Market Overview:
The global through-silicon vias (TSVs) market is expected to grow at a CAGR of XX% and reach a value of USD XX million by 2030. The market is segmented on the basis of type, application and region. On the basis of type, the market is segmented into 2.5D through-silicon vias and 3D through-silicon vias. On the basis of application, the market is segmented into mobile and consumer electronics, communication equipment, automotive and transportation electronics among others. Regionally, North America dominates the global TSV market followed by Europe due to high demand from end users in these regions for advanced electronic products such as smartphones, tablets etc.
 Industry Outlook.svg)
Product Definition:
A through-silicon via (TSV) is a vertical electrical interconnect made of metal that passes completely through a silicon chip. TSVs are used to connect different layers of the chip, allowing for faster data transfer and more efficient cooling.
2.5D Through-Silicon Vias:
2.5D through-silicon via (2.5D T-SV) is a type of electrical interconnect technology that allows high performance and compactness in electronic devices, compared to conventional wire bond or PCB track methods.
3D Through-Silicon Vias:
3D through-silicon via (3D TSSV) is a new technology that allows electrical signals to be sent and received between two chips in a silicon wafer, without the need for wires. It reduces the cost of manufacturing integrated circuits and helps reduce power consumption by up to 50%. 3D TSSV also enables high bandwidth communication between chips on the same chip as well as across different wafers.
Application Insights:
The mobile and consumer electronics segment accounted for the largest revenue share in 2016. The growth can be attributed to the increasing demand for smartphones across the globe. Moreover, technological advancements such as 4K Ultra-High Definition (UHD) will further propel industry growth over the forecast period. Communication equipment is another prominent application segment of TSVs owing to its rising demand from telecommunication companies for high-speed data transfer services over their infrastructures.
Automotive and transportation electronics is expected to grow at a significant rate during the forecast period due to its rising adoption in various automotive applications including infotainment systems, electric power steering, HVAC (heating, ventilation & air conditioning), lighting systems and safety systems among others. Furthermore, growing R&D activities by major players such as Continental AG., along with new product launches by them will fuel industry expansion over the next eight years ¢â‚¬Å“yes sir! no sir!.
Regional Analysis:
The Asia Pacific region is anticipated to witness the highest growth over the forecast period owing to increasing demand for consumer electronics and mobile phones. The rising adoption of smartphones, tablets, and other related products has led to an increase in the number of mobile internet users across this region. This trend is expected to continue over the next eight years, thereby driving market growth.
Europe accounted for a significant share in 2016 owing to growing demand from several key markets including Germany and U.K., which are among top five smartphone manufacturers globally along with China, Japan, South Korea & India respectively (GSMA 2015).
Growth Factors:
- Increasing demand for miniaturization in electronic devices: The need for smaller, faster, and more efficient electronic devices is driving the demand for TSVs. TSVs allow chips to be interconnected more densely, which leads to improved performance and reduced power consumption.
- Proliferation of 3D ICs: 3D ICs are composed of multiple chips stacked on top of each other, with through-silicon vias connecting them. TSVs are essential for creating 3D ICs, as they provide the necessary interconnections between the different chips.
- Development of advanced packaging technologies: As semiconductor technology continues to advance, so does the need for advanced packaging technologies that can accommodate these new features. TSVs are well-suited for advanced packaging applications due to their high density and low power consumption characteristics.
- Growing interest in heterogeneous integration: Heterogeneous integration refers to the combination of different types of semiconductor materials on a single chip in order to achieve specific functionalities or improve performance characteristics . By using TSVs to connect different types of semiconductors together, heterogeneous integration becomes possible without sacrificing device size or efficiency . This could lead to a number of new applications that wouldn’t be possible with traditional integrated circuits .
Scope Of The Report
Report Attributes
Report Details
Report Title
Through-Silicon Vias (TSVs) Market Research Report
By Type
2.5D Through-Silicon Vias, 3D Through-Silicon Vias
By Application
Mobile And Consumer Electronics, Communication Equipment, Automotive And Transportation Electronics
By Companies
ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung, Tianshui Huatian Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
229
Number of Tables & Figures
161
Customization Available
Yes, the report can be customized as per your need.
Global Through-Silicon Vias (TSVs) Market Report Segments:
The global Through-Silicon Vias (TSVs) market is segmented on the basis of:
Types
2.5D Through-Silicon Vias, 3D Through-Silicon Vias
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Mobile And Consumer Electronics, Communication Equipment, Automotive And Transportation Electronics
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ASE Technology Holding
- Amkor Technology
- Taiwan Semiconductor Manufacturing Company Limited
- Intel Corporation
- GLOBALFOUNDRIES
- JCET Group
- Samsung
- Tianshui Huatian Technology
 Market Overview.svg)
Highlights of The Through-Silicon Vias (TSVs) Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- 2.5D Through-Silicon Vias
- 3D Through-Silicon Vias
- By Application:
- Mobile And Consumer Electronics
- Communication Equipment
- Automotive And Transportation Electronics
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Through-Silicon Vias (TSVs) Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
 Market Statistics.svg)
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Through-silicon vias (TSVs) are a type of interconnect technology that allow electronic devices to connect with each other. TSVs use a thin layer of silicon between two chips, which allows for better signal transmission and less interference.
Some of the major companies in the through-silicon vias (tsvs) market are ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung, Tianshui Huatian Technology.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Through-Silicon Vias (TSVs) Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Through-Silicon Vias (TSVs) Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Through-Silicon Vias (TSVs) Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Through-Silicon Vias (TSVs) Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Through-Silicon Vias (TSVs) Market Size & Forecast, 2020-2028
4.5.1 Through-Silicon Vias (TSVs) Market Size and Y-o-Y Growth
4.5.2 Through-Silicon Vias (TSVs) Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 2.5D Through-Silicon Vias
5.2.2 3D Through-Silicon Vias
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Mobile And Consumer Electronics
6.2.2 Communication Equipment
6.2.3 Automotive And Transportation Electronics
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Through-Silicon Vias (TSVs) Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Through-Silicon Vias (TSVs) Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 2.5D Through-Silicon Vias
9.6.2 3D Through-Silicon Vias
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Mobile And Consumer Electronics
9.10.2 Communication Equipment
9.10.3 Automotive And Transportation Electronics
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 2.5D Through-Silicon Vias
10.6.2 3D Through-Silicon Vias
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Mobile And Consumer Electronics
10.10.2 Communication Equipment
10.10.3 Automotive And Transportation Electronics
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 2.5D Through-Silicon Vias
11.6.2 3D Through-Silicon Vias
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Mobile And Consumer Electronics
11.10.2 Communication Equipment
11.10.3 Automotive And Transportation Electronics
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 2.5D Through-Silicon Vias
12.6.2 3D Through-Silicon Vias
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Mobile And Consumer Electronics
12.10.2 Communication Equipment
12.10.3 Automotive And Transportation Electronics
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 2.5D Through-Silicon Vias
13.6.2 3D Through-Silicon Vias
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Mobile And Consumer Electronics
13.10.2 Communication Equipment
13.10.3 Automotive And Transportation Electronics
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Through-Silicon Vias (TSVs) Market: Competitive Dashboard
14.2 Global Through-Silicon Vias (TSVs) Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ASE Technology Holding
14.3.2 Amkor Technology
14.3.3 Taiwan Semiconductor Manufacturing Company Limited
14.3.4 Intel Corporation
14.3.5 GLOBALFOUNDRIES
14.3.6 JCET Group
14.3.7 Samsung
14.3.8 Tianshui Huatian Technology
