Market Overview:
The global silicon wafer polishing pads market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices and rising investments in the semiconductor industry. In terms of volume, the hard polishing pads segment is expected to dominate the global silicon wafer polishing pads market during the forecast period. This can be attributed to their superior performance as compared to soft polishing pads. In terms of application, 300mm wafers are expected to account for a major share of the global silicon wafer polishing pads market during the forecast period.
Product Definition:
Polishing pads are used to smooth and polish the surface of a silicon wafer. They are typically made from a soft, flexible material such as rubber or foam. Silicon wafer polishing pads are important because they help to ensure that the surface of the wafer is smooth and free from defects. This helps to improve the quality of the finished product.
Hard Polishing Pads:
Hard polishing pads are made of abrasive material and used for final finishing in semiconductor wafers. Silicon Wafer Polishing Pads Market is expected to grow at a significant rate over the forecast period owing to increasing demand from end-use industries such as consumer electronics, solar power generation, communication devices, etc. The growth factor for this market is projected to be high due to growing investments by manufacturers in developing countries such as China and India.
Soft Polishing Pads:
Soft polishing pads are made of special material which is used for polishing wafers in semiconductor industry. These pads are designed to provide maximum comfort and efficiency during the process. The softness of these products allows greater contact between the wafer and the pad, providing a superior finish with reduced risk of damage to components or substrate.
Application Insights:
300mm wafer was the largest application segment in 2017 and is expected to maintain its lead over the forecast period. 300mm silicon wafer polishing pads are widely used in semiconductor manufacturing plants, as they offer higher speed, better surface finish and enhanced productivity. The growing demand for 300mm silicon wafers from various sectors including solar cells & panels, LED lighting, super-hydrophobic coating production is expected to drive growth over the forecast period.
The 200mm silicon wafer segment accounted for a significant market share in terms of revenue generation in 2017 owing to high product adoption across different end-use industries such as electronics & Semiconductors (PCB), medical equipment & devices (MED) and others including automotive touch panels and display drivers. Silicon Wafers come with different types of edges; some have very sharp edges which require special care while using machines or automated systems since scratches can get embedded on them during the polishing process.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for electronic products in countries, such as China and India. In addition, rising investments by semiconductor manufacturers in developing countries of Asia Pacific are anticipated to fuel product demand in this region.
The market for global silicon wafer polishing pads is highly fragmented with a large number of small players across regions. This has led to high competition among regional markets resulting in lower prices and innovation of new products within each region.
Growth Factors:
- Increasing demand for semiconductor devices: The global semiconductor market is expected to grow at a CAGR of 6.5% from 2016 to 2020, reaching a value of USD 333.8 billion by 2020. This is driven by the increasing demand for miniaturized and more powerful electronic devices across all end-use segments.
- Rising technological advancements: Semiconductor manufacturers are constantly striving to develop innovative technologies that can improve the performance and efficiency of their products. This has led to an increase in the adoption of advanced silicon wafer polishing pads among chipmakers worldwide.
- Growing investments in R&D: Chipmakers are investing heavily in R&D activities in order to stay ahead of their competitors and bring new products to market faster than ever before possible .This is resulting in increased demand for silicon wafer polishing pads with better performance characteristics and higher yields.. 4) Emerging markets offer immense potential growth opportunities: The global semiconductor industry is witnessing significant growth momentum from emerging markets such as China, India, Brazil, Mexico, South Korea, and Taiwan .These regions offer immense potential growth opportunities for players operating in the silicon wafer polishing pads market due to rising consumer spending power and rapid industrialization.. 5) Stringent government regulations encouraging use of advanced technologies: Governments across various countries are implementing stringent environmental regulations that encourage the use of advanced technologies such as silicon wafer polishing pads .This is providing a major impetus to the overall
Scope Of The Report
Report Attributes
Report Details
Report Title
Silicon Wafer Polishing Pads Market Research Report
By Type
Hard Polishing Pads, Soft Polishing Pads
By Application
300mm Wafer, 200mm Wafer, Others
By Companies
DuPont, Cabot, FUJIBO, TWI Incorporated, JSR Micro, 3M, FNS TECH, IVT Technologies, SKC
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
205
Number of Tables & Figures
144
Customization Available
Yes, the report can be customized as per your need.
Global Silicon Wafer Polishing Pads Market Report Segments:
The global Silicon Wafer Polishing Pads market is segmented on the basis of:
Types
Hard Polishing Pads, Soft Polishing Pads
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
300mm Wafer, 200mm Wafer, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- DuPont
- Cabot
- FUJIBO
- TWI Incorporated
- JSR Micro
- 3M
- FNS TECH
- IVT Technologies
- SKC
Highlights of The Silicon Wafer Polishing Pads Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Hard Polishing Pads
- Soft Polishing Pads
- By Application:
- 300mm Wafer
- 200mm Wafer
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Silicon Wafer Polishing Pads Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Silicon Wafer Polishing Pads are a type of polishing pad used to remove scratches and other imperfections from silicon wafers.
Some of the major players in the silicon wafer polishing pads market are DuPont, Cabot, FUJIBO, TWI Incorporated, JSR Micro, 3M, FNS TECH, IVT Technologies, SKC.
The silicon wafer polishing pads market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Silicon Wafer Polishing Pads Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Silicon Wafer Polishing Pads Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Silicon Wafer Polishing Pads Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Silicon Wafer Polishing Pads Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Silicon Wafer Polishing Pads Market Size & Forecast, 2020-2028
4.5.1 Silicon Wafer Polishing Pads Market Size and Y-o-Y Growth
4.5.2 Silicon Wafer Polishing Pads Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Hard Polishing Pads
5.2.2 Soft Polishing Pads
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 300mm Wafer
6.2.2 200mm Wafer
6.2.3 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Silicon Wafer Polishing Pads Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Silicon Wafer Polishing Pads Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Hard Polishing Pads
9.6.2 Soft Polishing Pads
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 300mm Wafer
9.10.2 200mm Wafer
9.10.3 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Hard Polishing Pads
10.6.2 Soft Polishing Pads
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 300mm Wafer
10.10.2 200mm Wafer
10.10.3 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Hard Polishing Pads
11.6.2 Soft Polishing Pads
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 300mm Wafer
11.10.2 200mm Wafer
11.10.3 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Hard Polishing Pads
12.6.2 Soft Polishing Pads
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 300mm Wafer
12.10.2 200mm Wafer
12.10.3 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Hard Polishing Pads
13.6.2 Soft Polishing Pads
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 300mm Wafer
13.10.2 200mm Wafer
13.10.3 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Silicon Wafer Polishing Pads Market: Competitive Dashboard
14.2 Global Silicon Wafer Polishing Pads Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 DuPont
14.3.2 Cabot
14.3.3 FUJIBO
14.3.4 TWI Incorporated
14.3.5 JSR Micro
14.3.6 3M
14.3.7 FNS TECH
14.3.8 IVT Technologies
14.3.9 SKC
