Market Overview:
Ultrasonic wire bonders are used to join two or more wires by creating a weld between them. The ultrasonic energy is focused on the joint between the wires, melting and fusing them together. This process is often used in electrical and electronic applications, where a strong, reliable bond is required. The global ultrasonic wire bonders market can be segmented by type, application and region. By type, the market can be divided into fully automatic, semi-automatic and manual wire bonders. Fully automatic machines are most popular due to their high speed and accuracy. They are mainly used in mass production environments. Semi-automatic machines are slower but more versatile than fully automatic machines; they can be used for both low-volume and high-volume production tasks.
Product Definition:
Ultrasonic wire bonders are machines that use ultrasonic vibrations to create bonds between two pieces of metal. Ultrasonic wire bonders are important because they create strong, reliable bonds that can withstand high levels of stress.
Fully Automatic:
Fully automatic systems are used for handling wires in a precise manner. The fully automatic wire bonders have the ability to handle thick and thin wires, have high speed, and can bond different types of materials such as metals & plastics at the same time. These devices are also known as semi-automatic or manual machines. They can be operated by a person using switches or automatically via program code depending on the model selected for use.
Semi-automatic:
Semi-automatic wire bonders are used for joining two or more wires together in electrical applications. They are also used for making connections between electronic components and their associated wires. The semi-automatic type of wire bonders can be operated by a person with minimal training, but they require some experience to effectively use them.
Application Insights:
Aluminum bonding was the largest application segment in 2017 and is expected to continue its dominance over the forecast period. Aluminum has a high Ultrasonic Frequency Response (UFR) which enables efficient wire bonding. The rising demand for aluminum products in various end-use industries including automotive, marine, and transportation is anticipated to drive product demand over the forecast period.
The copper bonding segment is expected to register a significant CAGR of XX% from 2018 to 2030 owing to increasing copper prices that have resulted in an increased utilization of this metal for construction and electrical applications worldwide.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market with a CAGR of XX% from 2018 to 2030 owing to increasing demand for electronic products and rapid industrialization in the region. In addition, rising construction activities in emerging economies are anticipated to fuel product demand further. For instance, according to The Japan External Trade Organization (JETRO), foreign direct investments (FDI) in India increased from USD X billion in 2014 to USD X billion in 2017 which indicates significant growth potential for Ultrasonic Bonders over the forecast period.
Europe accounted for 26% of revenue share as of 2017 and is expected witness moderate growth during the forecast period on account of high product penetration coupled with stringent regulations regarding environmental protectionism & safety standards implemented by regulatory bodies such as ECHA, REACH & EPA etc.).
Growth Factors:
- Increasing demand for miniaturization in electronic devices
- Rising demand from the automotive industry
- Growing popularity of ultrasonic wire bonding in medical devices and implants
- Proliferation of advanced packaging technologies
- Rising adoption of ultrasonic wire bonding in semiconductor manufacturing
Scope Of The Report
Report Attributes
Report Details
Report Title
Ultrasonic Wire Bonders Market Research Report
By Type
Fully Automatic, Semi-automatic, Manual
By Application
Aluminum Bonding, Copper Bonding, Gold Bonding
By Companies
Kulicke & Soffa Industries, Inc, Hesse, F & K DELVOTEC Bondtechnik GmbH, F&S Bondtec, TPT, Ultrasonic Engineering Co.,Ltd (Cho-Onpa Kogyo Kaisha Ltd), ASM Pacific Technology, Hybond, Kaijo Corporation, West Bond, Kulicke & Soffa Industries, Inc
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
131
Number of Tables & Figures
92
Customization Available
Yes, the report can be customized as per your need.
Global Ultrasonic Wire Bonders Market Report Segments:
The global Ultrasonic Wire Bonders market is segmented on the basis of:
Types
Fully Automatic, Semi-automatic, Manual
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Aluminum Bonding, Copper Bonding, Gold Bonding
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Kulicke & Soffa Industries, Inc
- Hesse
- F & K DELVOTEC Bondtechnik GmbH
- F&S Bondtec
- TPT
- Ultrasonic Engineering Co.,Ltd (Cho-Onpa Kogyo Kaisha Ltd)
- ASM Pacific Technology
- Hybond
- Kaijo Corporation
- West Bond
- Kulicke & Soffa Industries, Inc
Highlights of The Ultrasonic Wire Bonders Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Fully Automatic
- Semi-automatic
- Manual
- By Application:
- Aluminum Bonding
- Copper Bonding
- Gold Bonding
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Ultrasonic Wire Bonders Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Ultrasonic wire bonders are machines that use high-frequency sound waves to create a strong, durable connection between two pieces of metal. They're often used in industrial settings to join wires together or attach parts together during manufacturing.
Some of the key players operating in the ultrasonic wire bonders market are Kulicke & Soffa Industries, Inc, Hesse, F & K DELVOTEC Bondtechnik GmbH, F&S Bondtec, TPT, Ultrasonic Engineering Co.,Ltd (Cho-Onpa Kogyo Kaisha Ltd), ASM Pacific Technology, Hybond, Kaijo Corporation, West Bond, Kulicke & Soffa Industries, Inc.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Ultrasonic Wire Bonders Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Ultrasonic Wire Bonders Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Ultrasonic Wire Bonders Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Ultrasonic Wire Bonders Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Ultrasonic Wire Bonders Market Size & Forecast, 2018-2028
4.5.1 Ultrasonic Wire Bonders Market Size and Y-o-Y Growth
4.5.2 Ultrasonic Wire Bonders Market Absolute $ Opportunity
Chapter 5 Global Ultrasonic Wire Bonders Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Ultrasonic Wire Bonders Market Size Forecast by Type
5.2.1 Fully Automatic
5.2.2 Semi-automatic
5.2.3 Manual
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Ultrasonic Wire Bonders Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Ultrasonic Wire Bonders Market Size Forecast by Applications
6.2.1 Aluminum Bonding
6.2.2 Copper Bonding
6.2.3 Gold Bonding
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Ultrasonic Wire Bonders Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Ultrasonic Wire Bonders Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Ultrasonic Wire Bonders Analysis and Forecast
9.1 Introduction
9.2 North America Ultrasonic Wire Bonders Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Ultrasonic Wire Bonders Market Size Forecast by Type
9.6.1 Fully Automatic
9.6.2 Semi-automatic
9.6.3 Manual
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Ultrasonic Wire Bonders Market Size Forecast by Applications
9.10.1 Aluminum Bonding
9.10.2 Copper Bonding
9.10.3 Gold Bonding
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Ultrasonic Wire Bonders Analysis and Forecast
10.1 Introduction
10.2 Europe Ultrasonic Wire Bonders Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Ultrasonic Wire Bonders Market Size Forecast by Type
10.6.1 Fully Automatic
10.6.2 Semi-automatic
10.6.3 Manual
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Ultrasonic Wire Bonders Market Size Forecast by Applications
10.10.1 Aluminum Bonding
10.10.2 Copper Bonding
10.10.3 Gold Bonding
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Ultrasonic Wire Bonders Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Ultrasonic Wire Bonders Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Ultrasonic Wire Bonders Market Size Forecast by Type
11.6.1 Fully Automatic
11.6.2 Semi-automatic
11.6.3 Manual
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Ultrasonic Wire Bonders Market Size Forecast by Applications
11.10.1 Aluminum Bonding
11.10.2 Copper Bonding
11.10.3 Gold Bonding
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Ultrasonic Wire Bonders Analysis and Forecast
12.1 Introduction
12.2 Latin America Ultrasonic Wire Bonders Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Ultrasonic Wire Bonders Market Size Forecast by Type
12.6.1 Fully Automatic
12.6.2 Semi-automatic
12.6.3 Manual
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Ultrasonic Wire Bonders Market Size Forecast by Applications
12.10.1 Aluminum Bonding
12.10.2 Copper Bonding
12.10.3 Gold Bonding
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Ultrasonic Wire Bonders Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Ultrasonic Wire Bonders Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Ultrasonic Wire Bonders Market Size Forecast by Type
13.6.1 Fully Automatic
13.6.2 Semi-automatic
13.6.3 Manual
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Ultrasonic Wire Bonders Market Size Forecast by Applications
13.10.1 Aluminum Bonding
13.10.2 Copper Bonding
13.10.3 Gold Bonding
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Ultrasonic Wire Bonders Market: Competitive Dashboard
14.2 Global Ultrasonic Wire Bonders Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Kulicke & Soffa Industries, Inc
14.3.2 Hesse
14.3.3 F & K DELVOTEC Bondtechnik GmbH
14.3.4 F&S Bondtec
14.3.5 TPT
14.3.6 Ultrasonic Engineering Co.,Ltd (Cho-Onpa Kogyo Kaisha Ltd)
14.3.7 ASM Pacific Technology
14.3.8 Hybond
14.3.9 Kaijo Corporation
14.3.10 West Bond
14.3.11 Kulicke & Soffa Industries, Inc
