Latest Update: Impact of current COVID-19 situation has been considered in this report while making the analysis.
Global Spherical Alumina for Semiconductor Market by Type (1-30 μm, 30-80 μm, 80-100 μm, Others), By Application (Semiconductor Sealing, IC Packing) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030-report

Global Spherical Alumina for Semiconductor Market by Type (1-30 μm, 30-80 μm, 80-100 μm, Others), By Application (Semiconductor Sealing, IC Packing) and Region (North America, Latin America, Europe, Asia Pacific and Middle East & Africa), Forecast From 2022 To 2030

Report ID: 345854 4200 Chemical & Material 377 183 Pages 4.5 (33)
                                          

Market Overview:


The global spherical alumina for semiconductor market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductors in various applications such as consumer electronics, automotive, and industrial. In addition, the growing demand for miniaturization of electronic devices is also fueling the growth of this market. The global spherical alumina for semiconductor market is segmented on the basis of type, application, and region. On the basis of type, it is divided into 1-30 μm, 30-80 μm, 80-100 μm and others. By application, it is classified into semiconductor sealing and IC packing.


Global Spherical Alumina for Semiconductor Industry Outlook


Product Definition:


A spherical alumina is a type of alumina that has been formed into a sphere. It is often used in the semiconductor industry because it has a very low surface roughness and can be machined to very tight tolerances.


1-30 μm:


1-30 μm is the shortest interplanetary distance. It's called inner solar system distance or sometimes planetary mile. It can also be referred to as a standard earth radii, which means it's the mean average radius of the earth plus sundistance at which satellites can orbit with 1 km orbital height and retain Earth surface area above waterline.


30-80 μm:


30-80 μm is the range of fiber diameters that can be used in fabricating spherical alumina for semiconductor devices. The optimum value for 30-80μm depends on the type of application and desired features. For example, if we are making a device with high thermal conductivity then we should use smaller fibers because they have better heat transfer properties than larger ones.


Application Insights:


Semiconductor sealing was the dominant application segment in terms of revenue share in 2017. The product is used as a replacement for glass substrates owing to its superior properties such as low thermal conductivity, high chemical resistance and high dielectric strength. These properties make it suitable for use in electronic packaging applications including semiconductor devices, circuit boards and power supplies.


The rising demand for energy-efficient products has resulted in increased focus on using alumina products over their glass counterparts.


Regional Analysis:


Asia Pacific dominated the global market in 2017. The growth is attributed to rapid industrialization and increasing demand for electronic products from China, India, South Korea, Japan and Taiwan. In addition, rising investments by foreign players such as Nidec Corporation; Furukawa Electric Co., Ltd.; Mitsubishi Materials Corp.; and Sumitomo Chemical Co., Ltd. are expected to drive the regional market over the forecast period.


The Asia Pacific region is characterized by rapidly growing economies with expanding population bases that generate high demands for consumer electronics; automobiles; appliances; solar panels etc., thereby driving semiconductor industry growth in this region over the forecast period. Moreover, presence of key electronic product manufacturers including Micron Technology Inc.; Broadcom Inc.; Qualcomm Technologies Inc.; Skyworks Solutions Holdings LLC among others will fuel regional product demand over next eight years (2018-2027).


Growth Factors:


  • Increasing demand for semiconductors in consumer electronics and automobiles
  • Rapid technological advancements in the semiconductor industry
  • Growing demand for miniaturized and energy-efficient semiconductors
  • Rising number of applications for semiconductors in various industries
  • Proliferation of nanotechnology and MEMS (micro-electro-mechanical systems)

Scope Of The Report

Report Attributes

Report Details

Report Title

Spherical Alumina for Semiconductor Market Research Report

By Type

1-30 μm, 30-80 μm, 80-100 μm, Others

By Application

Semiconductor Sealing, IC Packing

By Companies

Nippon Steel, Denka, Bestry, TRUNNANO, Sibelco, Admatechs Company, Showa Denko, Daehan Ceramics, Dongkuk R&S, NOVORAY CORPORATION, China Mineral Processing

Regions Covered

North America, Europe, APAC, Latin America, MEA

Base Year

2021

Historical Year

2019 to 2020 (Data from 2010 can be provided as per availability)

Forecast Year

2030

Number of Pages

183

Number of Tables & Figures

129

Customization Available

Yes, the report can be customized as per your need.


Global Spherical Alumina for Semiconductor Market Report Segments:

The global Spherical Alumina for Semiconductor market is segmented on the basis of:

Types

1-30 μm, 30-80 μm, 80-100 μm, Others

The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.

Applications

Semiconductor Sealing, IC Packing

The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.

Some of the companies that are profiled in this report are:

  1. Nippon Steel
  2. Denka
  3. Bestry
  4. TRUNNANO
  5. Sibelco
  6. Admatechs Company
  7. Showa Denko
  8. Daehan Ceramics
  9. Dongkuk R&S
  10. NOVORAY CORPORATION
  11. China Mineral Processing

Global Spherical Alumina for Semiconductor Market Overview


Highlights of The Spherical Alumina for Semiconductor Market Report:

  1. The market structure and projections for the coming years.
  2. Drivers, restraints, opportunities, and current trends of market.
  3. Historical data and forecast.
  4. Estimations for the forecast period 2030.
  5. Developments and trends in the market.
  6. By Type:

    1. 1-30 μm
    2. 30-80 μm
    3. 80-100 μm
    4. Others
  1. By Application:

    1. Semiconductor Sealing
    2. IC Packing
  1. Market scenario by region, sub-region, and country.
  2. Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
  3. Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
  4. Government Policies, Macro & Micro economic factors are also included in the report.

We have studied the Spherical Alumina for Semiconductor Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.

Regional Analysis

  • North America
  • Europe
  • Asia Pacific
  • Middle East & Africa
  • Latin America

Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.

The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.

How you may use our products:

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Global Spherical Alumina for Semiconductor Market Statistics

8 Reasons to Buy This Report

  1. Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
  2. Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
  3. Implemented Robust Methodology to Prepare the Report
  4. Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
  5. Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
  6. Provides Information About the Top-winning Strategies Implemented by Industry Players.
  7. In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
  8. Customization of the Report Available

Frequently Asked Questions?


Spherical alumina is a type of alumina that has been treated to create a spherical shape. This treatment makes the material more resistant to wear and tear, making it ideal for use in semiconductor devices.

Some of the key players operating in the spherical alumina for semiconductor market are Nippon Steel, Denka, Bestry, TRUNNANO, Sibelco, Admatechs Company, Showa Denko, Daehan Ceramics, Dongkuk R&S, NOVORAY CORPORATION, China Mineral Processing.

The spherical alumina for semiconductor market is expected to grow at a compound annual growth rate of 5.5%.

                                            
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Spherical Alumina for Semiconductor Market Overview    4.1 Introduction       4.1.1 Market Taxonomy       4.1.2 Market Definition       4.1.3 Macro-Economic Factors Impacting the Market Growth    4.2 Spherical Alumina for Semiconductor Market Dynamics       4.2.1 Market Drivers       4.2.2 Market Restraints       4.2.3 Market Opportunity    4.3 Spherical Alumina for Semiconductor Market - Supply Chain Analysis       4.3.1 List of Key Suppliers       4.3.2 List of Key Distributors       4.3.3 List of Key Consumers    4.4 Key Forces Shaping the Spherical Alumina for Semiconductor Market       4.4.1 Bargaining Power of Suppliers       4.4.2 Bargaining Power of Buyers       4.4.3 Threat of Substitution       4.4.4 Threat of New Entrants       4.4.5 Competitive Rivalry    4.5 Global Spherical Alumina for Semiconductor Market Size & Forecast, 2020-2028       4.5.1 Spherical Alumina for Semiconductor Market Size and Y-o-Y Growth       4.5.2 Spherical Alumina for Semiconductor Market Absolute $ Opportunity

Chapter 5 Global  Market Analysis and Forecast by Type
   5.1 Introduction
      5.1.1 Key Market Trends & Growth Opportunities by Type
      5.1.2 Basis Point Share (BPS) Analysis by Type
      5.1.3 Absolute $ Opportunity Assessment by Type
   5.2  Market Size Forecast by Type
      5.2.1 1-30 μm
      5.2.2 30-80 μm
      5.2.3 80-100 μm
      5.2.4 Others
   5.3 Market Attractiveness Analysis by Type

Chapter 6 Global  Market Analysis and Forecast by Applications
   6.1 Introduction
      6.1.1 Key Market Trends & Growth Opportunities by Applications
      6.1.2 Basis Point Share (BPS) Analysis by Applications
      6.1.3 Absolute $ Opportunity Assessment by Applications
   6.2  Market Size Forecast by Applications
      6.2.1 Semiconductor Sealing
      6.2.2 IC Packing
   6.3 Market Attractiveness Analysis by Applications

Chapter 7 Global Spherical Alumina for Semiconductor Market Analysis and Forecast by Region
   7.1 Introduction
      7.1.1 Key Market Trends & Growth Opportunities by Region
      7.1.2 Basis Point Share (BPS) Analysis by Region
      7.1.3 Absolute $ Opportunity Assessment by Region
   7.2 Spherical Alumina for Semiconductor Market Size Forecast by Region
      7.2.1 North America
      7.2.2 Europe
      7.2.3 Asia Pacific
      7.2.4 Latin America
      7.2.5 Middle East & Africa (MEA)
   7.3 Market Attractiveness Analysis by Region

Chapter 8 Coronavirus Disease (COVID-19) Impact 
   8.1 Introduction 
   8.2 Current & Future Impact Analysis 
   8.3 Economic Impact Analysis 
   8.4 Government Policies 
   8.5 Investment Scenario

Chapter 9 North America  Analysis and Forecast
   9.1 Introduction
   9.2 North America  Market Size Forecast by Country
      9.2.1 U.S.
      9.2.2 Canada
   9.3 Basis Point Share (BPS) Analysis by Country
   9.4 Absolute $ Opportunity Assessment by Country
   9.5 Market Attractiveness Analysis by Country
   9.6 North America  Market Size Forecast by Type
      9.6.1 1-30 μm
      9.6.2 30-80 μm
      9.6.3 80-100 μm
      9.6.4 Others
   9.7 Basis Point Share (BPS) Analysis by Type 
   9.8 Absolute $ Opportunity Assessment by Type 
   9.9 Market Attractiveness Analysis by Type
   9.10 North America  Market Size Forecast by Applications
      9.10.1 Semiconductor Sealing
      9.10.2 IC Packing
   9.11 Basis Point Share (BPS) Analysis by Applications 
   9.12 Absolute $ Opportunity Assessment by Applications 
   9.13 Market Attractiveness Analysis by Applications

Chapter 10 Europe  Analysis and Forecast
   10.1 Introduction
   10.2 Europe  Market Size Forecast by Country
      10.2.1 Germany
      10.2.2 France
      10.2.3 Italy
      10.2.4 U.K.
      10.2.5 Spain
      10.2.6 Russia
      10.2.7 Rest of Europe
   10.3 Basis Point Share (BPS) Analysis by Country
   10.4 Absolute $ Opportunity Assessment by Country
   10.5 Market Attractiveness Analysis by Country
   10.6 Europe  Market Size Forecast by Type
      10.6.1 1-30 μm
      10.6.2 30-80 μm
      10.6.3 80-100 μm
      10.6.4 Others
   10.7 Basis Point Share (BPS) Analysis by Type 
   10.8 Absolute $ Opportunity Assessment by Type 
   10.9 Market Attractiveness Analysis by Type
   10.10 Europe  Market Size Forecast by Applications
      10.10.1 Semiconductor Sealing
      10.10.2 IC Packing
   10.11 Basis Point Share (BPS) Analysis by Applications 
   10.12 Absolute $ Opportunity Assessment by Applications 
   10.13 Market Attractiveness Analysis by Applications

Chapter 11 Asia Pacific  Analysis and Forecast
   11.1 Introduction
   11.2 Asia Pacific  Market Size Forecast by Country
      11.2.1 China
      11.2.2 Japan
      11.2.3 South Korea
      11.2.4 India
      11.2.5 Australia
      11.2.6 South East Asia (SEA)
      11.2.7 Rest of Asia Pacific (APAC)
   11.3 Basis Point Share (BPS) Analysis by Country
   11.4 Absolute $ Opportunity Assessment by Country
   11.5 Market Attractiveness Analysis by Country
   11.6 Asia Pacific  Market Size Forecast by Type
      11.6.1 1-30 μm
      11.6.2 30-80 μm
      11.6.3 80-100 μm
      11.6.4 Others
   11.7 Basis Point Share (BPS) Analysis by Type 
   11.8 Absolute $ Opportunity Assessment by Type 
   11.9 Market Attractiveness Analysis by Type
   11.10 Asia Pacific  Market Size Forecast by Applications
      11.10.1 Semiconductor Sealing
      11.10.2 IC Packing
   11.11 Basis Point Share (BPS) Analysis by Applications 
   11.12 Absolute $ Opportunity Assessment by Applications 
   11.13 Market Attractiveness Analysis by Applications

Chapter 12 Latin America  Analysis and Forecast
   12.1 Introduction
   12.2 Latin America  Market Size Forecast by Country
      12.2.1 Brazil
      12.2.2 Mexico
      12.2.3 Rest of Latin America (LATAM)
   12.3 Basis Point Share (BPS) Analysis by Country
   12.4 Absolute $ Opportunity Assessment by Country
   12.5 Market Attractiveness Analysis by Country
   12.6 Latin America  Market Size Forecast by Type
      12.6.1 1-30 μm
      12.6.2 30-80 μm
      12.6.3 80-100 μm
      12.6.4 Others
   12.7 Basis Point Share (BPS) Analysis by Type 
   12.8 Absolute $ Opportunity Assessment by Type 
   12.9 Market Attractiveness Analysis by Type
   12.10 Latin America  Market Size Forecast by Applications
      12.10.1 Semiconductor Sealing
      12.10.2 IC Packing
   12.11 Basis Point Share (BPS) Analysis by Applications 
   12.12 Absolute $ Opportunity Assessment by Applications 
   12.13 Market Attractiveness Analysis by Applications

Chapter 13 Middle East & Africa (MEA)  Analysis and Forecast
   13.1 Introduction
   13.2 Middle East & Africa (MEA)  Market Size Forecast by Country
      13.2.1 Saudi Arabia
      13.2.2 South Africa
      13.2.3 UAE
      13.2.4 Rest of Middle East & Africa (MEA)
   13.3 Basis Point Share (BPS) Analysis by Country
   13.4 Absolute $ Opportunity Assessment by Country
   13.5 Market Attractiveness Analysis by Country
   13.6 Middle East & Africa (MEA)  Market Size Forecast by Type
      13.6.1 1-30 μm
      13.6.2 30-80 μm
      13.6.3 80-100 μm
      13.6.4 Others
   13.7 Basis Point Share (BPS) Analysis by Type 
   13.8 Absolute $ Opportunity Assessment by Type 
   13.9 Market Attractiveness Analysis by Type
   13.10 Middle East & Africa (MEA)  Market Size Forecast by Applications
      13.10.1 Semiconductor Sealing
      13.10.2 IC Packing
   13.11 Basis Point Share (BPS) Analysis by Applications 
   13.12 Absolute $ Opportunity Assessment by Applications 
   13.13 Market Attractiveness Analysis by Applications

Chapter 14 Competition Landscape 
   14.1 Spherical Alumina for Semiconductor Market: Competitive Dashboard
   14.2 Global Spherical Alumina for Semiconductor Market: Market Share Analysis, 2019
   14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy) 
      14.3.1 Nippon Steel
      14.3.2 Denka
      14.3.3 Bestry
      14.3.4 TRUNNANO
      14.3.5 Sibelco
      14.3.6 Admatechs Company
      14.3.7 Showa Denko
      14.3.8 Daehan Ceramics
      14.3.9 Dongkuk R&S
      14.3.10 NOVORAY CORPORATION
      14.3.11 China Mineral Processing

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