Market Overview:
The global sintering paste market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for high-performance electronic devices, rising demand for semiconductor devices, and growing adoption of LED lighting. In terms of type, the pressure-less sintering segment is expected to grow at a higher CAGR than the pressure sintering segment during the forecast period. This growth can be attributed to factors such as lower manufacturing cost and shorter processing time associated with pressure-less sintering as compared with pressure sintering.
Product Definition:
Sintering Paste is a type of thermal paste that is used to fill the air gaps between the CPU and heatsink. By doing so, it allows for better heat conduction and ultimately helps to achieve a lower CPU temperature.
Pressure Sintering:
Pressure sintering is a method of joining two or more materials together by the application of high pressure. The technique is used in various end-use industries such as automotive, construction, electrical & electronics and packaging. In the past few years, this technique has been increasingly used to manufacture ceramic parts for electronic devices including sensors and microchips owing to its characteristics such as low thermal expansion coefficient and high compressive strength among others.
Pressure-less Sintering:
Pressure-less sintering is a new technology that helps in producing high quality and strong parts with reduced labor cost. It uses tungsten or molybdenum powder as a substitute for pressure, which enables the part to be formed under the influence of heat without any external pressure. The process has applications in various end-use industries such as automotive, construction equipment, heavy machinery and electronics among others.
Application Insights:
Power semiconductor device application segment accounted for the largest revenue share in 2017 and is projected to continue its dominance over the forecast period. The product has numerous applications in power devices, such as transformers, inductors, capacitors and other components used in various end-use industries including automotive, medical equipment and consumer electronics.
The RF power device application segment is also expected to witness significant growth during the forecast period owing to increasing demand from wireless communication industry for this type of component. The product sintering process helps reduce non-metallic impurities present in ceramic materials that are used in these types of components resulting into high performance products with low levels of residual elements after sintering process which will drive its demand further.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market with a CAGR of XX% from 2018 to 2030 owing to rapid industrialization and increasing demand for electronics in China, India, Japan, South Korea and Taiwan. The region is also anticipated to witness high growth in power semiconductor devices due to rising electricity consumption coupled with growing population in countries such as China and India.
Europe accounted for over 25% of the global share by revenue in 2017 on account of presence of major players such as BASF SE; Bayer AG; Henkel AG & Co.; Sandvik AB; Stryker Corporation; Volkswagen Group Aktiengesellschaft (VAG) along with well-established automotive industry that caters almost every household across the region. Europe has been at forefront when it comes time for technological advancements especially within SIPs industry space which will bode well for regional growth over next eight years or so.
Growth Factors:
- Increasing demand for sintering paste from the automotive and aerospace industries due to the growing need for lightweight and durable components.
- Rising demand for sintering paste from the medical device industry due to its ability to produce high-quality medical implants with low porosity.
- Growing popularity of 3D printing technology, which requires sintering paste as a key component, is expected to drive market growth in the coming years.
- Rapid expansion of electronics manufacturing sector in Asia Pacific is anticipated to create lucrative opportunities for players operating in this region’s Sintering Paste market over the next few years.
Scope Of The Report
Report Attributes
Report Details
Report Title
Sintering Paste Market Research Report
By Type
Pressure Sintering, Pressure-less Sintering
By Application
Power Semiconductor Device, RF Power Device, High Performance LED, Other
By Companies
Heraeus, Kyocera, Indium, Alpha Assembly Solutions, Henkel, Namics, Advanced Joining Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
161
Number of Tables & Figures
113
Customization Available
Yes, the report can be customized as per your need.
Global Sintering Paste Market Report Segments:
The global Sintering Paste market is segmented on the basis of:
Types
Pressure Sintering, Pressure-less Sintering
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Power Semiconductor Device, RF Power Device, High Performance LED, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Heraeus
- Kyocera
- Indium
- Alpha Assembly Solutions
- Henkel
- Namics
- Advanced Joining Technology
Highlights of The Sintering Paste Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Pressure Sintering
- Pressure-less Sintering
- By Application:
- Power Semiconductor Device
- RF Power Device
- High Performance LED
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Sintering Paste Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Sintering paste is a type of adhesive that is used to join two or more pieces of metal together. It is made up of a powder mixture that is mixed with water and then applied to the metal surfaces. The paste will heat up as it comes in contact with the metal, causing it to fuse together.
Some of the major companies in the sintering paste market are Heraeus, Kyocera, Indium, Alpha Assembly Solutions, Henkel, Namics, Advanced Joining Technology.
The sintering paste market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Sintering Paste Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Sintering Paste Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Sintering Paste Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Sintering Paste Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Sintering Paste Market Size & Forecast, 2020-2028
4.5.1 Sintering Paste Market Size and Y-o-Y Growth
4.5.2 Sintering Paste Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Pressure Sintering
5.2.2 Pressure-less Sintering
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Power Semiconductor Device
6.2.2 RF Power Device
6.2.3 High Performance LED
6.2.4 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Sintering Paste Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Sintering Paste Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Pressure Sintering
9.6.2 Pressure-less Sintering
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Power Semiconductor Device
9.10.2 RF Power Device
9.10.3 High Performance LED
9.10.4 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Pressure Sintering
10.6.2 Pressure-less Sintering
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Power Semiconductor Device
10.10.2 RF Power Device
10.10.3 High Performance LED
10.10.4 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Pressure Sintering
11.6.2 Pressure-less Sintering
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Power Semiconductor Device
11.10.2 RF Power Device
11.10.3 High Performance LED
11.10.4 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Pressure Sintering
12.6.2 Pressure-less Sintering
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Power Semiconductor Device
12.10.2 RF Power Device
12.10.3 High Performance LED
12.10.4 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Pressure Sintering
13.6.2 Pressure-less Sintering
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Power Semiconductor Device
13.10.2 RF Power Device
13.10.3 High Performance LED
13.10.4 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Sintering Paste Market: Competitive Dashboard
14.2 Global Sintering Paste Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Heraeus
14.3.2 Kyocera
14.3.3 Indium
14.3.4 Alpha Assembly Solutions
14.3.5 Henkel
14.3.6 Namics
14.3.7 Advanced Joining Technology
