Market Overview:
The global ultra-thin FPC market is expected to grow at a CAGR of 9.5% during the forecast period from 2018 to 2030. The growth in this market can be attributed to the increasing demand for wearable devices and SIM cards, and the growing trend of miniaturization in electronic devices. Additionally, the increasing adoption of NFC technology is also contributing to the growth of this market. On the basis of type, single-sided FPCs are expected to account for a larger share than double-sided FPCs during the forecast period. This can be attributed to their low cost and easy manufacturing process as compared with double-sided FPCs. However, due to their high performance and smaller form factor, double-sided FPCs are expected to witness higher growth rates as compared with single-sided FPCs during the forecast period. On the basis of application, wearable devices are expected to account for a larger share than other applications duringthe forecast period owingto their growing popularity among consumers across different regions worldwide.
Product Definition:
An ultra-thin FPC is a type of flexible printed circuit board (FPC) that is thinner than traditional FPCs. Ultra-thin FPCs are typically used in applications where space is limited and weight is a concern, such as in portable electronics and medical devices. The reduced thickness allows for more flexibility, which can be important in products that are subject to vibration or wear and tear. Additionally, the lower weight of ultra-thin FPCs can improve fuel economy or prolong battery life in mobile devices.
Single-sided:
Single-sided PCB (Ultra-thin FPC) is a type of circuit board, which has one side of the circuit trace or layer made up of non-conductive material. Single Sided PCBs are mainly used in electronic devices where space is an issue and the component placement on the printed circuit board needs to be as close as possible.
Double-sided:
Double-sided (DS) Ultra-thin FPC market is expected to witness significant growth over the forecast period. DS UFPC is a type of flexible printed circuit board, which has two layers of copper traces on both sides of the substrate or base layer. The product can be used in various applications such as mobile phones, PDAs, gaming devices and other consumer electronics equipment with small form factor.
Application Insights:
The global ultra-thin FPC market is segmented based on application into wearable devices, SIM card, NFC device, drawing board, metro coin and others. The wearable devices segment held the largest share in 2017 owing to increasing demand for fitness trackers and smartwatches among other applications.
Ultra-thin FPCs are used in a wide range of applications including wearables & healthcare (smaller than 0.35mm), mobile phones & smartphones (0.35mm - 0.70mm), tablets & e-readers (0.70mm - 1 mm), SIM cards (1 mm+).
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market over the forecast period. The growth can be attributed to increasing demand for ultra-thin FPC from various application industries in China, Japan, and India. In addition, rising disposable income of consumers and rapid urbanization are also expected to drive the market growth in this region.
North America is projected to account for a significant share of global revenue throughout the forecast period owing to high demand from end-use industries such as mobile phones and consumer electronics devices. The presence of major technology players such as Intel Corporation; Qualcomm Inc.; Texas Instruments Inc.; Broadcom Limited; Avago Technologies Ltd.; Maxim Integrated Products Inc.; Fairchild Semiconductor; Xilinx LLC., among others will further boost industry expansion over next six years or so.
The U.S.-based companies have been focusing on developing new technologies with an aim toward commercialization at lower costs than their competitors based outside U.S.
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Proliferation of next-generation displays and sensors
- Rising demand for flexible electronics in automotive and medical applications
- Growing popularity of wearable technology
- Advances in printing technologies
Scope Of The Report
Report Attributes
Report Details
Report Title
Ultra-thin FPC Market Research Report
By Type
Single-sided, Double-sided
By Application
Wearable Device, SIM Card, NFC Device, Drawing Board, Metro Coin, Others
By Companies
Nitto Denko, CMK CORPORATION, Unimicron, Millennium Circuits Limited, Best Technology Co., Ltd, Compeq Manufacturing, Nippon Mektron Ltd, Oki Oecc, Alcanta Technology (ShenZhen) Co.,Ltd., Jindian Precision Circuit, Shenzhen Bora PCB Technology, All Flex, Fastline Circuits Co.,Limited
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
141
Number of Tables & Figures
99
Customization Available
Yes, the report can be customized as per your need.
Global Ultra-thin FPC Market Report Segments:
The global Ultra-thin FPC market is segmented on the basis of:
Types
Single-sided, Double-sided
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Wearable Device, SIM Card, NFC Device, Drawing Board, Metro Coin, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Nitto Denko
- CMK CORPORATION
- Unimicron
- Millennium Circuits Limited
- Best Technology Co., Ltd
- Compeq Manufacturing
- Nippon Mektron Ltd
- Oki Oecc
- Alcanta Technology (ShenZhen) Co.,Ltd.
- Jindian Precision Circuit
- Shenzhen Bora PCB Technology
- All Flex
- Fastline Circuits Co.,Limited
Highlights of The Ultra-thin FPC Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Single-sided
- Double-sided
- By Application:
- Wearable Device
- SIM Card
- NFC Device
- Drawing Board
- Metro Coin
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Ultra-thin FPC Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Ultra-thin FPC is a type of flexible printed circuit board (FPC) that has an extremely thin profile. This allows it to be used in applications where space is at a premium, such as in wearable electronics and automotive components.
Some of the major players in the ultra-thin fpc market are Nitto Denko, CMK CORPORATION, Unimicron, Millennium Circuits Limited, Best Technology Co., Ltd, Compeq Manufacturing, Nippon Mektron Ltd, Oki Oecc, Alcanta Technology (ShenZhen) Co.,Ltd., Jindian Precision Circuit, Shenzhen Bora PCB Technology, All Flex, Fastline Circuits Co.,Limited.
The ultra-thin fpc market is expected to register a CAGR of 9.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Ultra-thin FPC Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Ultra-thin FPC Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Ultra-thin FPC Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Ultra-thin FPC Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Ultra-thin FPC Market Size & Forecast, 2020-2028
4.5.1 Ultra-thin FPC Market Size and Y-o-Y Growth
4.5.2 Ultra-thin FPC Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Single-sided
5.2.2 Double-sided
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Wearable Device
6.2.2 SIM Card
6.2.3 NFC Device
6.2.4 Drawing Board
6.2.5 Metro Coin
6.2.6 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Ultra-thin FPC Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Ultra-thin FPC Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Single-sided
9.6.2 Double-sided
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Wearable Device
9.10.2 SIM Card
9.10.3 NFC Device
9.10.4 Drawing Board
9.10.5 Metro Coin
9.10.6 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Single-sided
10.6.2 Double-sided
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Wearable Device
10.10.2 SIM Card
10.10.3 NFC Device
10.10.4 Drawing Board
10.10.5 Metro Coin
10.10.6 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Single-sided
11.6.2 Double-sided
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Wearable Device
11.10.2 SIM Card
11.10.3 NFC Device
11.10.4 Drawing Board
11.10.5 Metro Coin
11.10.6 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Single-sided
12.6.2 Double-sided
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Wearable Device
12.10.2 SIM Card
12.10.3 NFC Device
12.10.4 Drawing Board
12.10.5 Metro Coin
12.10.6 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Single-sided
13.6.2 Double-sided
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Wearable Device
13.10.2 SIM Card
13.10.3 NFC Device
13.10.4 Drawing Board
13.10.5 Metro Coin
13.10.6 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Ultra-thin FPC Market: Competitive Dashboard
14.2 Global Ultra-thin FPC Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Nitto Denko
14.3.2 CMK CORPORATION
14.3.3 Unimicron
14.3.4 Millennium Circuits Limited
14.3.5 Best Technology Co., Ltd
14.3.6 Compeq Manufacturing
14.3.7 Nippon Mektron Ltd
14.3.8 Oki Oecc
14.3.9 Alcanta Technology (ShenZhen) Co.,Ltd.
14.3.10 Jindian Precision Circuit
14.3.11 Shenzhen Bora PCB Technology
14.3.12 All Flex
14.3.13 Fastline Circuits Co.,Limited
