Industry Growth Insights published a new data on “Thermal Interface Material for 5G Market”. The research report is titled “Thermal Interface Material for 5G Market research by Types (Thermal Pad, Thermal Gel, Thermal Grease, Thermal Tap, Graphite Sheet, Phase Change Material, Thermal Gap Filler, Others (Graphene, Carbon Fiber TIM)), By Applications (5G Smartphone, 5G Base Station, Others (Routers and Servers)), By Players/Companies Fuji Polymer Industries Co., Ltd., Laird Technologies, Inc., Henkel Corporation, Dow, W.L. Gore and Associates, Inc., Panasonic Corporation, Jiangxi Dasen Technology Co., Ltd., 3M Company, Shin-Etsu Chemical Co., Ltd., Denka Company Limited, Fuji Polymer Industries Co., Ltd., Parker Hannifin Corp, Momentive Performance Materials, Inc., Dongguan Sheen Electronic Technology Co., Ltd., T-Global Technology Co., Ltd.”.
Scope Of The Report
Report Attributes
Report Details
Report Title
Thermal Interface Material for 5G Market Research Report
By Type
Thermal Pad, Thermal Gel, Thermal Grease, Thermal Tap, Graphite Sheet, Phase Change Material, Thermal Gap Filler, Others (Graphene, Carbon Fiber TIM)
By Application
5G Smartphone, 5G Base Station, Others (Routers and Servers)
By Companies
Fuji Polymer Industries Co., Ltd., Laird Technologies, Inc., Henkel Corporation, Dow, W.L. Gore and Associates, Inc., Panasonic Corporation, Jiangxi Dasen Technology Co., Ltd., 3M Company, Shin-Etsu Chemical Co., Ltd., Denka Company Limited, Fuji Polymer Industries Co., Ltd., Parker Hannifin Corp, Momentive Performance Materials, Inc., Dongguan Sheen Electronic Technology Co., Ltd., T-Global Technology Co., Ltd.
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
230
Number of Tables & Figures
161
Customization Available
Yes, the report can be customized as per your need.
Global Thermal Interface Material for 5G Market Report Segments:
The global Thermal Interface Material for 5G market is segmented on the basis of:
Types
Thermal Pad, Thermal Gel, Thermal Grease, Thermal Tap, Graphite Sheet, Phase Change Material, Thermal Gap Filler, Others (Graphene, Carbon Fiber TIM)
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
5G Smartphone, 5G Base Station, Others (Routers and Servers)
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Fuji Polymer Industries Co., Ltd.
- Laird Technologies, Inc.
- Henkel Corporation
- Dow
- W.L. Gore and Associates, Inc.
- Panasonic Corporation
- Jiangxi Dasen Technology Co., Ltd.
- 3M Company
- Shin-Etsu Chemical Co., Ltd.
- Denka Company Limited
- Fuji Polymer Industries Co., Ltd.
- Parker Hannifin Corp
- Momentive Performance Materials, Inc.
- Dongguan Sheen Electronic Technology Co., Ltd.
- T-Global Technology Co., Ltd.
Highlights of The Thermal Interface Material for 5G Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Thermal Pad
- Thermal Gel
- Thermal Grease
- Thermal Tap
- Graphite Sheet
- Phase Change Material
- Thermal Gap Filler
- Others (Graphene, Carbon Fiber TIM)
- By Application:
- 5G Smartphone
- 5G Base Station
- Others (Routers and Servers)
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Thermal Interface Material for 5G Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Thermal interface material (TIM) is a material that helps to keep mobile devices and antennas cool. It also helps to prevent the spread of fire.
Some of the major companies in the thermal interface material for 5g market are Fuji Polymer Industries Co., Ltd., Laird Technologies, Inc., Henkel Corporation, Dow, W.L. Gore and Associates, Inc., Panasonic Corporation, Jiangxi Dasen Technology Co., Ltd., 3M Company, Shin-Etsu Chemical Co., Ltd., Denka Company Limited, Fuji Polymer Industries Co., Ltd., Parker Hannifin Corp, Momentive Performance Materials, Inc., Dongguan Sheen Electronic Technology Co., Ltd., T-Global Technology Co., Ltd..
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Thermal Interface Material for 5G Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Thermal Interface Material for 5G Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Thermal Interface Material for 5G Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Thermal Interface Material for 5G Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Thermal Interface Material for 5G Market Size & Forecast, 2018-2028
4.5.1 Thermal Interface Material for 5G Market Size and Y-o-Y Growth
4.5.2 Thermal Interface Material for 5G Market Absolute $ Opportunity
Chapter 5 Global Thermal Interface Material for 5G Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Thermal Interface Material for 5G Market Size Forecast by Type
5.2.1 Thermal Pad
5.2.2 Thermal Gel
5.2.3 Thermal Grease
5.2.4 Thermal Tap
5.2.5 Graphite Sheet
5.2.6 Phase Change Material
5.2.7 Thermal Gap Filler
5.2.8 Others (Graphene
5.2.9 Carbon Fiber TIM)
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Thermal Interface Material for 5G Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Thermal Interface Material for 5G Market Size Forecast by Applications
6.2.1 5G Smartphone
6.2.2 5G Base Station
6.2.3 Others (Routers and Servers)
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Thermal Interface Material for 5G Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Thermal Interface Material for 5G Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Thermal Interface Material for 5G Analysis and Forecast
9.1 Introduction
9.2 North America Thermal Interface Material for 5G Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Thermal Interface Material for 5G Market Size Forecast by Type
9.6.1 Thermal Pad
9.6.2 Thermal Gel
9.6.3 Thermal Grease
9.6.4 Thermal Tap
9.6.5 Graphite Sheet
9.6.6 Phase Change Material
9.6.7 Thermal Gap Filler
9.6.8 Others (Graphene
9.6.9 Carbon Fiber TIM)
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Thermal Interface Material for 5G Market Size Forecast by Applications
9.10.1 5G Smartphone
9.10.2 5G Base Station
9.10.3 Others (Routers and Servers)
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Thermal Interface Material for 5G Analysis and Forecast
10.1 Introduction
10.2 Europe Thermal Interface Material for 5G Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Thermal Interface Material for 5G Market Size Forecast by Type
10.6.1 Thermal Pad
10.6.2 Thermal Gel
10.6.3 Thermal Grease
10.6.4 Thermal Tap
10.6.5 Graphite Sheet
10.6.6 Phase Change Material
10.6.7 Thermal Gap Filler
10.6.8 Others (Graphene
10.6.9 Carbon Fiber TIM)
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Thermal Interface Material for 5G Market Size Forecast by Applications
10.10.1 5G Smartphone
10.10.2 5G Base Station
10.10.3 Others (Routers and Servers)
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Thermal Interface Material for 5G Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Thermal Interface Material for 5G Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Thermal Interface Material for 5G Market Size Forecast by Type
11.6.1 Thermal Pad
11.6.2 Thermal Gel
11.6.3 Thermal Grease
11.6.4 Thermal Tap
11.6.5 Graphite Sheet
11.6.6 Phase Change Material
11.6.7 Thermal Gap Filler
11.6.8 Others (Graphene
11.6.9 Carbon Fiber TIM)
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Thermal Interface Material for 5G Market Size Forecast by Applications
11.10.1 5G Smartphone
11.10.2 5G Base Station
11.10.3 Others (Routers and Servers)
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Thermal Interface Material for 5G Analysis and Forecast
12.1 Introduction
12.2 Latin America Thermal Interface Material for 5G Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Thermal Interface Material for 5G Market Size Forecast by Type
12.6.1 Thermal Pad
12.6.2 Thermal Gel
12.6.3 Thermal Grease
12.6.4 Thermal Tap
12.6.5 Graphite Sheet
12.6.6 Phase Change Material
12.6.7 Thermal Gap Filler
12.6.8 Others (Graphene
12.6.9 Carbon Fiber TIM)
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Thermal Interface Material for 5G Market Size Forecast by Applications
12.10.1 5G Smartphone
12.10.2 5G Base Station
12.10.3 Others (Routers and Servers)
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Thermal Interface Material for 5G Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Thermal Interface Material for 5G Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Thermal Interface Material for 5G Market Size Forecast by Type
13.6.1 Thermal Pad
13.6.2 Thermal Gel
13.6.3 Thermal Grease
13.6.4 Thermal Tap
13.6.5 Graphite Sheet
13.6.6 Phase Change Material
13.6.7 Thermal Gap Filler
13.6.8 Others (Graphene
13.6.9 Carbon Fiber TIM)
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Thermal Interface Material for 5G Market Size Forecast by Applications
13.10.1 5G Smartphone
13.10.2 5G Base Station
13.10.3 Others (Routers and Servers)
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Thermal Interface Material for 5G Market: Competitive Dashboard
14.2 Global Thermal Interface Material for 5G Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Fuji Polymer Industries Co., Ltd.
14.3.2 Laird Technologies, Inc.
14.3.3 Henkel Corporation
14.3.4 Dow
14.3.5 W.L. Gore and Associates, Inc.
14.3.6 Panasonic Corporation
14.3.7 Jiangxi Dasen Technology Co., Ltd.
14.3.8 3M Company
14.3.9 Shin-Etsu Chemical Co., Ltd.
14.3.10 Denka Company Limited
14.3.11 Fuji Polymer Industries Co., Ltd.
14.3.12 Parker Hannifin Corp
14.3.13 Momentive Performance Materials, Inc.
14.3.14 Dongguan Sheen Electronic Technology Co., Ltd.
14.3.15 T-Global Technology Co., Ltd.
