Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Single Wafer Cleaning Equipment Market by Type (Wafer Size 50mm-200mm, Wafer Size 300mm, Others), By Application (MEMS, CIS, Memory, RF devices, LED, Logic, Others) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Single Wafer Cleaning Equipment Market by Type (Wafer Size 50mm-200mm, Wafer Size 300mm, Others), By Application (MEMS, CIS, Memory, RF devices, LED, Logic, Others) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 351420 4200 Machinery & Equipment 377 243 Pages 4.8 (49)
                                          

Market Overview:


The global single wafer cleaning equipment market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductor devices and rising investments in the semiconductor industry. The market is segmented on the basis of type, application, and region. On the basis of type, the market is segmented into wafer size 50mm-200mm, Wafer size 300mm, and others. Wafer size 50mm-200mm held a major share of the global single wafer cleaning equipment market in 2017 and is expected to continue its dominance during the forecast period owing to its low cost as compared to other types of wafers.


Global Single Wafer Cleaning Equipment Industry Outlook


Product Definition:


Single Wafer Cleaning Equipment is used to clean the surface of a single wafer. This is important because it ensures that the wafer is clean and free of contaminants before it is subjected to further processing.


Wafer Size 50mm-200mm:


Wafer size 50mm-200mm is a term used for the dimension of wafers in single wafer cleaning equipment. It’s basically used to differentiate between two different types of products, i.e., Wafer Size 100mm and 200mm Cleaning System (CSE). The growth factor in this market largely depends on the demand from semiconductor industry for manufacturing integrated circuits (IC) chips.


Wafer Size 300mm:


Wafer size 300mm is a wafer thin slice of silicon. It has a diameter of about 0.3 mm and thickness less than the width of a human hair.


Application Insights:


The market is segmented by application into MEMS, CIS, memory, RF devices, LED/logic and other applications. The MEMS application segment dominated the global single wafer cleaning equipment market in 2017 owing to the high demand for small electronic devices. Single-layer integrated circuits (ICs) and multi-layer integrated circuits (ICs) are made using silicon wafers that range in size 50mm to 200mm. These semiconductor components are then used in a wide variety of end products such as mobile phones and computers among others.


Regional Analysis:


Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for electronic products in countries, such as China and India. In addition, rising investments by various governments in developing manufacturing facilities are anticipated to fuel industry expansion over the next eight years.


The presence of a large number of semiconductor manufacturers has resulted in high product demand across North America as well as Europe regions. However, slow growth rates observed during 2016 and 2017 on account of economic uncertainties have hampered market development across these regions; however, they are expected to recover soon on account of steady economic conditions leading towards higher spending capabilities among end users/buyers.


Growth Factors:


  • Increasing demand for semiconductor devices and integrated circuits
  • Growing number of fabs and wafer cleaning requirements for advanced packaging processes
  • Proliferation of 3D NAND flash memory technology
  • Rising demand from the LED market
  • Emergence of new applications such as MEMS, power electronics, and photovoltaics

Scope Of The Report

Report Attributes

Report Details

Report Title

Single Wafer Cleaning Equipment Market Research Report

By Type

Wafer Size 50mm-200mm, Wafer Size 300mm, Others

By Application

MEMS, CIS, Memory, RF devices, LED, Logic, Others

By Companies

SEMES, SCREEN Semiconductor Solutions, Tokyo Electron Limited, Shibaura Mechatronics Corp, Naura, ANO-MASTER, INC., Tazmo, KED Tech, ACM Research, Inc, Lam Research

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

243

Number of Tables & Figures

171

Customization Available

Yes, the report can be customized as per your need.


Global Single Wafer Cleaning Equipment Market Report Segments:

The global Single Wafer Cleaning Equipment market is segmented on the basis of:

Types

Wafer Size 50mm-200mm, Wafer Size 300mm, Others

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

MEMS, CIS, Memory, RF devices, LED, Logic, Others

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. SEMES
  2. SCREEN Semiconductor Solutions
  3. Tokyo Electron Limited
  4. Shibaura Mechatronics Corp
  5. Naura
  6. ANO-MASTER, INC.
  7. Tazmo
  8. KED Tech
  9. ACM Research, Inc
  10. Lam Research

Global Single Wafer Cleaning Equipment Market Overview


Highlights of The Single Wafer Cleaning Equipment Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. Wafer Size 50mm-200mm
    2. Wafer Size 300mm
    3. Others
  1. By Application:

    1. MEMS
    2. CIS
    3. Memory
    4. RF devices
    5. LED
    6. Logic
    7. Others
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Single Wafer Cleaning Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

How you may use our products:

  • Correctly Positioning New Products
  • Market Entry Strategies
  • Business Expansion Strategies
  • Consumer Insights
  • Understanding Competition Scenario
  • Product & Brand Management
  • Channel & Customer Management
  • Identifying Appropriate Advertising Appeals

Global Single Wafer Cleaning Equipment Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


Single wafer cleaning equipment is a specialized piece of equipment used to clean semiconductor devices, such as chips, using a single wafer at a time.

Some of the key players operating in the single wafer cleaning equipment market are SEMES, SCREEN Semiconductor Solutions, Tokyo Electron Limited, Shibaura Mechatronics Corp, Naura, ANO-MASTER, INC., Tazmo, KED Tech, ACM Research, Inc, Lam Research.

The single wafer cleaning equipment market is expected to grow at a compound annual growth rate of 6.5%.

                                            
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Single Wafer Cleaning Equipment Market Overview    4.1 Introduction       4.1.1 Market Taxonomy       4.1.2 Market Definition       4.1.3 Macro-Economic Factors Impacting the Market Growth    4.2 Single Wafer Cleaning Equipment Market Dynamics       4.2.1 Market Drivers       4.2.2 Market Restraints       4.2.3 Market Opportunity    4.3 Single Wafer Cleaning Equipment Market - Supply Chain Analysis       4.3.1 List of Key Suppliers       4.3.2 List of Key Distributors       4.3.3 List of Key Consumers    4.4 Key Forces Shaping the Single Wafer Cleaning Equipment Market       4.4.1 Bargaining Power of Suppliers       4.4.2 Bargaining Power of Buyers       4.4.3 Threat of Substitution       4.4.4 Threat of New Entrants       4.4.5 Competitive Rivalry    4.5 Global Single Wafer Cleaning Equipment Market Size & Forecast, 2020-2028       4.5.1 Single Wafer Cleaning Equipment Market Size and Y-o-Y Growth       4.5.2 Single Wafer Cleaning Equipment Market Absolute $ Opportunity

Chapter 5 Global  Market Analysis and Forecast by Type
   5.1 Introduction
      5.1.1 Key Market Trends & Growth Opportunities by Type
      5.1.2 Basis Point Share (BPS) Analysis by Type
      5.1.3 Absolute $ Opportunity Assessment by Type
   5.2  Market Size Forecast by Type
      5.2.1 Wafer Size 50mm-200mm
      5.2.2 Wafer Size 300mm
      5.2.3 Others
   5.3 Market Attractiveness Analysis by Type

Chapter 6 Global  Market Analysis and Forecast by Applications
   6.1 Introduction
      6.1.1 Key Market Trends & Growth Opportunities by Applications
      6.1.2 Basis Point Share (BPS) Analysis by Applications
      6.1.3 Absolute $ Opportunity Assessment by Applications
   6.2  Market Size Forecast by Applications
      6.2.1 MEMS
      6.2.2 CIS
      6.2.3 Memory
      6.2.4 RF devices
      6.2.5 LED
      6.2.6 Logic
      6.2.7 Others
   6.3 Market Attractiveness Analysis by Applications

Chapter 7 Global Single Wafer Cleaning Equipment Market Analysis and Forecast by Region
   7.1 Introduction
      7.1.1 Key Market Trends & Growth Opportunities by Region
      7.1.2 Basis Point Share (BPS) Analysis by Region
      7.1.3 Absolute $ Opportunity Assessment by Region
   7.2 Single Wafer Cleaning Equipment Market Size Forecast by Region
      7.2.1 North America
      7.2.2 Europe
      7.2.3 Asia Pacific
      7.2.4 Latin America
      7.2.5 Middle East & Africa (MEA)
   7.3 Market Attractiveness Analysis by Region

Chapter 8 Coronavirus Disease (COVID-19) Impact 
   8.1 Introduction 
   8.2 Current & Future Impact Analysis 
   8.3 Economic Impact Analysis 
   8.4 Government Policies 
   8.5 Investment Scenario

Chapter 9 North America  Analysis and Forecast
   9.1 Introduction
   9.2 North America  Market Size Forecast by Country
      9.2.1 U.S.
      9.2.2 Canada
   9.3 Basis Point Share (BPS) Analysis by Country
   9.4 Absolute $ Opportunity Assessment by Country
   9.5 Market Attractiveness Analysis by Country
   9.6 North America  Market Size Forecast by Type
      9.6.1 Wafer Size 50mm-200mm
      9.6.2 Wafer Size 300mm
      9.6.3 Others
   9.7 Basis Point Share (BPS) Analysis by Type 
   9.8 Absolute $ Opportunity Assessment by Type 
   9.9 Market Attractiveness Analysis by Type
   9.10 North America  Market Size Forecast by Applications
      9.10.1 MEMS
      9.10.2 CIS
      9.10.3 Memory
      9.10.4 RF devices
      9.10.5 LED
      9.10.6 Logic
      9.10.7 Others
   9.11 Basis Point Share (BPS) Analysis by Applications 
   9.12 Absolute $ Opportunity Assessment by Applications 
   9.13 Market Attractiveness Analysis by Applications

Chapter 10 Europe  Analysis and Forecast
   10.1 Introduction
   10.2 Europe  Market Size Forecast by Country
      10.2.1 Germany
      10.2.2 France
      10.2.3 Italy
      10.2.4 U.K.
      10.2.5 Spain
      10.2.6 Russia
      10.2.7 Rest of Europe
   10.3 Basis Point Share (BPS) Analysis by Country
   10.4 Absolute $ Opportunity Assessment by Country
   10.5 Market Attractiveness Analysis by Country
   10.6 Europe  Market Size Forecast by Type
      10.6.1 Wafer Size 50mm-200mm
      10.6.2 Wafer Size 300mm
      10.6.3 Others
   10.7 Basis Point Share (BPS) Analysis by Type 
   10.8 Absolute $ Opportunity Assessment by Type 
   10.9 Market Attractiveness Analysis by Type
   10.10 Europe  Market Size Forecast by Applications
      10.10.1 MEMS
      10.10.2 CIS
      10.10.3 Memory
      10.10.4 RF devices
      10.10.5 LED
      10.10.6 Logic
      10.10.7 Others
   10.11 Basis Point Share (BPS) Analysis by Applications 
   10.12 Absolute $ Opportunity Assessment by Applications 
   10.13 Market Attractiveness Analysis by Applications

Chapter 11 Asia Pacific  Analysis and Forecast
   11.1 Introduction
   11.2 Asia Pacific  Market Size Forecast by Country
      11.2.1 China
      11.2.2 Japan
      11.2.3 South Korea
      11.2.4 India
      11.2.5 Australia
      11.2.6 South East Asia (SEA)
      11.2.7 Rest of Asia Pacific (APAC)
   11.3 Basis Point Share (BPS) Analysis by Country
   11.4 Absolute $ Opportunity Assessment by Country
   11.5 Market Attractiveness Analysis by Country
   11.6 Asia Pacific  Market Size Forecast by Type
      11.6.1 Wafer Size 50mm-200mm
      11.6.2 Wafer Size 300mm
      11.6.3 Others
   11.7 Basis Point Share (BPS) Analysis by Type 
   11.8 Absolute $ Opportunity Assessment by Type 
   11.9 Market Attractiveness Analysis by Type
   11.10 Asia Pacific  Market Size Forecast by Applications
      11.10.1 MEMS
      11.10.2 CIS
      11.10.3 Memory
      11.10.4 RF devices
      11.10.5 LED
      11.10.6 Logic
      11.10.7 Others
   11.11 Basis Point Share (BPS) Analysis by Applications 
   11.12 Absolute $ Opportunity Assessment by Applications 
   11.13 Market Attractiveness Analysis by Applications

Chapter 12 Latin America  Analysis and Forecast
   12.1 Introduction
   12.2 Latin America  Market Size Forecast by Country
      12.2.1 Brazil
      12.2.2 Mexico
      12.2.3 Rest of Latin America (LATAM)
   12.3 Basis Point Share (BPS) Analysis by Country
   12.4 Absolute $ Opportunity Assessment by Country
   12.5 Market Attractiveness Analysis by Country
   12.6 Latin America  Market Size Forecast by Type
      12.6.1 Wafer Size 50mm-200mm
      12.6.2 Wafer Size 300mm
      12.6.3 Others
   12.7 Basis Point Share (BPS) Analysis by Type 
   12.8 Absolute $ Opportunity Assessment by Type 
   12.9 Market Attractiveness Analysis by Type
   12.10 Latin America  Market Size Forecast by Applications
      12.10.1 MEMS
      12.10.2 CIS
      12.10.3 Memory
      12.10.4 RF devices
      12.10.5 LED
      12.10.6 Logic
      12.10.7 Others
   12.11 Basis Point Share (BPS) Analysis by Applications 
   12.12 Absolute $ Opportunity Assessment by Applications 
   12.13 Market Attractiveness Analysis by Applications

Chapter 13 Middle East & Africa (MEA)  Analysis and Forecast
   13.1 Introduction
   13.2 Middle East & Africa (MEA)  Market Size Forecast by Country
      13.2.1 Saudi Arabia
      13.2.2 South Africa
      13.2.3 UAE
      13.2.4 Rest of Middle East & Africa (MEA)
   13.3 Basis Point Share (BPS) Analysis by Country
   13.4 Absolute $ Opportunity Assessment by Country
   13.5 Market Attractiveness Analysis by Country
   13.6 Middle East & Africa (MEA)  Market Size Forecast by Type
      13.6.1 Wafer Size 50mm-200mm
      13.6.2 Wafer Size 300mm
      13.6.3 Others
   13.7 Basis Point Share (BPS) Analysis by Type 
   13.8 Absolute $ Opportunity Assessment by Type 
   13.9 Market Attractiveness Analysis by Type
   13.10 Middle East & Africa (MEA)  Market Size Forecast by Applications
      13.10.1 MEMS
      13.10.2 CIS
      13.10.3 Memory
      13.10.4 RF devices
      13.10.5 LED
      13.10.6 Logic
      13.10.7 Others
   13.11 Basis Point Share (BPS) Analysis by Applications 
   13.12 Absolute $ Opportunity Assessment by Applications 
   13.13 Market Attractiveness Analysis by Applications

Chapter 14 Competition Landscape 
   14.1 Single Wafer Cleaning Equipment Market: Competitive Dashboard
   14.2 Global Single Wafer Cleaning Equipment Market: Market Share Analysis, 2019
   14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.3.1 SEMES
      14.3.2 SCREEN Semiconductor Solutions
      14.3.3 Tokyo Electron Limited
      14.3.4 Shibaura Mechatronics Corp
      14.3.5 Naura
      14.3.6 ANO-MASTER, INC.
      14.3.7 Tazmo
      14.3.8 KED Tech
      14.3.9 ACM Research, Inc
      14.3.10 Lam Research

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