Market Overview:
The global thermal interface pads market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth of this market can be attributed to the increasing demand for consumer electronics and power supply units across the globe. Additionally, the growing demand for telecom equipment is also propelling the growth of this market. On the basis of type, phase change material (PCM) held a major share in 2017 and is expected to continue its dominance during the forecast period. This can be attributed to PCMs superior thermal conductivity as compared to other types of thermal interface pads available in the market.
Product Definition:
Thermal Interface Pads are thin sheets of material, typically made from silicone, copper or aluminum that helps to improve the thermal conductivity between two objects. Thermal Interface Pads can help to increase the efficiency of heat transfer between two objects and can be used in a variety of applications, including CPU cooling and LED lighting.
Phase Change Material:
Phase change material is a solid that changes its physical properties when heated or chilled. The most common phase change materials are waxes, salts, and sugars. Waxes are used in applications where high thermal conductivity is required such as solders in electronics and automotive parts due to their ability to melt at low temperatures. Salts including table salt, Kosher salt, etc.
Thermal Grease:
Thermal greases are used to transfer heat between two surfaces. It is also used as a thermal adhesive to enable the adhesion of one material to another which has low coefficient of thermal expansion and is not compatible with the first. The product helps in increasing the efficiency of heat spreading and thus, plays an important role in providing efficient cooling for electronic devices.
Application Insights:
The consumer electronics segment held the largest market share in 2017 and is projected to expand at a CAGR of XX% over the forecast period. The growth can be attributed to increasing demand for smartphones, tablets, personal computers and other electronic devices across the globe. Moreover, rapid technological advancements coupled with growing demand for high-tech products are expected to boost industry growth over the coming years.
Telecom equipment is anticipated to be one of the fastest-growing segments owing to extensive usage of telecom infrastructure across various regions including Asia Pacific and Middle East & Africa where it faces extreme environmental conditions such as hot sun rays beating down directly on telecom tower while also getting exposed to freezing temperatures at night time which may cause damage or malfunctioning in future if not properly taken care off that includes installing TIPS (Thermal Interface Pads & Stacks) along with its associated components like PCB (Printed Circuit Board).
Regional Analysis:
Asia Pacific regional market accounted for the largest share in 2017 and is expected to continue its dominance over the forecast period. The growth of this region is attributed to rapid industrialization, which has triggered the demand from various application sectors such as consumer electronics, power supply units, telecom equipment.
The increasing number of manufacturing facilities in China owing to low labor costs coupled with easy access to capital is one of the major factors driving regional market growth. In addition, growing penetration of solar energy generation systems due to rising government initiatives such as “Make in India†campaign by Indian government will further drive industry expansion over the next eight years.
North America and Europe are anticipated to witness steady growth rates owing their high technological advancement compared with Asia Pacific countries along with growing awareness regarding thermal interface material usage within their applications sector only if it provides maximum efficiency during extreme conditions such as high & low temperature or moisture content thus affecting product demand & sales negatively.
Growth Factors:
- Increasing demand for miniaturization in electronic devices: Thermal Interface Pads help in dissipating heat from electronic devices, thereby enabling their miniaturization. This is a key growth driver for the market.
- Rising demand for thermal management solutions: With the increase in power consumption and rise in temperature of semiconductor devices, there is an increased demand for thermal management solutions, which is benefiting the Thermal Interface Pads market.
- Growing adoption of LED lighting: The increasing adoption of LED lighting is resulting in higher heat generation, thereby leading to an increased need for effective thermal management solutions, including Thermal Interface Pads.
- Proliferation of smart electronics: The proliferation of smart electronics has resulted in a surge in the number of microprocessors and other semiconductor-based components used across various applications, which is driving the need for better thermal management solutions and consequently benefitting the Thermal Interface Pads market growth rate positively . 5) Technological advancements: Continuous technological advancements are resulting not only into smaller form factors but also more powerful processors that generate more heat than ever before; this is further fueling the demand for better thermal interface pads
Scope Of The Report
Report Attributes
Report Details
Report Title
Thermal Interface Pads Market Research Report
By Type
Phase Change Material, Thermal Grease, Thermal Pads
By Application
Consumer Electronics, Power Supply Units, Telecom Equipment
By Companies
Semiconductor Packaging Materials, DOW Corning, Henkel AG, Laird Technologies, Parker Hannifin Corp, Honeywell International, The Bergquist Company, Stockwell Elastomerics, Fujipoly, Graftech International Holding, 3M Company
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
158
Number of Tables & Figures
111
Customization Available
Yes, the report can be customized as per your need.
Global Thermal Interface Pads Market Report Segments:
The global Thermal Interface Pads market is segmented on the basis of:
Types
Phase Change Material, Thermal Grease, Thermal Pads
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Power Supply Units, Telecom Equipment
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Semiconductor Packaging Materials
- DOW Corning
- Henkel AG
- Laird Technologies
- Parker Hannifin Corp
- Honeywell International
- The Bergquist Company
- Stockwell Elastomerics
- Fujipoly
- Graftech International Holding
- 3M Company
Highlights of The Thermal Interface Pads Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Phase Change Material
- Thermal Grease
- Thermal Pads
- By Application:
- Consumer Electronics
- Power Supply Units
- Telecom Equipment
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Thermal Interface Pads Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Thermal interface pads are small pieces of material that are placed between the CPU and the cooler to help dissipate heat.
Some of the major players in the thermal interface pads market are Semiconductor Packaging Materials, DOW Corning, Henkel AG, Laird Technologies, Parker Hannifin Corp, Honeywell International, The Bergquist Company, Stockwell Elastomerics, Fujipoly, Graftech International Holding, 3M Company.
The thermal interface pads market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Thermal Interface Pads Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Thermal Interface Pads Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Thermal Interface Pads Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Thermal Interface Pads Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Thermal Interface Pads Market Size & Forecast, 2018-2028
4.5.1 Thermal Interface Pads Market Size and Y-o-Y Growth
4.5.2 Thermal Interface Pads Market Absolute $ Opportunity
Chapter 5 Global Thermal Interface Pads Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Thermal Interface Pads Market Size Forecast by Type
5.2.1 Phase Change Material
5.2.2 Thermal Grease
5.2.3 Thermal Pads
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Thermal Interface Pads Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Thermal Interface Pads Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Power Supply Units
6.2.3 Telecom Equipment
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Thermal Interface Pads Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Thermal Interface Pads Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Thermal Interface Pads Analysis and Forecast
9.1 Introduction
9.2 North America Thermal Interface Pads Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Thermal Interface Pads Market Size Forecast by Type
9.6.1 Phase Change Material
9.6.2 Thermal Grease
9.6.3 Thermal Pads
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Thermal Interface Pads Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Power Supply Units
9.10.3 Telecom Equipment
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Thermal Interface Pads Analysis and Forecast
10.1 Introduction
10.2 Europe Thermal Interface Pads Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Thermal Interface Pads Market Size Forecast by Type
10.6.1 Phase Change Material
10.6.2 Thermal Grease
10.6.3 Thermal Pads
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Thermal Interface Pads Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Power Supply Units
10.10.3 Telecom Equipment
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Thermal Interface Pads Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Thermal Interface Pads Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Thermal Interface Pads Market Size Forecast by Type
11.6.1 Phase Change Material
11.6.2 Thermal Grease
11.6.3 Thermal Pads
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Thermal Interface Pads Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Power Supply Units
11.10.3 Telecom Equipment
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Thermal Interface Pads Analysis and Forecast
12.1 Introduction
12.2 Latin America Thermal Interface Pads Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Thermal Interface Pads Market Size Forecast by Type
12.6.1 Phase Change Material
12.6.2 Thermal Grease
12.6.3 Thermal Pads
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Thermal Interface Pads Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Power Supply Units
12.10.3 Telecom Equipment
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Thermal Interface Pads Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Thermal Interface Pads Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Thermal Interface Pads Market Size Forecast by Type
13.6.1 Phase Change Material
13.6.2 Thermal Grease
13.6.3 Thermal Pads
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Thermal Interface Pads Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Power Supply Units
13.10.3 Telecom Equipment
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Thermal Interface Pads Market: Competitive Dashboard
14.2 Global Thermal Interface Pads Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Semiconductor Packaging Materials
14.3.2 DOW Corning
14.3.3 Henkel AG
14.3.4 Laird Technologies
14.3.5 Parker Hannifin Corp
14.3.6 Honeywell International
14.3.7 The Bergquist Company
14.3.8 Stockwell Elastomerics
14.3.9 Fujipoly
14.3.10 Graftech International Holding
14.3.11 3M Company
