Market Overview:
The global solder mask ink market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth of the solder mask ink market can be attributed to the increasing demand for miniaturization and higher density in electronic devices, and the growing trend of using lead-free solders. In addition, the increasing demand for advanced packaging solutions is also contributing to the growth of the solder mask ink market. The photoimageable solder mask ink segment is expected to dominate the global solder mask ink market during the forecast period. This segment is projected to grow at a CAGR of 6% from 2018 to 2030.
Product Definition:
Solder Mask Ink is a special ink that is used in the manufacturing of printed circuit boards. It is used to protect the copper traces on the board from oxidation and corrosion.
Photoimageable Solder Mask Ink:
The photoimageable solder mask ink is a special type of inks that can be used on the PCB surface while soldering. The property of this ink allows the image to be seen through it even when it is not connected to a camera and there is no light source. This makes it an ideal product for creating prototypes with printed circuit boards (PCB). It also has applications in repairing electronic devices as well as assembling new ones, which are why manufacturers prefer this product over traditional methods.
UV Curable Solder Mask Ink:
UV curable solder mask ink is a type of printing inks which can be cured by Ultraviolet (UV) light. The typical applications of UV curable solder mask ink include PCB laminating, component laminating and others. It has various advantages over conventional methods such as it provides high-quality images and also enables low operating costs with minimum environmental impact.
Application Insights:
The global solder mask ink market is segmented on the basis of application into computers, communications, consumer electronics, industrial and other applications. The computer application segment accounted for a major share in 2017 owing to the rising demand for high-tech products across the globe. Moreover, rapid urbanization coupled with increasing disposable income has led to an increase in demand for computers and related equipment in developing countries such as India and China. This factor is expected to drive growth over the forecast period.
The IC packaging segment is projected to witness significant growth over the forecast period due to extensive use of components with integrated circuits that have become increasingly smaller through miniaturization techniques known as micro-electromechanical systems (MEMS). These MEMS devices are packaged using various types of materials including plastic and epoxy which require different types of masks during assembly operations. Thus, growing preference for micromechanical devices along with increasing product complexity requiring more complex processes will boost industry growth over the coming years.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to rapid industrialization, presence of numerous electronics manufacturing companies in China and Taiwan, high population growth, and low labor cost. Moreover, increasing demand for consumer electronics such as smartphones and laptops has led to an increase in IC packaging activities which will drive the regional market further.
The Asia Pacific region is also home to several small-scale manufacturers who adhere strictly to traditional methods of production coupled with low investment levels pertaining their product launches into mass markets; hence driving revenue generation from soldering equipment sales rather than mask ink sales thereby reducing overall industry size. However, recent developments have been witnessed wherein some Asian countries are coming close on par with international standards by offering excellent quality products at competitive prices thus making them a preferred destination for many OEMs across industries including computing & mobile phones & communication equipment manufacturing sectors worldwide thus positively impacting overall industry size over next few years.
Growth Factors:
- Increasing demand from the electronics and semiconductor industry for solder mask ink
- Rising demand for miniaturization in electronic devices
- Growing popularity of printed circuit boards (PCBs)
- Proliferation of 3D printing technology
- Increasing use of lead-free solder
Scope Of The Report
Report Attributes
Report Details
Report Title
Solder Mask Ink Market Research Report
By Type
Photoimageable Solder Mask Ink, UV Curable Solder Mask Ink, Thermal Curable Solder Mask Ink
By Application
Computers, Communications, Consumer Electronics, IC Packaging, Others
By Companies
TAIYO, OTC, Jiangsu Kuangshun, Shenzhen Rongda, HUNTSMAN, TAMURA, SAN-EI Kagaku, Coants Electronic, Greencure Technology, Hitachi Chemical, Lanbang Electronic Hardware Materials, Greentop Technology, Seoul Chemical Research Laboratory, Donghua Electronics Technology, Jiangmen ABQ Electronic Material
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
179
Number of Tables & Figures
126
Customization Available
Yes, the report can be customized as per your need.
Global Solder Mask Ink Market Report Segments:
The global Solder Mask Ink market is segmented on the basis of:
Types
Photoimageable Solder Mask Ink, UV Curable Solder Mask Ink, Thermal Curable Solder Mask Ink
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Computers, Communications, Consumer Electronics, IC Packaging, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- TAIYO
- OTC
- Jiangsu Kuangshun
- Shenzhen Rongda
- HUNTSMAN
- TAMURA
- SAN-EI Kagaku
- Coants Electronic
- Greencure Technology
- Hitachi Chemical
- Lanbang Electronic Hardware Materials
- Greentop Technology
- Seoul Chemical Research Laboratory
- Donghua Electronics Technology
- Jiangmen ABQ Electronic Material
Highlights of The Solder Mask Ink Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Photoimageable Solder Mask Ink
- UV Curable Solder Mask Ink
- Thermal Curable Solder Mask Ink
- By Application:
- Computers
- Communications
- Consumer Electronics
- IC Packaging
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Solder Mask Ink Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Solder Mask Ink is a type of ink used in the printing and manufacturing industries. It is a black or dark blue ink that is used to create images on metal surfaces. Solder Mask Ink can be used to print logos, text, and other graphics onto metal parts.
Some of the major companies in the solder mask ink market are TAIYO, OTC, Jiangsu Kuangshun, Shenzhen Rongda, HUNTSMAN, TAMURA, SAN-EI Kagaku, Coants Electronic, Greencure Technology, Hitachi Chemical, Lanbang Electronic Hardware Materials, Greentop Technology, Seoul Chemical Research Laboratory, Donghua Electronics Technology, Jiangmen ABQ Electronic Material.
The solder mask ink market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Solder Mask Ink Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Solder Mask Ink Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Solder Mask Ink Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Solder Mask Ink Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Solder Mask Ink Market Size & Forecast, 2020-2028
4.5.1 Solder Mask Ink Market Size and Y-o-Y Growth
4.5.2 Solder Mask Ink Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Photoimageable Solder Mask Ink
5.2.2 UV Curable Solder Mask Ink
5.2.3 Thermal Curable Solder Mask Ink
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Computers
6.2.2 Communications
6.2.3 Consumer Electronics
6.2.4 IC Packaging
6.2.5 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Solder Mask Ink Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Solder Mask Ink Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Photoimageable Solder Mask Ink
9.6.2 UV Curable Solder Mask Ink
9.6.3 Thermal Curable Solder Mask Ink
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Computers
9.10.2 Communications
9.10.3 Consumer Electronics
9.10.4 IC Packaging
9.10.5 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Photoimageable Solder Mask Ink
10.6.2 UV Curable Solder Mask Ink
10.6.3 Thermal Curable Solder Mask Ink
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Computers
10.10.2 Communications
10.10.3 Consumer Electronics
10.10.4 IC Packaging
10.10.5 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Photoimageable Solder Mask Ink
11.6.2 UV Curable Solder Mask Ink
11.6.3 Thermal Curable Solder Mask Ink
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Computers
11.10.2 Communications
11.10.3 Consumer Electronics
11.10.4 IC Packaging
11.10.5 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Photoimageable Solder Mask Ink
12.6.2 UV Curable Solder Mask Ink
12.6.3 Thermal Curable Solder Mask Ink
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Computers
12.10.2 Communications
12.10.3 Consumer Electronics
12.10.4 IC Packaging
12.10.5 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Photoimageable Solder Mask Ink
13.6.2 UV Curable Solder Mask Ink
13.6.3 Thermal Curable Solder Mask Ink
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Computers
13.10.2 Communications
13.10.3 Consumer Electronics
13.10.4 IC Packaging
13.10.5 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Solder Mask Ink Market: Competitive Dashboard
14.2 Global Solder Mask Ink Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 TAIYO
14.3.2 OTC
14.3.3 Jiangsu Kuangshun
14.3.4 Shenzhen Rongda
14.3.5 HUNTSMAN
14.3.6 TAMURA
14.3.7 SAN-EI Kagaku
14.3.8 Coants Electronic
14.3.9 Greencure Technology
14.3.10 Hitachi Chemical
14.3.11 Lanbang Electronic Hardware Materials
14.3.12 Greentop Technology
14.3.13 Seoul Chemical Research Laboratory
14.3.14 Donghua Electronics Technology
14.3.15 Jiangmen ABQ Electronic Material
