Market Overview:
The global tape for wafer dicing market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for semiconductor devices and rising demand for miniaturization of electronic devices. UV-based tapes are expected to witness higher growth rates as compared to non-UV based tapes, owing to their superior performance characteristics such as high adhesion and low residue levels. Thin wafers are expected to account for the largest share of the global tape for wafer dicing market in 2018, followed by bumped wafers. North America is estimated to be the largest regional market for tape for wafer dicing in 2018, followed by Europe and Asia Pacific.
Product Definition:
Tape is a material used to attach wafers together for easier handling and dicing. Tape also helps to protect the wafer surface from scratches and other damage.
UV:
Ultraviolet (UV) is a form of electromagnetic radiation with a wavelength between 10 nm to 400 nm. UV is generally used for patterning materials like glass, silicon wafers and other substrates by cutting or drilling the material in desired patterns. The most common application of UV includes manufacturing semiconductors such as silicon wafers and integrated circuits (IC). Other applications include non-semiconductor devices such as flat panel detectors, photomask alignments, etc.
Non-UV:
Non-UV is a technology that helps to avoid damage of sensitive wafers during wafer dicing. It provides high accuracy and repeatability in the process, which reduces the cost by avoiding reworking of wafers. Non-UV systems are majorly used for silicon nitride, silicon dioxide, and glass substrates as these materials have low absorption coefficient for UV light.
The global market size was valued at USD 1.5 billion in 2016.
Application Insights:
Thin wafer application dominated the global market in 2017, accounting for over 60% of the total revenue share. The demand for thin wafers is expected to increase significantly owing to their use in various applications including solar cells, flexible displays and lighting devices. In addition, growing demand from semiconductor manufacturers such as Taiwan Semiconductor Manufacturing Co., Ltd., United Microelectronics Corporation and Renesas Electronics Corporation is anticipated to fuel industry growth over the forecast period.
Bumped wafer segment is projected to witness significant growth during the study period owing to its rising application in photovoltaic (PV) modules and high-temperature superconductors (HTS). Growing adoption of bumped wafers by manufacturers such as JinkoSolar Technology Co., Ltd., Canadian Solar Inc., REC Silicon Corp. among others are expected drive industry expansion over the forecast period.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for semiconductor devices from various end-use industries, such as consumer electronics, automotive and telecommunication. China is projected to remain a key player in this regional market owing to low manufacturing cost coupled with easy availability of labor & raw materials.
The presence of several foundries has also fueled the growth of Asia Pacific regional market including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC) and others. In addition, growing investments by foreign players such as Micron Technology Inc.; Qualcomm Inc.; Samsung Electronics Co., Ltd; Intel Corporation; Western Digital Technologies Co., Ltd; among others are anticipated to fuel industry expansion over the next eight years.
North America held a significant share in global wafer dicing industry due to high demand for customized electronic products from U.S.
Growth Factors:
- Increasing demand for semiconductor devices from the consumer electronics sector is expected to drive the growth of the tape for wafer dicing market during the forecast period.
- The increasing demand for miniaturized and high-performance semiconductor devices is also anticipated to fuel the growth of this market in the near future.
- The rising trend of using advanced packaging technologies, such as 3D ICs, is also projected to boost demand for tape for wafer dicing over the next few years.
- Rapid technological advancements in semiconductor manufacturing are expected to create new opportunities for players operating in this market during the forecast period. 5
Scope Of The Report
Report Attributes
Report Details
Report Title
Tape for Wafer Dicing Market Research Report
By Type
UV, Non-UV
By Application
Thin Wafer, Bumped Wafer
By Companies
Furukawa Electric, Nitto, Mitsui Chemicals, Lintec Corporation, Sumitomo Bakelite, Denka, Pantech Tape, Ultron Systems, AI Technology, Nippon Pulse Motor Taiwan, Minitron Electronic, Loadpoint, DaehyunST
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
199
Number of Tables & Figures
140
Customization Available
Yes, the report can be customized as per your need.
Global Tape for Wafer Dicing Market Report Segments:
The global Tape for Wafer Dicing market is segmented on the basis of:
Types
UV, Non-UV
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Thin Wafer, Bumped Wafer
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Furukawa Electric
- Nitto
- Mitsui Chemicals
- Lintec Corporation
- Sumitomo Bakelite
- Denka
- Pantech Tape
- Ultron Systems
- AI Technology
- Nippon Pulse Motor Taiwan
- Minitron Electronic
- Loadpoint
- DaehyunST
Highlights of The Tape for Wafer Dicing Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- UV
- Non-UV
- By Application:
- Thin Wafer
- Bumped Wafer
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Tape for Wafer Dicing Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Tape is a thin, adhesive sheet that is used to hold wafers together during the cutting process. It helps to prevent the wafers from sticking to each other and allows for more accurate cuts.
Some of the key players operating in the tape for wafer dicing market are Furukawa Electric, Nitto, Mitsui Chemicals, Lintec Corporation, Sumitomo Bakelite, Denka, Pantech Tape, Ultron Systems, AI Technology, Nippon Pulse Motor Taiwan, Minitron Electronic, Loadpoint, DaehyunST.
The tape for wafer dicing market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Tape for Wafer Dicing Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Tape for Wafer Dicing Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Tape for Wafer Dicing Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Tape for Wafer Dicing Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Tape for Wafer Dicing Market Size & Forecast, 2020-2028 4.5.1 Tape for Wafer Dicing Market Size and Y-o-Y Growth 4.5.2 Tape for Wafer Dicing Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 UV
5.2.2 Non-UV
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Thin Wafer
6.2.2 Bumped Wafer
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Tape for Wafer Dicing Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Tape for Wafer Dicing Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 UV
9.6.2 Non-UV
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Thin Wafer
9.10.2 Bumped Wafer
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 UV
10.6.2 Non-UV
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Thin Wafer
10.10.2 Bumped Wafer
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 UV
11.6.2 Non-UV
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Thin Wafer
11.10.2 Bumped Wafer
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 UV
12.6.2 Non-UV
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Thin Wafer
12.10.2 Bumped Wafer
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 UV
13.6.2 Non-UV
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Thin Wafer
13.10.2 Bumped Wafer
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Tape for Wafer Dicing Market: Competitive Dashboard
14.2 Global Tape for Wafer Dicing Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Furukawa Electric
14.3.2 Nitto
14.3.3 Mitsui Chemicals
14.3.4 Lintec Corporation
14.3.5 Sumitomo Bakelite
14.3.6 Denka
14.3.7 Pantech Tape
14.3.8 Ultron Systems
14.3.9 AI Technology
14.3.10 Nippon Pulse Motor Taiwan
14.3.11 Minitron Electronic
14.3.12 Loadpoint
14.3.13 DaehyunST