Market Overview:
The global system-in-package market is expected to grow from USD XX million in 2018 to USD XX million by 2030, at a CAGR of X.X%. The growth of the system-in-package market can be attributed to the increasing demand for miniaturization and higher integration in electronic devices. Moreover, the growing trend of Internet of Things (IoT) is also fueling the growth of the system-in-package market. However, high manufacturing costs and complexities associated with 3D ICs are restraining the growth of this market. Based on type, 2D ICs accounted for a major share of the global system-in package market in 2017. This segment is expected to dominate this market during the forecast period owing to its low cost and easy manufacturing process as compared to other types such as 2.5D ICs and 3DICs . However, 3DICs are expected to witness highest CAGR during 2018–2030 due its ability offer higher performance and smaller form factor as compared to other types.
Product Definition:
A System-in-Package (SiP) is a complete system on a single chip. SiPs can include processors, memory, sensors, and other components in a single package. SiPs are important because they save time and space when designing products.
2D IC:
2D integrated circuits (2IC) are a type of integrated circuit that is built to perform two independent operations simultaneously. The most common example of 2D ICs are the microprocessors which have two processing cores, allowing it to process more data at once thereby making it faster than a single core processor.
The System-in- Package (SiP) market has been witnessing growth in recent years owing to technological advancements and increasing demand for miniaturization.
2.5D IC:
2.5D integrated circuit (IC) is a technology that integrates the System-in- Package (SiP) with 2D components on a single wafer of semiconductor material such as silicon. The technology provides several benefits such as low power consumption, small size, and high performance in comparison to traditional 3D ICs which are used for heavy tasks such as gaming or video streaming.
Application Insights:
The global system-in-package market has been segmented on the basis of application into consumer electronics, communications, automotive & transportation, aerospace & defense and other applications. The other applications segment includes medical equipment and military equipment. The healthcare segment is expected to witness significant growth over the forecast period owing to increasing demand for electronic devices in hospitals across the globe.
Consumer electronics was estimated as the largest application sector in 2016 with a share of over 40%. This is attributed to growing demand for smartphones and tablets from developing countries such as India and China along with advanced economies such as U.S., Germany, UK etc.
Regional Analysis:
The market in Asia Pacific is expected to grow at the highest rate over the forecast period. The growth can be attributed to increasing demand for system-in-package solutions from various end users such as consumer electronics, automotive and others. The presence of key players such as Nidec Corporation; Renesas Electronics Corporation; Fujitsu Microelectronics Ltd.; and Toshiba Semiconductor & Storage Devices Co., Ltd.; among others is also anticipated to boost the regional market growth in near future.
The Europe region accounted for more than 20% of global revenue share in 2017 owing to high product adoption by application sectors including aerospace & defense, healthcare, IT & telecommunication and consumer electronics industry verticals. Moreover, rising R&D activities by major technology companies are projected to fuel regional market growth over the forecast period.
North America region is estimated witness significant growth due its dominance by developed economies like U.S.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Proliferation of smart devices and the Internet of Things (IoT)
- Growing trend of integrating multiple functions into a single chip or package
- Advances in semiconductor packaging technology and materials science
- Emergence of new applications that require advanced system-in-package solutions
Scope Of The Report
Report Attributes
Report Details
Report Title
System-in-Package Market Research Report
By Type
2D IC, 2.5D IC, 3D IC
By Application
Consumer Electronics, Communications, Automotive & Transportation, Aerospace & Defense, Healthcare, Others
By Companies
Amkor Technology, ASE, Jiangsu Changjiang Electronics Technology (JCET), Siliconware Precision Industries (SPIL), United Test and Assembly Center (UTAC)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
203
Number of Tables & Figures
143
Customization Available
Yes, the report can be customized as per your need.
Global System-in-Package Market Report Segments:
The global System-in-Package market is segmented on the basis of:
Types
2D IC, 2.5D IC, 3D IC
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Communications, Automotive & Transportation, Aerospace & Defense, Healthcare, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Amkor Technology
- ASE
- Jiangsu Changjiang Electronics Technology (JCET)
- Siliconware Precision Industries (SPIL)
- United Test and Assembly Center (UTAC)
Highlights of The System-in-Package Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 2D IC
- 2.5D IC
- 3D IC
- By Application:
- Consumer Electronics
- Communications
- Automotive & Transportation
- Aerospace & Defense
- Healthcare
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the System-in-Package Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
System-in-package is a software development model in which the entire system, including its dependencies, is packaged into a single executable. This allows for easier management and deployment of the system.
Some of the major companies in the system-in-package market are Amkor Technology, ASE, Jiangsu Changjiang Electronics Technology (JCET), Siliconware Precision Industries (SPIL), United Test and Assembly Center (UTAC).
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 System-in-Package Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 System-in-Package Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 System-in-Package Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the System-in-Package Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global System-in-Package Market Size & Forecast, 2018-2028
4.5.1 System-in-Package Market Size and Y-o-Y Growth
4.5.2 System-in-Package Market Absolute $ Opportunity
Chapter 5 Global System-in-Package Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 System-in-Package Market Size Forecast by Type
5.2.1 2D IC
5.2.2 2.5D IC
5.2.3 3D IC
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global System-in-Package Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 System-in-Package Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Communications
6.2.3 Automotive & Transportation
6.2.4 Aerospace & Defense
6.2.5 Healthcare
6.2.6 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global System-in-Package Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 System-in-Package Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America System-in-Package Analysis and Forecast
9.1 Introduction
9.2 North America System-in-Package Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America System-in-Package Market Size Forecast by Type
9.6.1 2D IC
9.6.2 2.5D IC
9.6.3 3D IC
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America System-in-Package Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Communications
9.10.3 Automotive & Transportation
9.10.4 Aerospace & Defense
9.10.5 Healthcare
9.10.6 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe System-in-Package Analysis and Forecast
10.1 Introduction
10.2 Europe System-in-Package Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe System-in-Package Market Size Forecast by Type
10.6.1 2D IC
10.6.2 2.5D IC
10.6.3 3D IC
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe System-in-Package Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Communications
10.10.3 Automotive & Transportation
10.10.4 Aerospace & Defense
10.10.5 Healthcare
10.10.6 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific System-in-Package Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific System-in-Package Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific System-in-Package Market Size Forecast by Type
11.6.1 2D IC
11.6.2 2.5D IC
11.6.3 3D IC
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific System-in-Package Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Communications
11.10.3 Automotive & Transportation
11.10.4 Aerospace & Defense
11.10.5 Healthcare
11.10.6 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America System-in-Package Analysis and Forecast
12.1 Introduction
12.2 Latin America System-in-Package Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America System-in-Package Market Size Forecast by Type
12.6.1 2D IC
12.6.2 2.5D IC
12.6.3 3D IC
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America System-in-Package Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Communications
12.10.3 Automotive & Transportation
12.10.4 Aerospace & Defense
12.10.5 Healthcare
12.10.6 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) System-in-Package Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) System-in-Package Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) System-in-Package Market Size Forecast by Type
13.6.1 2D IC
13.6.2 2.5D IC
13.6.3 3D IC
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) System-in-Package Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Communications
13.10.3 Automotive & Transportation
13.10.4 Aerospace & Defense
13.10.5 Healthcare
13.10.6 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 System-in-Package Market: Competitive Dashboard
14.2 Global System-in-Package Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Amkor Technology
14.3.2 ASE
14.3.3 Jiangsu Changjiang Electronics Technology (JCET)
14.3.4 Siliconware Precision Industries (SPIL)
14.3.5 United Test and Assembly Center (UTAC)
