Market Overview:
The global thin wafers temporary bonding equipment market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductor devices and advanced packaging solutions across the globe. In addition, the growing trend of miniaturization in electronic devices is also fueling the demand for thin wafers temporary bonding equipment. Based on type, the global thin wafers temporary bonding equipment market can be segmented into semi-automatic bonding equipment and fully automatic bonding equipment. The semi-automatic segment is expected to account for a larger share of the market in 2018 owing to its low cost and easy operability as compared to fully automatic bonders. However, with advancements in technology, fully automatic bonders are becoming more popular among end users due their high throughput and accuracy levels. Based on application, MEMS accounted for a major share of the global thin wafers temporary bonding equipment market in 2017 owing to its wide adoption across various industries such as automotive, aerospace & defense, medical & healthcare, and consumer electronics among others.
Product Definition:
Thin wafers temporary bonding equipment is used to temporarily bond two thin wafers together. This is important because it allows the wafers to be handled as a single unit, which makes them easier to transport and reduces the risk of damage.
Semi-Automatic Bonding Equipment:
Semi-automatic bonding equipment is used to bond and temporarily hold the wafer during various processes such as cleaning, pre-bond, actual bond and post-clean. The growth factor for semi automatic bonding equipment market is high demand from the microelectronics industry which has led to an increase in research & development activities.
The semiconductor industry has witnessed a tremendous rise over the past few years owing to technological advancements resulting in increased production of integrated circuits (IC).
Fully Automatic Bonding Equipment:
Fully automatic bonding equipment and it's usage in thin wafers temporary bonding equipment market is expected to grow at a significant rate over the forecast period. The growth of this market can be attributed to several factors such as growing demand for semiconductors, technological advancements, and increasing investments by manufacturers in order to meet consumer demands.
Application Insights:
The market is segmented by application into MEMS, advanced packaging, CMOS and others. The others segment includes the semiconductor industry where thin wafers are used for manufacturing various products such as solar cells and micro-electromechanical systems (MEMS). Advanced packaging is expected to be the fastest-growing application over the forecast period owing to increasing demand from high technology industries.
Thin wafers are widely used in manufacturing of integrated circuits (ICs) that are further utilized in a variety of end-use applications including mobile phones, data communication equipment and computers among others. The rapid growth of electronics industry across various regions has led to an increased demand for ICs which has subsequently boosted the product usage over recent years.
Regional Analysis:
Asia Pacific dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth of this region can be attributed to increasing demand for semiconductor manufacturing. China, Taiwan Semiconductor Manufacturing Company (TSMC), and Samsung are among the top 10 global manufacturers of semiconductors. Thus, Asia Pacific has a strong base for Thin Wafers Temporary Bonding Equipment production as well as consumption owing to presence of major players such as Foxconn Technology Group Co., Ltd., Micron Technology Inc., and so on.
Europe accounted for more than 20% share in 2017 owing to high demand from packaging application segment due to rising consumer preference toward packaged food products with reduced calorie content coupled with growing health awareness among consumers across Europe countries such as Germany, France, Italy, Spain etc.; which is likely drive TBT equipment market over next eight years or so.
Growth Factors:
- Increasing demand for semiconductor devices: The global semiconductor market is expected to grow at a CAGR of 6.5% from 2016 to 2020, reaching a value of USD 333.8 billion by 2020. This growth is primarily attributed to the increasing demand for semiconductor devices in consumer electronics and automotive applications.
- Rising demand for miniaturized and high-performance devices: With the advent of new technologies such as 3D printing, Internet of Things (IoT), and wearable electronics, there is an increasing demand for miniaturized and high-performance semiconductor devices. Thin wafers temporary bonding equipment helps in fabricating these miniature and high-performance devices efficiently and accurately.
- Growing trend of advanced packaging: The trend of advanced packaging involves stacking multiple dies or chips on a single substrate, which improves performance while reducing costs simultaneously. Thin wafers temporary bonding equipment helps in achieving this goal by providing accurate alignment between the dies/chips during bonding process thereby improving yield rates significantly..
Scope Of The Report
Report Attributes
Report Details
Report Title
Thin Wafers Temporary Bonding Equipment Market Research Report
By Type
Semi-Automatic Bonding Equipment, Fully Automatic Bonding Equipment
By Application
MEMS, Advanced Packaging, CMOS
By Companies
EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
144
Number of Tables & Figures
101
Customization Available
Yes, the report can be customized as per your need.
Global Thin Wafers Temporary Bonding Equipment Market Report Segments:
The global Thin Wafers Temporary Bonding Equipment market is segmented on the basis of:
Types
Semi-Automatic Bonding Equipment, Fully Automatic Bonding Equipment
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
MEMS, Advanced Packaging, CMOS
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- EV Group
- SUSS MicroTec
- Tokyo Electron
- AML
- Mitsubishi
- Ayumi Industry
- SMEE
Highlights of The Thin Wafers Temporary Bonding Equipment Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Semi-Automatic Bonding Equipment
- Fully Automatic Bonding Equipment
- By Application:
- MEMS
- Advanced Packaging
- CMOS
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Thin Wafers Temporary Bonding Equipment Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
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- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Thin wafers temporary bonding equipment is a machine that uses heat and pressure to temporarily bond two or more pieces of metal together. This type of equipment is used in manufacturing, engineering, and other industries where precision is important.
Some of the major companies in the thin wafers temporary bonding equipment market are EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE.
The thin wafers temporary bonding equipment market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Thin Wafers Temporary Bonding Equipment Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Thin Wafers Temporary Bonding Equipment Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Thin Wafers Temporary Bonding Equipment Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Thin Wafers Temporary Bonding Equipment Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Thin Wafers Temporary Bonding Equipment Market Size & Forecast, 2020-2028
4.5.1 Thin Wafers Temporary Bonding Equipment Market Size and Y-o-Y Growth
4.5.2 Thin Wafers Temporary Bonding Equipment Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Semi-Automatic Bonding Equipment
5.2.2 Fully Automatic Bonding Equipment
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 MEMS
6.2.2 Advanced Packaging
6.2.3 CMOS
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Thin Wafers Temporary Bonding Equipment Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Thin Wafers Temporary Bonding Equipment Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Semi-Automatic Bonding Equipment
9.6.2 Fully Automatic Bonding Equipment
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 MEMS
9.10.2 Advanced Packaging
9.10.3 CMOS
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Semi-Automatic Bonding Equipment
10.6.2 Fully Automatic Bonding Equipment
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 MEMS
10.10.2 Advanced Packaging
10.10.3 CMOS
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Semi-Automatic Bonding Equipment
11.6.2 Fully Automatic Bonding Equipment
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 MEMS
11.10.2 Advanced Packaging
11.10.3 CMOS
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Semi-Automatic Bonding Equipment
12.6.2 Fully Automatic Bonding Equipment
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 MEMS
12.10.2 Advanced Packaging
12.10.3 CMOS
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Semi-Automatic Bonding Equipment
13.6.2 Fully Automatic Bonding Equipment
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 MEMS
13.10.2 Advanced Packaging
13.10.3 CMOS
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Thin Wafers Temporary Bonding Equipment Market: Competitive Dashboard
14.2 Global Thin Wafers Temporary Bonding Equipment Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 EV Group
14.3.2 SUSS MicroTec
14.3.3 Tokyo Electron
14.3.4 AML
14.3.5 Mitsubishi
14.3.6 Ayumi Industry
14.3.7 SMEE
