Market Overview:
The global silicon IR camera market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for silicon IR cameras in various applications such as wafer dicing and wafer backgrinding. Additionally, the growing demand for semiconductor devices is also contributing to the growth of this market. However, factors such as high cost and limited availability of these cameras are restraining its growth.
Product Definition:
A silicon IR camera is a device that captures images using infrared radiation. These cameras are used in a variety of applications, including security, machine vision, and medical imaging. Silicon IR cameras offer many advantages over other types of infrared cameras, including high resolution images and the ability to capture images in low light conditions.
Single-sided:
Single-sided, it's usage.
The global single-sided, it's usage and growth factor in Silicon IR (Infrared) camera market size was valued at USD 6.0 billion in 2015. The growing demand for smartphones & tablets coupled with the increasing penetration of internet services is expected to drive the industry over the forecast period.
Double-sided:
Double-sided (DS) silicon IR camera is a new technology that has been developed to overcome the limitations of traditional IR cameras. The main reason for the limited performance of traditional cameras is due to their inability to detect objects on both sides of the sensor simultaneously. This results in an offset image, which reduces sensitivity and accuracy.
Application Insights:
The inspection application segment dominated the global market in terms of revenue share in 2017. The growth can be attributed to the increasing demand for advanced semiconductor products with higher performance and reliability. Silicon wafer dicing is one of the most demanding processes during manufacturing of integrated circuits (IC). To check consistency, alignment and quality of each wafer before it goes into production, various technologies such as silicon IR camera are used.
Inspection using these cameras helps detect issues like misalignment or wrinkles on a layer that has not been seen before due to its hidden position within the IC masking process. These cameras also aid inspection at different stages including pre-production, production and post-production testing phases which aids in catching any issue during manufacturing leading to an improved product yield which eventually boosts industry growth over a period of time.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for advanced technology in this region. In addition, rising number of semiconductor manufacturing companies in countries such as China and India is anticipated to fuel product demand over the next eight years.
The Asia Pacific region accounted for a revenue share of more than 30% in 2017 owing to high production volume of IR cameras used during various stages of wafer fabrication procedure including dicing and backgrinding process. Moreover, presence of key players such as InfraScanner Technologies Pvt Ltd., KLA-Tencor Corporation, PerkinElmer Inc., and Nikon Corporation has established a strong foothold in this region which will further boost industry expansion over the coming years.
North America was one among prominent markets that contributed significantly towards global silicon ir camera market revenue owing to early adoption by major foundry clients across U.S.
Growth Factors:
- Increasing demand for Silicon IR Cameras in security and surveillance applications
- Proliferation of smart devices and the Internet of Things (IoT) is expected to drive the demand for Silicon IR Cameras
- Growing demand from automotive sector for night vision systems in vehicles
- Rising adoption of Silicon IR Cameras in medical applications such as endoscopy and laparoscopy
- Increasing use of Silicon IR Cameras in industrial applications such as quality control, research and development, etc
Scope Of The Report
Report Attributes
Report Details
Report Title
Silicon IR (Infrared) Camera Market Research Report
By Type
Single-sided, Double-sided
By Application
Wafer Dicing, Wafer Backgrinding
By Companies
Furukawa Electric, Nitto, Lintec Corporation, Sumitomo Bakelite, DaehyunST, Mitsui Chemicals, AI Technology, Ultron Systems, Semiconductor Equipment Corporation, Toyo Adtec, Pantech Tape, Nippon Pulse Motor Taiwan, Minitron Electronic, Loadpoint
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
183
Number of Tables & Figures
129
Customization Available
Yes, the report can be customized as per your need.
Global Silicon IR (Infrared) Camera Market Report Segments:
The global Silicon IR (Infrared) Camera market is segmented on the basis of:
Types
Single-sided, Double-sided
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Wafer Dicing, Wafer Backgrinding
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Furukawa Electric
- Nitto
- Lintec Corporation
- Sumitomo Bakelite
- DaehyunST
- Mitsui Chemicals
- AI Technology
- Ultron Systems
- Semiconductor Equipment Corporation
- Toyo Adtec
- Pantech Tape
- Nippon Pulse Motor Taiwan
- Minitron Electronic
- Loadpoint
Highlights of The Silicon IR (Infrared) Camera Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Single-sided
- Double-sided
- By Application:
- Wafer Dicing
- Wafer Backgrinding
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Silicon IR (Infrared) Camera Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A silicon IR camera is a type of camera that uses infrared light to capture images. This type of camera is often used in surveillance applications because it can see through smoke and other obscuring objects.
Some of the major companies in the silicon ir (infrared) camera market are Furukawa Electric, Nitto, Lintec Corporation, Sumitomo Bakelite, DaehyunST, Mitsui Chemicals, AI Technology, Ultron Systems, Semiconductor Equipment Corporation, Toyo Adtec, Pantech Tape, Nippon Pulse Motor Taiwan, Minitron Electronic, Loadpoint.
The silicon ir (infrared) camera market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Silicon IR (Infrared) Camera Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Silicon IR (Infrared) Camera Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Silicon IR (Infrared) Camera Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Silicon IR (Infrared) Camera Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Silicon IR (Infrared) Camera Market Size & Forecast, 2020-2028 4.5.1 Silicon IR (Infrared) Camera Market Size and Y-o-Y Growth 4.5.2 Silicon IR (Infrared) Camera Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Single-sided
5.2.2 Double-sided
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Wafer Dicing
6.2.2 Wafer Backgrinding
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Silicon IR (Infrared) Camera Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Silicon IR (Infrared) Camera Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Single-sided
9.6.2 Double-sided
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Wafer Dicing
9.10.2 Wafer Backgrinding
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Single-sided
10.6.2 Double-sided
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Wafer Dicing
10.10.2 Wafer Backgrinding
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Single-sided
11.6.2 Double-sided
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Wafer Dicing
11.10.2 Wafer Backgrinding
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Single-sided
12.6.2 Double-sided
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Wafer Dicing
12.10.2 Wafer Backgrinding
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Single-sided
13.6.2 Double-sided
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Wafer Dicing
13.10.2 Wafer Backgrinding
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Silicon IR (Infrared) Camera Market: Competitive Dashboard
14.2 Global Silicon IR (Infrared) Camera Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Furukawa Electric
14.3.2 Nitto
14.3.3 Lintec Corporation
14.3.4 Sumitomo Bakelite
14.3.5 DaehyunST
14.3.6 Mitsui Chemicals
14.3.7 AI Technology
14.3.8 Ultron Systems
14.3.9 Semiconductor Equipment Corporation
14.3.10 Toyo Adtec
14.3.11 Pantech Tape
14.3.12 Nippon Pulse Motor Taiwan
14.3.13 Minitron Electronic
14.3.14 Loadpoint