Market Overview:
The global solder preforms in electronic packaging market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth of this market can be attributed to the increasing demand for miniaturized and lightweight electronic devices, rising adoption of advanced packaging technologies, and growing demand for semiconductor components. The solder preforms in electronic packaging market is segmented on the basis of type into semi-automatic type and fully-automatic type. The semi-automatic type segment is expected to hold a larger share of the global solder preforms in electronic packaging market during the forecast period from 2018 to 2030. This can be attributed to its low cost as compared to fully-automatic types and its ability to meet small batch production requirements. On the basis of application, the solder preforms in electronic packaging market is segmented into hospital, inspection agency, research institution, and other applications.
Product Definition:
A solder preform is a small, rod-shaped piece of solder that is used to make electrical connections between electronic components. The preform is placed on the connection point and then heated until it melts and bonds with the component. Solder preforms are important in electronic packaging because they provide a reliable way to connect components together without using too much solder. This helps keep the weight and size of the finished product down, which is important for portable electronics devices like cell phones and tablets.
Semi-automatic type:
Semi-automatic type is used for producing large volumes of solder preforms in electronic packaging market. It's a continuous process and has high production capacity compared to other types of soldering equipment.
It can be used for mass manufacturing of components such as printed circuit boards, semiconductor devices, and others which are generally used in electronics assembly workflows.
Fully-automatic type:
Fully-automatic type is used for producing large volumes of solder preforms in electronic packaging market. It is a continuous process and has high production capacity as compared to semi-automatic type. The fully automatic soldering equipment consists of several components such as heating chamber, vacuum pump, thermal control system, soldering irons etc., which are operated by programmable controllers or microprocessors.
Application Insights:
The other application segment includes food packaging, consumer goods packaging, industrial machinery and equipment packaging. The demand for solder preforms in this application is expected to witness growth owing to the increasing use of electronic products such as mobile phones, tablets and computers in various end-use industries such as education, healthcare and transportation.
In addition, the solder preform is used for a variety of applications including hospital equipment manufacturing (X-ray machines), inspection agencies (food safety testing laboratories) research institutions (laboratories). These factors are anticipated to drive the global market over the forecast period.
Electronic components such as integrated circuits have been increasingly used in a wide range of end-use industries on account of their high performance capabilities and low prices coupled with technological advancements that have made them more user friendly. This has led to an increased demand for electronic packaging solutions across all regions which is likely to fuel product demand over the forecast period.
Regional Analysis:
Asia Pacific is expected to be the largest and fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for electronic products in countries such as China, India, Japan, and South Korea. Rapid industrialization coupled with low labor cost in these countries has attracted numerous manufacturers from other regions to set up their production facilities in this region. This scenario is further anticipated to drive the Asia Pacific solder preform market over the forecast period.
The Asia Pacific region was followed by North America which accounted for a revenue share of more than 20% in 2017 owing to high product adoption across various application industries such as medical & healthcare, automotive etc., mainly due to its superior performance characteristics including ease of use and excellent results obtained during testing procedures conducted on it by third parties (inspection agencies).
Growth Factors:
- Increasing demand for miniaturization in electronic packaging
- Rising demand from the automotive and aerospace industries
- Growing popularity of lead-free solder preforms
- Proliferation of 3D printing technology in the electronics industry
- Emergence of new applications for solder preforms
Scope Of The Report
Report Attributes
Report Details
Report Title
Solder Preforms in Electronic Packaging Market Research Report
By Type
Semi-automatic type, Fully-automatic type
By Application
Hospital, Inspection Agency, Research Institution, Other
By Companies
BioMérieux, Thermo Fisher Scientific, Biolog, Becton, Dickinson and Company, Beckman Coulter (Danaher), Shimadzu, Bruker, MIDI Inc., QIAGEN, Charles River, Tiandiren Bio-tech, Hefei Hengxing Technology, Bioyong Technology, Scenker Biological, Huizhou Sunshine Bio
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
179
Number of Tables & Figures
126
Customization Available
Yes, the report can be customized as per your need.
Global Solder Preforms in Electronic Packaging Market Report Segments:
The global Solder Preforms in Electronic Packaging market is segmented on the basis of:
Types
Semi-automatic type, Fully-automatic type
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Hospital, Inspection Agency, Research Institution, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- BioMérieux
- Thermo Fisher Scientific
- Biolog
- Becton, Dickinson and Company
- Beckman Coulter (Danaher)
- Shimadzu
- Bruker
- MIDI Inc.
- QIAGEN
- Charles River
- Tiandiren Bio-tech
- Hefei Hengxing Technology
- Bioyong Technology
- Scenker Biological
- Huizhou Sunshine Bio
Highlights of The Solder Preforms in Electronic Packaging Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Semi-automatic type
- Fully-automatic type
- By Application:
- Hospital
- Inspection Agency
- Research Institution
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Solder Preforms in Electronic Packaging Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Solder preforms are used in electronic packaging to provide a thermal interface between the heat-sink and the package.
Some of the major companies in the solder preforms in electronic packaging market are BioM©rieux, Thermo Fisher Scientific, Biolog, Becton, Dickinson and Company, Beckman Coulter (Danaher), Shimadzu, Bruker, MIDI Inc., QIAGEN, Charles River, Tiandiren Bio-tech, Hefei Hengxing Technology, Bioyong Technology, Scenker Biological, Huizhou Sunshine Bio.
The solder preforms in electronic packaging market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Solder Preforms in Electronic Packaging Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Solder Preforms in Electronic Packaging Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Solder Preforms in Electronic Packaging Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Solder Preforms in Electronic Packaging Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Solder Preforms in Electronic Packaging Market Size & Forecast, 2020-2028
4.5.1 Solder Preforms in Electronic Packaging Market Size and Y-o-Y Growth
4.5.2 Solder Preforms in Electronic Packaging Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Semi-automatic type
5.2.2 Fully-automatic type
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Hospital
6.2.2 Inspection Agency
6.2.3 Research Institution
6.2.4 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Solder Preforms in Electronic Packaging Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Solder Preforms in Electronic Packaging Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Semi-automatic type
9.6.2 Fully-automatic type
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Hospital
9.10.2 Inspection Agency
9.10.3 Research Institution
9.10.4 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Semi-automatic type
10.6.2 Fully-automatic type
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Hospital
10.10.2 Inspection Agency
10.10.3 Research Institution
10.10.4 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Semi-automatic type
11.6.2 Fully-automatic type
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Hospital
11.10.2 Inspection Agency
11.10.3 Research Institution
11.10.4 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Semi-automatic type
12.6.2 Fully-automatic type
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Hospital
12.10.2 Inspection Agency
12.10.3 Research Institution
12.10.4 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Semi-automatic type
13.6.2 Fully-automatic type
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Hospital
13.10.2 Inspection Agency
13.10.3 Research Institution
13.10.4 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Solder Preforms in Electronic Packaging Market: Competitive Dashboard
14.2 Global Solder Preforms in Electronic Packaging Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 BioMérieux
14.3.2 Thermo Fisher Scientific
14.3.3 Biolog
14.3.4 Becton, Dickinson and Company
14.3.5 Beckman Coulter (Danaher)
14.3.6 Shimadzu
14.3.7 Bruker
14.3.8 MIDI Inc.
14.3.9 QIAGEN
14.3.10 Charles River
14.3.11 Tiandiren Bio-tech
14.3.12 Hefei Hengxing Technology
14.3.13 Bioyong Technology
14.3.14 Scenker Biological
14.3.15 Huizhou Sunshine Bio
