Market Overview:
The global thick layer photoresists market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for advanced semiconductor devices and rising demand for miniaturization of electronic components. Thick layer photoresists are used in various applications such as circuit board wiring, micro bump, flip chip bump, MEMS and electrodeposition. Among these applications, the MEMS segment is expected to witness the highest growth during the forecast period owing to its growing demand from end-use industries such as automotive and medical sectors. Geographically, North America is expected to hold the largest share of the global thick layer photoresists market in 2018 followed by Europe and Asia Pacific.
Product Definition:
Thick Layer photoresists are a type of photoresist that is thicker than the standard layer thickness. This type of resist is used when higher resolution and line accuracy are desired. The importance of thick layer photoresists is that they provide better resolution and line accuracy than standard layer photoresists.
Positive Polarity:
Positive polarity is a type of electric charge that attracts electron density in the uppermost layer of a photoresist. As the positive polarity voltage is increased, more and more charges are brought to the surface of the wafer, ultimately building up an enormous potential difference between any given point on the wafer and its corresponding point on top ofthe glass.
Negative Polarity:
NEGATIVE POLARITY is a property exhibited by some chemical substances, which enables them to grow toward the anode instead of cathode when exposed to an electric field. In other words, they are attracted to the high voltage side of the cell. Polarity in photoresists can be represented by two types: negative and positive. The majority of photoresist materials have negative polarity; however, there are also some that have positive polarity.
Application Insights:
Circuit board wiring was the largest application segment in 2016 and is expected to continue its dominance over the forecast period. The growth of this market can be attributed to increasing demand for photoresist solutions in high volume manufacturing of integrated circuits. Micro bumping is anticipated to witness significant growth over the forecast period owing to its rising applications in microelectronics, including but not limited by MEMS devices and flat panel displays.
Flip chip bumping is also expected to grow at a lucrative rate owing to its rising applications across various industry verticals such as semiconductor packaging, automotive electronics, consumer electronics and communication equipment among others. Electrodeposition will witness moderate growth during the forecast period due to increased demand for low cost production lines with enhanced efficiency levels that are capable of handling higher volumes on a consistent basis without compromising quality or performance levels required by end-users or consumers worldwide.
Regional Analysis:
The Asia Pacific region is expected to witness significant growth over the forecast period owing to the presence of key players in countries such as China, Japan, and South Korea. The increasing demand for high-quality semiconductor devices from various end-use industries such as Automotive & Transportation, Consumer Electronics has led this regional market growth.
In addition, growing investments by leading players in R&D activities coupled with rising consumer electronics production are anticipated to drive the APAC region’s overall industry expansion over the next eight years. Rising disposable income especially in developing countries like India and China is also a major factor driving product demand within this region.
North America held a substantial share of global Thick Layer Photoresists (TLP) consumption due to its well established automotive manufacturing sector along with being an early adopter for new technologies within electronic components industry space.
Growth Factors:
- Increasing demand for semiconductor and electronics products
- Rising demand for advanced packaging and 3D printing technology
- Growing trend of miniaturization in electronic devices
- Proliferation of nanotechnology and MEMS (micro-electro-mechanical systems) applications
- Increasing investments in R&D by leading photoresist manufacturers
Scope Of The Report
Report Attributes
Report Details
Report Title
Thick Layer Photoresists Market Research Report
By Type
Positive Polarity, Negative Polarity
By Application
Circuit Board Wiring, Micro Bump, Flip Chip Bump, MEMS, Electrodeposition
By Companies
JSR, Merck Group, Allresist, DuPont, Shin-Etsu MicroSi, Showa Denko, TOK
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
172
Number of Tables & Figures
121
Customization Available
Yes, the report can be customized as per your need.
Global Thick Layer Photoresists Market Report Segments:
The global Thick Layer Photoresists market is segmented on the basis of:
Types
Positive Polarity, Negative Polarity
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Circuit Board Wiring, Micro Bump, Flip Chip Bump, MEMS, Electrodeposition
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- JSR
- Merck Group
- Allresist
- DuPont
- Shin-Etsu MicroSi
- Showa Denko
- TOK
Highlights of The Thick Layer Photoresists Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Positive Polarity
- Negative Polarity
- By Application:
- Circuit Board Wiring
- Micro Bump
- Flip Chip Bump
- MEMS
- Electrodeposition
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Thick Layer Photoresists Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Thick layer photoresists are a type of photoresist that have a thicker film than standard photoresists. This makes the film more resistant to etching and other chemical processes.
Some of the key players operating in the thick layer photoresists market are JSR, Merck Group, Allresist, DuPont, Shin-Etsu MicroSi, Showa Denko, TOK.
The thick layer photoresists market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Thick Layer Photoresists Market Overview 4.1 Introduction 4.1.1 Market Taxonomy 4.1.2 Market Definition 4.1.3 Macro-Economic Factors Impacting the Market Growth 4.2 Thick Layer Photoresists Market Dynamics 4.2.1 Market Drivers 4.2.2 Market Restraints 4.2.3 Market Opportunity 4.3 Thick Layer Photoresists Market - Supply Chain Analysis 4.3.1 List of Key Suppliers 4.3.2 List of Key Distributors 4.3.3 List of Key Consumers 4.4 Key Forces Shaping the Thick Layer Photoresists Market 4.4.1 Bargaining Power of Suppliers 4.4.2 Bargaining Power of Buyers 4.4.3 Threat of Substitution 4.4.4 Threat of New Entrants 4.4.5 Competitive Rivalry 4.5 Global Thick Layer Photoresists Market Size & Forecast, 2020-2028 4.5.1 Thick Layer Photoresists Market Size and Y-o-Y Growth 4.5.2 Thick Layer Photoresists Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Positive Polarity
5.2.2 Negative Polarity
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Circuit Board Wiring
6.2.2 Micro Bump
6.2.3 Flip Chip Bump
6.2.4 MEMS
6.2.5 Electrodeposition
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Thick Layer Photoresists Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Thick Layer Photoresists Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Positive Polarity
9.6.2 Negative Polarity
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Circuit Board Wiring
9.10.2 Micro Bump
9.10.3 Flip Chip Bump
9.10.4 MEMS
9.10.5 Electrodeposition
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Positive Polarity
10.6.2 Negative Polarity
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Circuit Board Wiring
10.10.2 Micro Bump
10.10.3 Flip Chip Bump
10.10.4 MEMS
10.10.5 Electrodeposition
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Positive Polarity
11.6.2 Negative Polarity
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Circuit Board Wiring
11.10.2 Micro Bump
11.10.3 Flip Chip Bump
11.10.4 MEMS
11.10.5 Electrodeposition
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Positive Polarity
12.6.2 Negative Polarity
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Circuit Board Wiring
12.10.2 Micro Bump
12.10.3 Flip Chip Bump
12.10.4 MEMS
12.10.5 Electrodeposition
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Positive Polarity
13.6.2 Negative Polarity
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Circuit Board Wiring
13.10.2 Micro Bump
13.10.3 Flip Chip Bump
13.10.4 MEMS
13.10.5 Electrodeposition
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Thick Layer Photoresists Market: Competitive Dashboard
14.2 Global Thick Layer Photoresists Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 JSR
14.3.2 Merck Group
14.3.3 Allresist
14.3.4 DuPont
14.3.5 Shin-Etsu MicroSi
14.3.6 Showa Denko
14.3.7 TOK