Market Overview:
Thermal interface materials (TIMs) are used to fill the air gaps between heat-generating components and heat sinks in order to improve the thermal conductivity. They are also used as a sealant to prevent the leakage of air and moisture. The global thermal interface materials for 5G market is expected to grow at a CAGR of 7.5% during the forecast period 2018-2030. The shell structure type is expected to hold the largest share of the global thermal interface materials for 5G market by 2030 owing to its high thermal conductivity and low price point. The spherical structure type is expected to be the fastest growing segment during the forecast period, owing to its superior properties such as low Thermal Resistance (TR) and high Thermal Conductivity (TC).
Product Definition:
Thermal Interface Materials (TIMs) are materials that are used to improve the thermal conductivity between two surfaces. They are often used to fill in air gaps between components, which can reduce the overall efficiency of a system. TIMs can also be used to protect sensitive components from overheating.
Shell Structure:
5G is a high frequency, next-generation mobile network standard. It provides enhanced data capacity and low latency connectivity than the present 4G technology. The primary driver for 5G technology is its ability to cater to the growing demand for ultra-reliable Low Latency Connectivity (ULC) across various industry verticals such as automotive, public safety & government, healthcare & life sciences, and industrial manufacturing.
Spherical Structure:
The spherical structure is a type of micro-structure that is used in thermal interface materials for 5G. The spherical structure has a large surface area to volume ratio which provides an opportunity for heat transfer enhancement. In addition, the shape also offers low density and high porosity which makes it suitable as a heat spreader or dissipator in electronic devices.
Application Insights:
The airborne radome segment accounted for the largest market share in 2017 and is projected to expand at a CAGR of XX% from 2018 to 2030. The growth can be attributed to the growing adoption of Global Thermal Interface Materials (TTIM) by telecom companies, equipment manufacturers and service providers in order to enhance the performance of antennas on mobile phones, tablets, laptops and desktops. Furthermore, demand for these products is expected from wireless infrastructure operators as they provide enhanced signal reception while protecting users from extreme weather conditions such as snow or rain caused by sudden changes in temperature.
The ground-based radome segment accounted for a significant market share in 2017 owing to its wide application scope including military & aerospace applications where high durability.
Regional Analysis:
Asia Pacific regional market accounted for the largest share in 2017 and is expected to continue its dominance over the forecast period. The presence of key manufacturers, technological advancements, and favorable government regulations are some of the major factors contributing to this growth. China is anticipated to dominate this region owing to its low manufacturing cost as compared to other countries in the world. Moreover, it has a large consumer base which makes it an ideal market for global vendors looking for lucrative opportunities in emerging economies with high growth potentials.
The European regional market also held a significant share in 2017 due to growing demand from various end-use industries such as telecommunication & IT and aerospace & defense industry coupled with rising investments by governments across several countries including Germany, France, Italy etc.
Growth Factors:
- Increased demand for high-performance mobile devices
- Growing trend of miniaturization in electronic devices
- Proliferation of next-generation wireless technologies (5G)
- Rising demand for thermal management solutions in electronics industry
- Increasing adoption of advanced packaging technologies
Scope Of The Report
Report Attributes
Report Details
Report Title
Thermal Interface Materials for 5G Market Research Report
By Type
Shell Structure, Spherical Structure, Others
By Application
Airborne Radome, Ground-Based Radome, Shipboard Radome
By Companies
General Dynamics, Saint-Gobain, Cobham (Meggitt), Nordam, ATK, AVIC, L-3 ESSCO, Harris, Raytheon, Kelvin Hughes, Royal Engineered Composites, Infinite Technologies, CPI, Leonardo, Jenoptik, HTC
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
135
Number of Tables & Figures
95
Customization Available
Yes, the report can be customized as per your need.
Global Thermal Interface Materials for 5G Market Report Segments:
The global Thermal Interface Materials for 5G market is segmented on the basis of:
Types
Shell Structure, Spherical Structure, Others
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Airborne Radome, Ground-Based Radome, Shipboard Radome
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- General Dynamics
- Saint-Gobain
- Cobham (Meggitt)
- Nordam
- ATK
- AVIC
- L-3 ESSCO
- Harris
- Raytheon
- Kelvin Hughes
- Royal Engineered Composites
- Infinite Technologies
- CPI
- Leonardo
- Jenoptik
- HTC
Highlights of The Thermal Interface Materials for 5G Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Shell Structure
- Spherical Structure
- Others
- By Application:
- Airborne Radome
- Ground-Based Radome
- Shipboard Radome
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Thermal Interface Materials for 5G Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Thermal interface materials (TIMs) are used in 5G networks to help keep the devices and antennas connected. They help create a thermal bridge between the device and antenna, which helps reduce heat buildup.
Some of the key players operating in the thermal interface materials for 5g market are General Dynamics, Saint-Gobain, Cobham (Meggitt), Nordam, ATK, AVIC, L-3 ESSCO, Harris, Raytheon, Kelvin Hughes, Royal Engineered Composites, Infinite Technologies, CPI, Leonardo, Jenoptik, HTC.
The thermal interface materials for 5g market is expected to grow at a compound annual growth rate of 7.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Thermal Interface Materials for 5G Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Thermal Interface Materials for 5G Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Thermal Interface Materials for 5G Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Thermal Interface Materials for 5G Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Thermal Interface Materials for 5G Market Size & Forecast, 2020-2028
4.5.1 Thermal Interface Materials for 5G Market Size and Y-o-Y Growth
4.5.2 Thermal Interface Materials for 5G Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Shell Structure
5.2.2 Spherical Structure
5.2.3 Others
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Airborne Radome
6.2.2 Ground-Based Radome
6.2.3 Shipboard Radome
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Thermal Interface Materials for 5G Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Thermal Interface Materials for 5G Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Shell Structure
9.6.2 Spherical Structure
9.6.3 Others
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Airborne Radome
9.10.2 Ground-Based Radome
9.10.3 Shipboard Radome
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Shell Structure
10.6.2 Spherical Structure
10.6.3 Others
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Airborne Radome
10.10.2 Ground-Based Radome
10.10.3 Shipboard Radome
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Shell Structure
11.6.2 Spherical Structure
11.6.3 Others
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Airborne Radome
11.10.2 Ground-Based Radome
11.10.3 Shipboard Radome
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Shell Structure
12.6.2 Spherical Structure
12.6.3 Others
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Airborne Radome
12.10.2 Ground-Based Radome
12.10.3 Shipboard Radome
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Shell Structure
13.6.2 Spherical Structure
13.6.3 Others
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Airborne Radome
13.10.2 Ground-Based Radome
13.10.3 Shipboard Radome
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Thermal Interface Materials for 5G Market: Competitive Dashboard
14.2 Global Thermal Interface Materials for 5G Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 General Dynamics
14.3.2 Saint-Gobain
14.3.3 Cobham (Meggitt)
14.3.4 Nordam
14.3.5 ATK
14.3.6 AVIC
14.3.7 L-3 ESSCO
14.3.8 Harris
14.3.9 Raytheon
14.3.10 Kelvin Hughes
14.3.11 Royal Engineered Composites
14.3.12 Infinite Technologies
14.3.13 CPI
14.3.14 Leonardo
14.3.15 Jenoptik
14.3.16 HTC
