus on using renewable energy for electricity generation and industrialization.
North America is anticipated to witness significant growth over the next eight years owing to rising product demand from various end-use industries, such as electronics, automotive, building & construction materials among others. Increasing use in medical devices due to better electrical properties compared with traditional solders will also drive industry growth over this period.
Growth Factors:
- Increasing demand from the automotive and electronics industries for shingled conductive adhesive products is expected to drive the market growth.
- Rising demand for miniaturization and lightweighting of electronic devices is also anticipated to fuel the market growth over the forecast period.
- Growing popularity of wearable electronics is another key factor that is expected to propel the Shingled Conductive Adhesive market growth in coming years.
- Increasing research and development activities by leading players for new product launches is also projected to boost the market growth in near future.
Scope Of The Report
Report Attributes
Report Details
Report Title
Shingled Conductive Adhesive Market Research Report
By Type
Acrylic Conductive Adhesive, Epoxy Conductive Adhesive, Silicone Conductive Adhesive
By Application
Shingled Single-sided Module, Shingled Dual-sided Module, Others
By Companies
Heraeus, Henkel, DuPont, Electron Microscopy Sciences, Inc., Wuxi DK Electronic, Yantai Darbond, Shanghai Ruilang, Suzhou Ruilibo
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
244
Number of Tables & Figures
171
Customization Available
Yes, the report can be customized as per your need.
Global Shingled Conductive Adhesive Market Report Segments:
The global Shingled Conductive Adhesive market is segmented on the basis of:
Types
Acrylic Conductive Adhesive, Epoxy Conductive Adhesive, Silicone Conductive Adhesive
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Shingled Single-sided Module, Shingled Dual-sided Module, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Heraeus
- Henkel
- DuPont
- Electron Microscopy Sciences, Inc.
- Wuxi DK Electronic
- Yantai Darbond
- Shanghai Ruilang
- Suzhou Ruilibo
Highlights of The Shingled Conductive Adhesive Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Acrylic Conductive Adhesive
- Epoxy Conductive Adhesive
- Silicone Conductive Adhesive
- By Application:
- Shingled Single-sided Module
- Shingled Dual-sided Module
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Shingled Conductive Adhesive Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Shingled conductive adhesive is a type of electrical tape that has alternating layers of metal and plastic. The metal layer acts as a conductor, while the plastic layer provides insulation. This combination makes shingled conductive adhesive an effective way to connect wires together in a circuit.
Some of the key players operating in the shingled conductive adhesive market are Heraeus, Henkel, DuPont, Electron Microscopy Sciences, Inc., Wuxi DK Electronic, Yantai Darbond, Shanghai Ruilang, Suzhou Ruilibo.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Shingled Conductive Adhesive Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Shingled Conductive Adhesive Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Shingled Conductive Adhesive Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Shingled Conductive Adhesive Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Shingled Conductive Adhesive Market Size & Forecast, 2020-2028
4.5.1 Shingled Conductive Adhesive Market Size and Y-o-Y Growth
4.5.2 Shingled Conductive Adhesive Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Acrylic Conductive Adhesive
5.2.2 Epoxy Conductive Adhesive
5.2.3 Silicone Conductive Adhesive
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Shingled Single-sided Module
6.2.2 Shingled Dual-sided Module
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Shingled Conductive Adhesive Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Shingled Conductive Adhesive Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Acrylic Conductive Adhesive
9.6.2 Epoxy Conductive Adhesive
9.6.3 Silicone Conductive Adhesive
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Shingled Single-sided Module
9.10.2 Shingled Dual-sided Module
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Acrylic Conductive Adhesive
10.6.2 Epoxy Conductive Adhesive
10.6.3 Silicone Conductive Adhesive
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Shingled Single-sided Module
10.10.2 Shingled Dual-sided Module
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Acrylic Conductive Adhesive
11.6.2 Epoxy Conductive Adhesive
11.6.3 Silicone Conductive Adhesive
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Shingled Single-sided Module
11.10.2 Shingled Dual-sided Module
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Acrylic Conductive Adhesive
12.6.2 Epoxy Conductive Adhesive
12.6.3 Silicone Conductive Adhesive
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Shingled Single-sided Module
12.10.2 Shingled Dual-sided Module
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Acrylic Conductive Adhesive
13.6.2 Epoxy Conductive Adhesive
13.6.3 Silicone Conductive Adhesive
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Shingled Single-sided Module
13.10.2 Shingled Dual-sided Module
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Shingled Conductive Adhesive Market: Competitive Dashboard
14.2 Global Shingled Conductive Adhesive Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Heraeus
14.3.2 Henkel
14.3.3 DuPont
14.3.4 Electron Microscopy Sciences, Inc.
14.3.5 Wuxi DK Electronic
14.3.6 Yantai Darbond
14.3.7 Shanghai Ruilang
14.3.8 Suzhou Ruilibo
