Market Overview:
The global silver powder for electronic components market is expected to grow at a CAGR of 5.8% during the forecast period from 2018 to 2030. The market is segmented on the basis of type, application and region. On the basis of type, the market is segmented into superfine silver powder, flake silver powder and spherical silver powder. Superfine silver powders are used in high-end applications such as circuit conductors, capacitors and bonding materials among others. Flake Silver Powders are used in low-end applications such as films and semiconductor ceramics among others while spherical powders are used in displays and other applications where uniformity is required. By application, the market is divided into circuit conductors, capacitors, bonding materials, displays semiconductor ceramics films ohters). Circuit conductors held a major share of the global market in 2017 owing to their widespread use across various industries such as automotive electronics consumer electronics telecom & IT etc.). The demand for capacitors is also expected to increase significantly during the forecast period owing to increasing demand from sectors such as renewable energy storage medical devices etc.). Bonding materials held a significant share of the overall market in 2017 due its use across various end-use industries (such as automotive aerospace defense marine infrastructure etc.
Product Definition:
Silver powder is a very fine powder that is made up of tiny silver particles. It is used in electronic components to prevent corrosion and to improve electrical conductivity.
Superfine Silver Powder:
Superfine silver powder is a new generation of the traditional fine silver powder. It has better flow characteristics and high surface area as compared to traditional fine silver powders. The super-small particle size of this product offers unique properties such as high electrical conductivity, corrosion resistance, and antibacterial activity. These products are used in applications where small particle size is an advantage including medical devices & implants, cosmetics & personal care products, food processing equipment and others (paints & coatings).
Flake Silver Powder:
Flake silver powder is a type of plating solution that contains soluble salts of silver. It is also known as liquid Silver or Arsenic Gold. The major difference between the two being that flakes are solid and liquid, whereas solids contain needles or grains which can be applied to various surfaces by the sputtering device.
The major advantage associated with this product over conventional solutions such as electroplating, etc.
Application Insights:
Circuit conductors held the largest market share of more than 40% in 2017. The product is used to manufacture high-density and high-temperature circuit boards. It has excellent electrical properties, such as low resistivity and good thermal management, which ensure its application in various electronic products over the coming years.
The displays segment is expected to expand at a CAGR of XX% from 2018 to 2030 owing to increasing demand for silve powder for manufacturing color TVs and LCDs. In addition, growing use of OLED displays will fuel industry expansion over the forecast period due to rising demand for flat panel televisions across various regions including Asia Pacific, Latin America and North America.
Semiconductor ceramics are manufactured using a process called sintering which involves melting together ceramic powders with metals like aluminum or steel at elevated temperatures under pressure conditions (above 800°C).
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to rising product demand from key application sectors including electronics, automotive, healthcare & medical, renewable energy and others. China is one of the largest producers as well as consumers of silve powder products in this region owing to easy availability of raw materials at low cost coupled with high population density.
The Asia Pacific regional market was followed by Europe which accounted for a share of more than 20% in terms of revenue in 2017 owing to growing product demand from several major end-use industries such as aerospace & defense, renewable energy etc. In addition, presence or development plans for new greenfield plants by some prominent players are projected to boost regional growth over the forecast period.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand for high-performance and energy-efficient electronic components
- Proliferation of next-generation technologies, such as 5G, IoT, and artificial intelligence
- Growing adoption of silver powder in automotive electronics industry
- Increasing investments in research and development to develop new applications for silver powder
Scope Of The Report
Report Attributes
Report Details
Report Title
Silve Powder for Electronic Components Market Research Report
By Type
Superfine Silver Powder, Flake Silver Powder, Spherical Silver Powder
By Application
Circuit Conductors, Capacitors, Bonding Materials, Displays, Semiconductor Ceramics, Films, Ohters
By Companies
Dowa, Ames Goldsmith, Pometon, Kaken Tech, Fukuda Metal Foil & Powder, Toyo Chemical, Heraeus, Daiken Chemical, Daejoo Electronic Materials, AG PRO Technology, Guangdong Lingguang New Material, Hongwu International, Makin Metal Powders, Fushel
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
154
Number of Tables & Figures
108
Customization Available
Yes, the report can be customized as per your need.
Global Silve Powder for Electronic Components Market Report Segments:
The global Silve Powder for Electronic Components market is segmented on the basis of:
Types
Superfine Silver Powder, Flake Silver Powder, Spherical Silver Powder
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Circuit Conductors, Capacitors, Bonding Materials, Displays, Semiconductor Ceramics, Films, Ohters
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Dowa
- Ames Goldsmith
- Pometon
- Kaken Tech
- Fukuda Metal Foil & Powder
- Toyo Chemical
- Heraeus
- Daiken Chemical
- Daejoo Electronic Materials
- AG PRO Technology
- Guangdong Lingguang New Material
- Hongwu International
- Makin Metal Powders
- Fushel
Highlights of The Silve Powder for Electronic Components Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Superfine Silver Powder
- Flake Silver Powder
- Spherical Silver Powder
- By Application:
- Circuit Conductors
- Capacitors
- Bonding Materials
- Displays
- Semiconductor Ceramics
- Films
- Ohters
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Silve Powder for Electronic Components Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Silve powder is a type of electronic component that is used in semiconductor devices. It helps to improve the performance of these devices by providing a layer of insulation between the device's components.
Some of the major players in the silve powder for electronic components market are Dowa, Ames Goldsmith, Pometon, Kaken Tech, Fukuda Metal Foil & Powder, Toyo Chemical, Heraeus, Daiken Chemical, Daejoo Electronic Materials, AG PRO Technology, Guangdong Lingguang New Material, Hongwu International, Makin Metal Powders, Fushel.
The silve powder for electronic components market is expected to grow at a compound annual growth rate of 5.8%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Silve Powder for Electronic Components Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Silve Powder for Electronic Components Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Silve Powder for Electronic Components Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Silve Powder for Electronic Components Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Silve Powder for Electronic Components Market Size & Forecast, 2018-2028
4.5.1 Silve Powder for Electronic Components Market Size and Y-o-Y Growth
4.5.2 Silve Powder for Electronic Components Market Absolute $ Opportunity
Chapter 5 Global Silve Powder for Electronic Components Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Silve Powder for Electronic Components Market Size Forecast by Type
5.2.1 Superfine Silver Powder
5.2.2 Flake Silver Powder
5.2.3 Spherical Silver Powder
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Silve Powder for Electronic Components Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Silve Powder for Electronic Components Market Size Forecast by Applications
6.2.1 Circuit Conductors
6.2.2 Capacitors
6.2.3 Bonding Materials
6.2.4 Displays
6.2.5 Semiconductor Ceramics
6.2.6 Films
6.2.7 Ohters
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Silve Powder for Electronic Components Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Silve Powder for Electronic Components Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Silve Powder for Electronic Components Analysis and Forecast
9.1 Introduction
9.2 North America Silve Powder for Electronic Components Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Silve Powder for Electronic Components Market Size Forecast by Type
9.6.1 Superfine Silver Powder
9.6.2 Flake Silver Powder
9.6.3 Spherical Silver Powder
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Silve Powder for Electronic Components Market Size Forecast by Applications
9.10.1 Circuit Conductors
9.10.2 Capacitors
9.10.3 Bonding Materials
9.10.4 Displays
9.10.5 Semiconductor Ceramics
9.10.6 Films
9.10.7 Ohters
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Silve Powder for Electronic Components Analysis and Forecast
10.1 Introduction
10.2 Europe Silve Powder for Electronic Components Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Silve Powder for Electronic Components Market Size Forecast by Type
10.6.1 Superfine Silver Powder
10.6.2 Flake Silver Powder
10.6.3 Spherical Silver Powder
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Silve Powder for Electronic Components Market Size Forecast by Applications
10.10.1 Circuit Conductors
10.10.2 Capacitors
10.10.3 Bonding Materials
10.10.4 Displays
10.10.5 Semiconductor Ceramics
10.10.6 Films
10.10.7 Ohters
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Silve Powder for Electronic Components Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Silve Powder for Electronic Components Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Silve Powder for Electronic Components Market Size Forecast by Type
11.6.1 Superfine Silver Powder
11.6.2 Flake Silver Powder
11.6.3 Spherical Silver Powder
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Silve Powder for Electronic Components Market Size Forecast by Applications
11.10.1 Circuit Conductors
11.10.2 Capacitors
11.10.3 Bonding Materials
11.10.4 Displays
11.10.5 Semiconductor Ceramics
11.10.6 Films
11.10.7 Ohters
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Silve Powder for Electronic Components Analysis and Forecast
12.1 Introduction
12.2 Latin America Silve Powder for Electronic Components Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Silve Powder for Electronic Components Market Size Forecast by Type
12.6.1 Superfine Silver Powder
12.6.2 Flake Silver Powder
12.6.3 Spherical Silver Powder
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Silve Powder for Electronic Components Market Size Forecast by Applications
12.10.1 Circuit Conductors
12.10.2 Capacitors
12.10.3 Bonding Materials
12.10.4 Displays
12.10.5 Semiconductor Ceramics
12.10.6 Films
12.10.7 Ohters
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Silve Powder for Electronic Components Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Silve Powder for Electronic Components Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Silve Powder for Electronic Components Market Size Forecast by Type
13.6.1 Superfine Silver Powder
13.6.2 Flake Silver Powder
13.6.3 Spherical Silver Powder
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Silve Powder for Electronic Components Market Size Forecast by Applications
13.10.1 Circuit Conductors
13.10.2 Capacitors
13.10.3 Bonding Materials
13.10.4 Displays
13.10.5 Semiconductor Ceramics
13.10.6 Films
13.10.7 Ohters
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Silve Powder for Electronic Components Market: Competitive Dashboard
14.2 Global Silve Powder for Electronic Components Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Dowa
14.3.2 Ames Goldsmith
14.3.3 Pometon
14.3.4 Kaken Tech
14.3.5 Fukuda Metal Foil & Powder
14.3.6 Toyo Chemical
14.3.7 Heraeus
14.3.8 Daiken Chemical
14.3.9 Daejoo Electronic Materials
14.3.10 AG PRO Technology
14.3.11 Guangdong Lingguang New Material
14.3.12 Hongwu International
14.3.13 Makin Metal Powders
14.3.14 Fushel
