Market Overview:
The global through glass via (TGV) interposers market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The growth of this market can be attributed to the increasing demand for miniaturization and higher performance in electronic devices, rising demand for 3D ICs, and growing adoption of TGV interposers in MEMS applications. However, the high cost associated with TGV interposers may restrain the growth of this market to some extent during the forecast period.
 Interposers Industry Outlook.svg)
Product Definition:
A Through Glass Via (TGV) Interposer is a device that allows electronic signals to pass between two pieces of glass. The importance of TGV Interposers is that they allow for the creation of thin, lightweight displays and sensors.
2.5D:
2.5D is a technology that allows the image to be displayed in a manner such that it appears real and three-dimensional on the flat panel display. The 2.5D technology can be applied to any electronic device with a display, including smartphones, televisions, monitors and so on; however, it is most commonly used for mobile phones due to their large displays screens as they provide an ideal surface upon which 2D images can be projected without compromising image quality or accuracy.
3D:
3D is an optical technology that enhances the viewing experience by providing a three-dimensional view of images. It has gained popularity in recent years due to its ability to provide improved image quality and realistic effects. 3D films have been gaining traction among audiences, which is expected to drive demand over the forecast period.
The Through Glass Via (TGV) interposers market can be segmented based on type into TGV base, glass substrate, and electronics assembly.
Application Insights:
The market for TGV interposers is segmented on the basis of application into microelectronics, RF, optics, MEMs and others. The RF segment held the largest share in 2017 owing to increasing demand for high-speed trains from countries such as China and India. These are expected to be major markets over the forecast period owing to rapid urbanization along with rising per capita income levels in developing regions such as Asia Pacific and Latin America.
MEMS is anticipated to be one of the fastest-growing segments during the forecast period due to increasing demand for small size components that offer enhanced performance at a lower cost than traditional counterparts. Moreover, growing adoption of MEMS technology across various end-use industries including healthcare & medical devices, automotive & transportation systems and consumer electronics is expected drive growth over the coming years.
Regional Analysis:
North America dominated the global through glass via interposers market in 2016 with a revenue share of over 35%. The growth can be attributed to the presence of major players such as Corning Incorporated, Furukawa Electric Co., Ltd., and Panasonic Corporation. In addition, increasing demand for high-speed trains is expected to drive regional product demand over the forecast period.
Asia Pacific is anticipated to witness significant growth owing to rising investments in railways infrastructure by China and Japan. For instance, according to International Union for Railways (UIC), both China and Japan are spending huge amounts on railroads expansion projects which include construction of new railway lines as well as improvement of existing railway infrastructure. Such factors are projected to boost regional product demand over the forecast period.
Growth Factors:
- Increasing demand for miniaturization in electronics industry
- Growing trend of 3D integration in semiconductor industry
- Proliferation of advanced packaging technologies
- Rising demand for high-performance and low-power consumption devices
- Growing trend of system-in-package (SiP) and heterogeneous integration
Scope Of The Report
Report Attributes
Report Details
Report Title
Through Glass Via (TGV) Interposers Market Research Report
By Type
2.5D, 3D
By Application
MEMs, RF, Optics, Others
By Companies
Kiso Micro Co, Plan Optik AG, Ushio, Corning, D Glass Solutions, Inc, Triton Microtechnologies, Inc
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
127
Number of Tables & Figures
89
Customization Available
Yes, the report can be customized as per your need.
Global Through Glass Via (TGV) Interposers Market Report Segments:
The global Through Glass Via (TGV) Interposers market is segmented on the basis of:
Types
2.5D, 3D
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
MEMs, RF, Optics, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Kiso Micro Co
- Plan Optik AG
- Ushio
- Corning
- D Glass Solutions, Inc
- Triton Microtechnologies, Inc
 Interposers Market Overview.svg)
Highlights of The Through Glass Via (TGV) Interposers Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 2.5D
- 3D
- By Application:
- MEMs
- RF
- Optics
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Through Glass Via (TGV) Interposers Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 Interposers Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Through Glass Via (TGV) interposers are a type of optical fiber connector that allow for the connection of two or more fibers in a single cable. They are inserted into the ends of the fibers, and their light guides direct light down the length of each fiber. This allows for greater bandwidth and improved signal quality compared to traditional connectors.
Some of the key players operating in the through glass via (tgv) interposers market are Kiso Micro Co, Plan Optik AG, Ushio, Corning, D Glass Solutions, Inc, Triton Microtechnologies, Inc.
The through glass via (tgv) interposers market is expected to register a CAGR of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Through Glass Via (TGV) Interposers Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Through Glass Via (TGV) Interposers Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Through Glass Via (TGV) Interposers Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Through Glass Via (TGV) Interposers Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Through Glass Via (TGV) Interposers Market Size & Forecast, 2020-2028
4.5.1 Through Glass Via (TGV) Interposers Market Size and Y-o-Y Growth
4.5.2 Through Glass Via (TGV) Interposers Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 2.5D
5.2.2 3D
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 MEMs
6.2.2 RF
6.2.3 Optics
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Through Glass Via (TGV) Interposers Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Through Glass Via (TGV) Interposers Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 2.5D
9.6.2 3D
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 MEMs
9.10.2 RF
9.10.3 Optics
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 2.5D
10.6.2 3D
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 MEMs
10.10.2 RF
10.10.3 Optics
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 2.5D
11.6.2 3D
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 MEMs
11.10.2 RF
11.10.3 Optics
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 2.5D
12.6.2 3D
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 MEMs
12.10.2 RF
12.10.3 Optics
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 2.5D
13.6.2 3D
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 MEMs
13.10.2 RF
13.10.3 Optics
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Through Glass Via (TGV) Interposers Market: Competitive Dashboard
14.2 Global Through Glass Via (TGV) Interposers Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Kiso Micro Co
14.3.2 Plan Optik AG
14.3.3 Ushio
14.3.4 Corning
14.3.5 D Glass Solutions, Inc
14.3.6 Triton Microtechnologies, Inc
