Market Overview:
The global unlead solder paste and flux market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth in the market can be attributed to the increasing demand for miniaturization and higher density packaging in the semiconductor industry, and the growing trend of using lead-free solders. In terms of volume, Asia Pacific is expected to dominate the global unlead solder paste and flux market during the forecast period.
Product Definition:
Unlead solder paste is a type of solder that does not contain lead. It is often used in applications where lead is not allowed, such as in the manufacturing of medical devices. Unlead solder paste fluxes are typically based on organic acids and can be used to clean surfaces and remove oxides prior to soldering.
Solder Paste:
Solder Paste is a lead-free alloy of tin, bismuth, and antimony. It is an alloy which has been used in soldering applications for more than two thousand years. The paste consists of 60% to 70% by weight of tin with small proportions of other metals added to improve specific properties such as adhesion or corrosion resistance.
Flux:
Flux is a material that aids in the cleaning and bonding of surfaces. It can be either used as an additive to improve properties or removed during surface treatment. Fluxes are available in various forms including powders, liquids, pastes and gels. The most commonly used flux for lead-based solders is rosin-based flux because it provides good adhesion properties to metals at high temperatures along with preventing their oxidation when exposed to air.
Application Insights:
SMT assembly was the largest application segment in 2017 and is projected to grow at a CAGR of XX% over the forecast period. The growing demand for small machine tools with integrated SMT equipment is expected to drive product demand in this application segment over the coming years.
Global unlead solder paste.
Semiconductor packaging was another prominent application segment accounting for a share of 22% in 2017 owing to high product utilization during various stages of semiconductor manufacturing such as wafer processing, patterning, and device fabrication. Lead-free solder pastes offer enhanced thermal conductivity which helps improve heat dissipation from chips thereby reducing stress on substrates leading to improved yield rates.
Regional Analysis:
Asia Pacific is expected to be the fastest-growing regional market with a CAGR of XX% from 2018 to 2030 owing to rapid industrialization and increasing foreign investments in the electronics sector. The region has witnessed significant growth in electronic manufacturing services (EMS) over the past few years, which is likely to have a positive impact on industry growth over the forecast period.
The Asia Pacific region comprises majorly developing countries such as China, India, South Korea and Taiwan; however it lacks in terms of infrastructure facilities for handling large volume production runs thus leading towards high demand for SMT assembly services from developed regions such as North America and Europe. This trend is projected to continue over the next eight years thereby driving global unlead solder paste & flux market growth across regions during the forecast period.
Growth Factors:
- Increasing demand from the automotive and electronics industries
- Rising demand for miniaturization in electronic devices
- Growing popularity of lead-free soldering technology
- Proliferation of 3D printing technology
- Technological advancements in solder paste and flux formulations
Scope Of The Report
Report Attributes
Report Details
Report Title
Unlead Solder Paste & Flux Market Research Report
By Type
Solder Paste, Flux
By Application
SMT Assembly, Semiconductor Packaging, Other
By Companies
ECOJOIN, Uchihashi Estec, Senju Metal Industry, Qualitek, MacDermid Alpha Electronics Solutions, Tamura, KOKI, Kester, Henkel AG & Co., AMTECH, Nihon Superior, Nihon Genma Mfg, AIM Solder, Nordson, MG Chemicals, NIHON ALMIT, Huaqing Solder Material Technology
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
191
Number of Tables & Figures
134
Customization Available
Yes, the report can be customized as per your need.
Global Unlead Solder Paste & Flux Market Report Segments:
The global Unlead Solder Paste & Flux market is segmented on the basis of:
Types
Solder Paste, Flux
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
SMT Assembly, Semiconductor Packaging, Other
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- ECOJOIN
- Uchihashi Estec
- Senju Metal Industry
- Qualitek
- MacDermid Alpha Electronics Solutions
- Tamura
- KOKI
- Kester
- Henkel AG & Co.
- AMTECH
- Nihon Superior
- Nihon Genma Mfg
- AIM Solder
- Nordson
- MG Chemicals
- NIHON ALMIT
- Huaqing Solder Material Technology
Highlights of The Unlead Solder Paste & Flux Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Solder Paste
- Flux
- By Application:
- SMT Assembly
- Semiconductor Packaging
- Other
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Unlead Solder Paste & Flux Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Unlead solder paste and flux are two components used in soldering. They are both made of lead and tin, which is the main component in solder. Unlead solder paste is a liquid that is applied to the joint to be soldered, while flux helps it adhere to the metal.
Some of the major companies in the unlead solder paste & flux market are ECOJOIN, Uchihashi Estec, Senju Metal Industry, Qualitek, MacDermid Alpha Electronics Solutions, Tamura, KOKI, Kester, Henkel AG & Co., AMTECH, Nihon Superior, Nihon Genma Mfg, AIM Solder, Nordson, MG Chemicals, NIHON ALMIT, Huaqing Solder Material Technology.
The unlead solder paste & flux market is expected to grow at a compound annual growth rate of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Unlead Solder Paste & Flux Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Unlead Solder Paste & Flux Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Unlead Solder Paste & Flux Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Unlead Solder Paste & Flux Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Unlead Solder Paste & Flux Market Size & Forecast, 2020-2028
4.5.1 Unlead Solder Paste & Flux Market Size and Y-o-Y Growth
4.5.2 Unlead Solder Paste & Flux Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Solder Paste
5.2.2 Flux
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 SMT Assembly
6.2.2 Semiconductor Packaging
6.2.3 Other
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Unlead Solder Paste & Flux Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Unlead Solder Paste & Flux Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Solder Paste
9.6.2 Flux
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 SMT Assembly
9.10.2 Semiconductor Packaging
9.10.3 Other
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Solder Paste
10.6.2 Flux
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 SMT Assembly
10.10.2 Semiconductor Packaging
10.10.3 Other
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Solder Paste
11.6.2 Flux
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 SMT Assembly
11.10.2 Semiconductor Packaging
11.10.3 Other
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Solder Paste
12.6.2 Flux
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 SMT Assembly
12.10.2 Semiconductor Packaging
12.10.3 Other
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Solder Paste
13.6.2 Flux
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 SMT Assembly
13.10.2 Semiconductor Packaging
13.10.3 Other
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Unlead Solder Paste & Flux Market: Competitive Dashboard
14.2 Global Unlead Solder Paste & Flux Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 ECOJOIN
14.3.2 Uchihashi Estec
14.3.3 Senju Metal Industry
14.3.4 Qualitek
14.3.5 MacDermid Alpha Electronics Solutions
14.3.6 Tamura
14.3.7 KOKI
14.3.8 Kester
14.3.9 Henkel AG & Co.
14.3.10 AMTECH
14.3.11 Nihon Superior
14.3.12 Nihon Genma Mfg
14.3.13 AIM Solder
14.3.14 Nordson
14.3.15 MG Chemicals
14.3.16 NIHON ALMIT
14.3.17 Huaqing Solder Material Technology
