Market Overview:
The global solder powder market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the solder powder market can be attributed to the increasing demand for lead-free type solder powders and semiconductor packaging applications. In terms of volume, the lead-free type segment is projected to grow at a higher CAGR than the lead type segment during the forecast period. Asia Pacific is expected to be the fastest growing region in terms of volume during the forecast period.
Product Definition:
Solder powder is a fine metal powder that is used to create a strong bond between two metal surfaces. It is important because it helps create a strong, durable connection between two pieces of metal.
Lead-free Type:
The global lead-free type is a category of solders with low or no addition of lead during the manufacturing process. Lead-free types are preferred in electronics and automotive industries owing to their characteristics such as high electrical resistance, enhanced mechanical strength, improved thermal performance along with less risk of health issues associated with exposure to lead. The growing demand for electronic devices across the globe is expected to propel market growth over the forecast period.
Lead Type:
Lead type is one of the major raw materials used in solder powder production. It has different properties such as softness, malleability, and high thermal stability which makes it suitable for various soldering applications. Lead can be classified into two types: lead-based alloys (Pb) and lead-acid batteries (LA).
Application Insights:
SMT assembly was the largest application segment in 2016 and is expected to continue its dominance over the forecast period. SMT assembly involves joining of components using solder as a component leads are not able to make contact with each other without solder. The growth of this application can be attributed to increasing demand for high-density boards with low power dissipation that require strong electronic bond between components.
Solder is used in various semiconductor packaging applications such as leadframe, chip carrier, QFP (Quad Flat Pack), LQFP (Low Profile Flat Pack), MLP (Micro Lead Pitch) and BGA (Ball Grid Array). These products are made from special alloys that have excellent soldering properties along with thermal shock resistance which makes them ideal for use in semiconductor packaging applications.
Regional Analysis:
Asia Pacific is expected to be the largest and fastest-growing regional market over the forecast period. The growth can be attributed to increasing production of electronic products in China, India, South Korea, Japan and Taiwan. In addition, rising population in countries such as China and India will boost demand for consumer electronics which will further propel industry expansion.
The Asia Pacific region accounted for a revenue share of more than 30% in 2017 owing to its dominant position in manufacturing electronic products coupled with high consumption levels worldwide. The presence of numerous manufacturers coupled with low labor costs has attracted many foreign investors who have set up their plants near major population centers across the region thereby boosting industry development over last few years (see Table 1).
Company Product Offering Country/Region Samsung Electronics Co., Ltd Various Electronic Products South Korea LG Electronics Inc., Various Electronic Products; Smartphones; Air Conditioners; Refrigerators etc.
Growth Factors:
- Increasing demand from the electronics and electrical industry for solder powder as a replacement to traditional soldering methods will drive the market growth.
- Rising demand for miniaturization in electronic devices is also expected to fuel the solder powder market growth over the forecast period.
- Growing popularity of lead-free soldering techniques is anticipated to create new opportunities for solder powder manufacturers in the coming years.
- Increasing use of 3D printing technology in manufacturing sector is projected to boost demand for solder powders during the forecast period.
Scope Of The Report
Report Attributes
Report Details
Report Title
Solder Powder Market Research Report
By Type
Lead-free Type, Lead Type
By Application
SMT Assembly, Semiconductor Packaging
By Companies
AIM Metals & Alloys, Heraeus, Qualitek, IPS, Huijin Atomizing, Indium Corporation
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
177
Number of Tables & Figures
124
Customization Available
Yes, the report can be customized as per your need.
Global Solder Powder Market Report Segments:
The global Solder Powder market is segmented on the basis of:
Types
Lead-free Type, Lead Type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
SMT Assembly, Semiconductor Packaging
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- AIM Metals & Alloys
- Heraeus
- Qualitek
- IPS
- Huijin Atomizing
- Indium Corporation
Highlights of The Solder Powder Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Lead-free Type
- Lead Type
- By Application:
- SMT Assembly
- Semiconductor Packaging
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Solder Powder Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Solder powder is a type of flux that helps solder joints together. It is made up of small, finely ground particles of metal that oxidize when exposed to air and heat. This process creates a strong bond between the two metals, making it ideal for use in soldering.
Some of the major players in the solder powder market are AIM Metals & Alloys, Heraeus, Qualitek, IPS, Huijin Atomizing, Indium Corporation.
The solder powder market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Solder Powder Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Solder Powder Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Solder Powder Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Solder Powder Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Solder Powder Market Size & Forecast, 2020-2028
4.5.1 Solder Powder Market Size and Y-o-Y Growth
4.5.2 Solder Powder Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Lead-free Type
5.2.2 Lead Type
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 SMT Assembly
6.2.2 Semiconductor Packaging
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Solder Powder Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Solder Powder Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Lead-free Type
9.6.2 Lead Type
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 SMT Assembly
9.10.2 Semiconductor Packaging
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Lead-free Type
10.6.2 Lead Type
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 SMT Assembly
10.10.2 Semiconductor Packaging
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Lead-free Type
11.6.2 Lead Type
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 SMT Assembly
11.10.2 Semiconductor Packaging
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Lead-free Type
12.6.2 Lead Type
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 SMT Assembly
12.10.2 Semiconductor Packaging
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Lead-free Type
13.6.2 Lead Type
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 SMT Assembly
13.10.2 Semiconductor Packaging
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Solder Powder Market: Competitive Dashboard
14.2 Global Solder Powder Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 AIM Metals & Alloys
14.3.2 Heraeus
14.3.3 Qualitek
14.3.4 IPS
14.3.5 Huijin Atomizing
14.3.6 Indium Corporation
