Market Overview:
The global UV and non-UV tape for semiconductor market is expected to grow at a CAGR of 5.5% from 2018 to 2030. The growth of the market can be attributed to the increasing demand for semiconductors in various applications such as consumer electronics, automotive, and industrial. In addition, the growing demand for miniaturization and higher performance in electronic devices is also fueling the growth of the market. The UV tape segment is expected to grow at a CAGR of 6% from 2018 to 2030, while the non-UV tape segment is projected to grow at a CAGR of 4% during the same period. The growth of both segments can be attributed to their unique properties that offer various benefits over traditional tapes used in semiconductor packaging applications.
Product Definition:
UV Tape is a self-adhesive tape which cures (hardens) upon exposure to ultraviolet light. Non-UV Tape is a self-adhesive tape which does not cure (harden) upon exposure to ultraviolet light. UV Tape is used for bonding and encapsulating semiconductor devices, while Non-UV Tape can be used for general purpose bonding and sealing applications.
UV Tape:
UV tape is a special type of adhesive tape that can be used in both UV and non-UV applications. It has high adhesion properties to most substrates such as plastics, glass, metal foils and paper. The product offers excellent resistance to water vapor, alcohols & solvents along with good flexibility at low temperatures which makes it suitable for semiconductor packaging applications where other tapes would be damaged by moisture or other chemical substances.
Non-UV Tape:
Non-UV tape is a special type of adhesive tape that can be used in place of UV curable resin tapes. It is majorly used for packaging semiconductor devices such as integrated circuits and wafers. The major advantage associated with non-uv tapes over their uv counterparts are the former does not require any special clean room facilities, it also offers higher adhesion to substrates and better flexibility at low temperatures along with lower curing times.
Application Insights:
The demand for the product in wafer foundry application is expected to witness a CAGR of XX% from 2018 to 2030 owing to the increasing number of semiconductor companies establishing their manufacturing facilities in Asia Pacific and Central & South America. The growing demand for electronic devices, especially smartphones, is anticipated to drive the growth over the forecast period.
Non-UV tapes are used during various stages of integrated device manufacture (IDM), including non-critical component assembly, packaging and testing applications. Growing usage of UV resistant tapes by manufacturers at early stages of production saves costs as well as timelines incurred while changing these tapes during critical phases such as initial production run or pilot run stage which otherwise would have been taken up by retaping activities at later stages when higher quantities are involved in final assembly process or test procedures respectively. These factors are projected to fuel market growth over the coming years.
Regional Analysis:
Asia Pacific was the largest market for global ultraviolet and non-uv tape, accounting for more than 35% of the total revenue in 2017. This is attributed to increasing demand from Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics Co., Ltd, and others. In addition, rising number of semiconductor manufacturing plants in China is expected to fuel product demand over the forecast period.
Europe accounted for more than 20% of global market share owing to high adoption rate from European manufacturers including Infineon Technologies AG, NXP BV Semiconductors N.V., Qualcomm Incorporated and others are anticipated to drive growth over next eight years.
The U.S dominated this region with highest adoption rate due to presence of major players such as Intel Corporation; Texas Instruments Inc.
Growth Factors:
- Increasing demand for miniaturization in semiconductor devices
- Growing trend of 3D IC packaging
- Proliferation of advanced packaging technologies
- Rising demand for semiconductor testing and inspection services
- Increasing number of fabless companies
Scope Of The Report
Report Attributes
Report Details
Report Title
UV and Non-UV Tape for Semiconductor Market Research Report
By Type
UV Tape, Non-UV Tape
By Application
Wafer Foundry, IDM
By Companies
LINTEC ADVANCED, Mitsui Chemicals Tohcello, Denka, Nitto Denko, Furukawa Electric, D&X, AI Technology, Loadpoint, ULTRON SYSTEM, Maxell Holdings, Ltd, Shenzhen Deshengxing Electronics, NPMT(NDS)
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
162
Number of Tables & Figures
114
Customization Available
Yes, the report can be customized as per your need.
Global UV and Non-UV Tape for Semiconductor Market Report Segments:
The global UV and Non-UV Tape for Semiconductor market is segmented on the basis of:
Types
UV Tape, Non-UV Tape
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Wafer Foundry, IDM
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- LINTEC ADVANCED
- Mitsui Chemicals Tohcello
- Denka
- Nitto Denko
- Furukawa Electric
- D&X
- AI Technology
- Loadpoint
- ULTRON SYSTEM
- Maxell Holdings, Ltd
- Shenzhen Deshengxing Electronics
- NPMT(NDS)
Highlights of The UV and Non-UV Tape for Semiconductor Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- UV Tape
- Non-UV Tape
- By Application:
- Wafer Foundry
- IDM
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the UV and Non-UV Tape for Semiconductor Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
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- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
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8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
UV tape is a type of adhesive tape that is used to attach semiconductor devices to printed circuit boards. Non-UV tape is a type of adhesive tape that is used to attach semiconductor devices to other surfaces, such as metal.
Some of the major companies in the uv and non-uv tape for semiconductor market are LINTEC ADVANCED, Mitsui Chemicals Tohcello, Denka, Nitto Denko, Furukawa Electric, D&X, AI Technology, Loadpoint, ULTRON SYSTEM, Maxell Holdings, Ltd, Shenzhen Deshengxing Electronics, NPMT(NDS).
The uv and non-uv tape for semiconductor market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 UV and Non-UV Tape for Semiconductor Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 UV and Non-UV Tape for Semiconductor Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 UV and Non-UV Tape for Semiconductor Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the UV and Non-UV Tape for Semiconductor Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global UV and Non-UV Tape for Semiconductor Market Size & Forecast, 2018-2028
4.5.1 UV and Non-UV Tape for Semiconductor Market Size and Y-o-Y Growth
4.5.2 UV and Non-UV Tape for Semiconductor Market Absolute $ Opportunity
Chapter 5 Global UV and Non-UV Tape for Semiconductor Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 UV and Non-UV Tape for Semiconductor Market Size Forecast by Type
5.2.1 UV Tape
5.2.2 Non-UV Tape
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global UV and Non-UV Tape for Semiconductor Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 UV and Non-UV Tape for Semiconductor Market Size Forecast by Applications
6.2.1 Wafer Foundry
6.2.2 IDM
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global UV and Non-UV Tape for Semiconductor Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 UV and Non-UV Tape for Semiconductor Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America UV and Non-UV Tape for Semiconductor Analysis and Forecast
9.1 Introduction
9.2 North America UV and Non-UV Tape for Semiconductor Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America UV and Non-UV Tape for Semiconductor Market Size Forecast by Type
9.6.1 UV Tape
9.6.2 Non-UV Tape
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America UV and Non-UV Tape for Semiconductor Market Size Forecast by Applications
9.10.1 Wafer Foundry
9.10.2 IDM
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe UV and Non-UV Tape for Semiconductor Analysis and Forecast
10.1 Introduction
10.2 Europe UV and Non-UV Tape for Semiconductor Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe UV and Non-UV Tape for Semiconductor Market Size Forecast by Type
10.6.1 UV Tape
10.6.2 Non-UV Tape
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe UV and Non-UV Tape for Semiconductor Market Size Forecast by Applications
10.10.1 Wafer Foundry
10.10.2 IDM
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific UV and Non-UV Tape for Semiconductor Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific UV and Non-UV Tape for Semiconductor Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific UV and Non-UV Tape for Semiconductor Market Size Forecast by Type
11.6.1 UV Tape
11.6.2 Non-UV Tape
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific UV and Non-UV Tape for Semiconductor Market Size Forecast by Applications
11.10.1 Wafer Foundry
11.10.2 IDM
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America UV and Non-UV Tape for Semiconductor Analysis and Forecast
12.1 Introduction
12.2 Latin America UV and Non-UV Tape for Semiconductor Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America UV and Non-UV Tape for Semiconductor Market Size Forecast by Type
12.6.1 UV Tape
12.6.2 Non-UV Tape
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America UV and Non-UV Tape for Semiconductor Market Size Forecast by Applications
12.10.1 Wafer Foundry
12.10.2 IDM
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) UV and Non-UV Tape for Semiconductor Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) UV and Non-UV Tape for Semiconductor Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) UV and Non-UV Tape for Semiconductor Market Size Forecast by Type
13.6.1 UV Tape
13.6.2 Non-UV Tape
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) UV and Non-UV Tape for Semiconductor Market Size Forecast by Applications
13.10.1 Wafer Foundry
13.10.2 IDM
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 UV and Non-UV Tape for Semiconductor Market: Competitive Dashboard
14.2 Global UV and Non-UV Tape for Semiconductor Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 LINTEC ADVANCED
14.3.2 Mitsui Chemicals Tohcello
14.3.3 Denka
14.3.4 Nitto Denko
14.3.5 Furukawa Electric
14.3.6 D&X
14.3.7 AI Technology
14.3.8 Loadpoint
14.3.9 ULTRON SYSTEM
14.3.10 Maxell Holdings, Ltd
14.3.11 Shenzhen Deshengxing Electronics
14.3.12 NPMT(NDS)
