Market Overview:
The global thermally conductive materials for electronics market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The growth of this market can be attributed to the increasing demand for consumer electronics, home appliances, and telecommunication devices. In addition, the growing automotive industry is also contributing to the growth of this market. The global thermally conductive materials for electronics market can be segmented on the basis of type into thermally conductive potting compound, thermally conductive structural adhesives, thermal paste, and thermally conductive tape. Of these segments, the thermal paste segment is expected to grow at a higher CAGR during the forecast period from 2018 to 2030. This growth can be attributed to its high thermal performance and low cost as compared with other types of thermallyconductive materials available in the market. .
Product Definition:
Thermally conductive materials are used in electronic devices and circuits to help dissipate heat. This is important because if too much heat builds up, it can damage or destroy the device. Thermally conductive materials help keep the temperature of the device under control.
Thermally Conductive Potting Compound:
The global market for thermally conductive potting compounds is expected to grow at a CAGR of XX% from 2016 to 2024. Thermally conductive potting compounds are used in the manufacturing of thermal interface materials, heat spreaders, and heat sinks which are widely used in electronic devices such as smartphones and tablets.
Thermally Conductive Structural Adhesives:
The global market size was valued at USD 8.0 million in 2016 and is expected to grow at a CAGR of XX% from 2017 to 2022. The rising demand for thermally conductive materials in electronics is anticipated to drive the growth over the forecast period.
Application Insights:
The market is segmented by application into consumer electronics, home appliances, telecommunications, automotive & transportation, energy and other applications. The home appliance sector is expected to witness the highest growth over the forecast period owing to increasing demand for technologically advanced products with enhanced features. In addition there are a number of manufacturers in this region who have introduced new products in recent years which has increased the scope for growth.
Telecommunication was one of the largest application segments accounting for over 30% share of global revenue in 2017 due to growing demand from end-use industries such as data centers and IT offices. Thermally conductive materials help reduce heat dissipation from electronic devices through conduction and convection radiation which results in improved operational efficiency leading to lower power consumption and cost reduction. These factors are anticipated to drive product demand across telecommunication industry over the forecast period thereby contributing towards overall regional market development during future phases of analysis.
Regional Analysis:
Asia Pacific is estimated to be the largest regional market over the forecast period owing to rapid industrialization and increasing adoption of electric vehicles. The region is characterized by presence of a large number of manufacturers, who are actively engaged in developing innovative products incorporating these materials. Increasing demand for consumer electronics in countries like China and India on account of rising disposable income coupled with growing penetration of global players in these markets will drive industry growth over the next eight years.
North America was valued at USD X million in 2017 and is expected to witness steady growth rate over the forecast period owing to high acceptance among end-users for its superior performance characteristics including low thermal resistance as compared to other alternatives available out there In addition, growing demand from major application sectors including automotive, energy & power, aerospace & defense has further propelled industry expansion across this region.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the semiconductor and electronics industries
- Growing popularity of thermal management solutions
- Proliferation of portable electronic devices
- Technological advancements in thermally conductive materials
Scope Of The Report
Report Attributes
Report Details
Report Title
Thermally Conductive Materials for Electronics Market Research Report
By Type
Thermally Conductive Potting Compound, Thermally Conductive Structural Adhesives, Thermal Paste, Thermally Conductive Tape
By Application
Consumer Electronics, Home Appliance, Telecommunication, Automotive, Energy, Others
By Companies
Laird, Shin-Etsu, Dow, Henkel, M, Parker Hannifin, Momentive, Hönle, Shanghai Huitian New Material, Aok Technology, Hunan Boxiang New Material
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
187
Number of Tables & Figures
131
Customization Available
Yes, the report can be customized as per your need.
Global Thermally Conductive Materials for Electronics Market Report Segments:
The global Thermally Conductive Materials for Electronics market is segmented on the basis of:
Types
Thermally Conductive Potting Compound, Thermally Conductive Structural Adhesives, Thermal Paste, Thermally Conductive Tape
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Consumer Electronics, Home Appliance, Telecommunication, Automotive, Energy, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Laird
- Shin-Etsu
- Dow
- Henkel
- M
- Parker Hannifin
- Momentive
- Hönle
- Shanghai Huitian New Material
- Aok Technology
- Hunan Boxiang New Material
Highlights of The Thermally Conductive Materials for Electronics Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Thermally Conductive Potting Compound
- Thermally Conductive Structural Adhesives
- Thermal Paste
- Thermally Conductive Tape
- By Application:
- Consumer Electronics
- Home Appliance
- Telecommunication
- Automotive
- Energy
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Thermally Conductive Materials for Electronics Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Thermally conductive materials are materials that allow heat to flow through them easily. This is important for electronics because it allows the devices to stay cool and operate efficiently. Thermally conductive materials can be made from a variety of substances, including metals, plastics, and composites.
Some of the major players in the thermally conductive materials for electronics market are Laird, Shin-Etsu, Dow, Henkel, M, Parker Hannifin, Momentive, H¶nle, Shanghai Huitian New Material, Aok Technology, Hunan Boxiang New Material.
The thermally conductive materials for electronics market is expected to grow at a compound annual growth rate of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Thermally Conductive Materials for Electronics Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Thermally Conductive Materials for Electronics Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Thermally Conductive Materials for Electronics Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Thermally Conductive Materials for Electronics Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Thermally Conductive Materials for Electronics Market Size & Forecast, 2020-2028
4.5.1 Thermally Conductive Materials for Electronics Market Size and Y-o-Y Growth
4.5.2 Thermally Conductive Materials for Electronics Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Thermally Conductive Potting Compound
5.2.2 Thermally Conductive Structural Adhesives
5.2.3 Thermal Paste
5.2.4 Thermally Conductive Tape
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Consumer Electronics
6.2.2 Home Appliance
6.2.3 Telecommunication
6.2.4 Automotive
6.2.5 Energy
6.2.6 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Thermally Conductive Materials for Electronics Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Thermally Conductive Materials for Electronics Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Thermally Conductive Potting Compound
9.6.2 Thermally Conductive Structural Adhesives
9.6.3 Thermal Paste
9.6.4 Thermally Conductive Tape
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Consumer Electronics
9.10.2 Home Appliance
9.10.3 Telecommunication
9.10.4 Automotive
9.10.5 Energy
9.10.6 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Thermally Conductive Potting Compound
10.6.2 Thermally Conductive Structural Adhesives
10.6.3 Thermal Paste
10.6.4 Thermally Conductive Tape
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Consumer Electronics
10.10.2 Home Appliance
10.10.3 Telecommunication
10.10.4 Automotive
10.10.5 Energy
10.10.6 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Thermally Conductive Potting Compound
11.6.2 Thermally Conductive Structural Adhesives
11.6.3 Thermal Paste
11.6.4 Thermally Conductive Tape
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Consumer Electronics
11.10.2 Home Appliance
11.10.3 Telecommunication
11.10.4 Automotive
11.10.5 Energy
11.10.6 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Thermally Conductive Potting Compound
12.6.2 Thermally Conductive Structural Adhesives
12.6.3 Thermal Paste
12.6.4 Thermally Conductive Tape
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Consumer Electronics
12.10.2 Home Appliance
12.10.3 Telecommunication
12.10.4 Automotive
12.10.5 Energy
12.10.6 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Thermally Conductive Potting Compound
13.6.2 Thermally Conductive Structural Adhesives
13.6.3 Thermal Paste
13.6.4 Thermally Conductive Tape
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Consumer Electronics
13.10.2 Home Appliance
13.10.3 Telecommunication
13.10.4 Automotive
13.10.5 Energy
13.10.6 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Thermally Conductive Materials for Electronics Market: Competitive Dashboard
14.2 Global Thermally Conductive Materials for Electronics Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Laird
14.3.2 Shin-Etsu
14.3.3 Dow
14.3.4 Henkel
14.3.5 M
14.3.6 Parker Hannifin
14.3.7 Momentive
14.3.8 Hönle
14.3.9 Shanghai Huitian New Material
14.3.10 Aok Technology
14.3.11 Hunan Boxiang New Material
