Market Overview:
The global wafer ball machine market is expected to grow at a CAGR of 5.5% during the forecast period from 2018 to 2030. The solder paste + solder ball type segment is expected to dominate the market in terms of revenue share during the forecast period, followed by the solder paste + soldering iron type segment. The motherboard south bridge chip application segment is expected to be the largest contributor in terms of revenue share during the forecast period, followed by motherboard north bridge chip application segment. North America is estimated to be the largest regional market for wafer ball machines during 2018-2030, owing to high demand from end-use industries such as automotive and consumer electronics in this region.
Product Definition:
The Wafer Ball Machine is a device that is used to produce wafer balls. These balls are then used in various food preparations, such as ice cream or cake. The importance of the Wafer Ball Machine is that it allows for the consistent production of these wafer balls, which can then be used in food preparations.
Solder Paste + Solder Ball:
Solder paste is a combination of flux, rosin and metals such as tin, lead or copper. It is used for joining different components in semiconductor devices during the manufacturing process. The solder paste forms an interface between the two components which are to be soldered together and provides mechanical support for better bonding.
Solder Paste + Solder Ball:
Solder paste is a combination of flux and solder. It is used in soldering electronic components and it's different types include rosin-based, lead-based, tin-based, bismuth-based and others. The major function of this paste is to provide an even flow along with better thermal management which helps in reducing the time consumed while soldering multiple small parts together.
Application Insights:
The global wafer ball machine market by application is segmented into motherboard south bridge chip, motherboard north bridge chip, other chips and components and others. The other chips and components segment held the largest share in 2017 owing to the increasing demand for high-density circuit boards with low power consumption. South Bridge Chips are integrated circuits that are used in both mobile as well as desktop computers. Increasing demand for smart devices is expected to drive the product demand over the forecast period.
The North Bridge Chip application market has witnessed significant growth due to its rising usage in smartphones among others applications such as data centers or enterprise servers which require a large number of processors per unit area on PCBs orchids which use this component type.
Regional Analysis:
Asia Pacific region dominated the global market in 2017 and is expected to continue its dominance over the forecast period. This can be attributed to increasing production of electronic products in this region, particularly smartphones and laptops. The presence of a large number of manufacturers coupled with low labor costs has also contributed significantly to regional growth.
The Asia Pacific wafer ball machine market is anticipated to grow at a CAGR exceeding 7% from 2018 to 2030 owing to rapid development in China, India, South Korea, Taiwan among other Asian countries. In addition, growing demand for consumer electronics such as smart phones and tablets along with rising investments by key players are likely contributors for regional growth over the next eight years time span.
Growth Factors:
- Increasing demand for semiconductor devices: The global semiconductor market is expected to grow at a CAGR of 6.5% from 2016 to 2020. This is due to the increasing demand for semiconductor devices in consumer electronics, automotive, and industrial applications. This will drive the growth of the wafer ball machine market as well.
- Growing demand for miniaturized and high-performance components: The trend of miniaturization and high performance is driving the growth of the wafer ball machine market as these machines can produce miniaturized components with high precision and accuracy.
- Rising number of fabless companies: A fabless company is a company that outsources all or most of its manufacturing needs to contract manufacturers (CM). There has been a rise in the number of fabless companies in recent years due to advancements in technology that have made it easier for companies to design chips without having their own fabrication facilities. This will lead to an increase in demand for wafer ball machines as CM’s need these machines for producing chipsets on behalf of their clients/customers .
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Ball Machine Market Research Report
By Type
Solder Paste + Solder Ball, Solder Paste + Solder Ball
By Application
Motherboard South Bridge Chip, Motherboard North Bridge Chip
By Companies
Pac Tech, Minami, Ueno Seiki Co Ltd, Kulicke Soffa, Kingrun Technology, Shinkawa, Mioson, Tec Photo, Techsense, Dezhengzn
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
241
Number of Tables & Figures
169
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Ball Machine Market Report Segments:
The global Wafer Ball Machine market is segmented on the basis of:
Types
Solder Paste + Solder Ball, Solder Paste + Solder Ball
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
Motherboard South Bridge Chip, Motherboard North Bridge Chip
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- Pac Tech
- Minami
- Ueno Seiki Co Ltd
- Kulicke Soffa
- Kingrun Technology
- Shinkawa
- Mioson
- Tec Photo
- Techsense
- Dezhengzn
Highlights of The Wafer Ball Machine Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Solder Paste + Solder Ball
- Solder Paste + Solder Ball
- By Application:
- Motherboard South Bridge Chip
- Motherboard North Bridge Chip
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Ball Machine Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
A Wafer Ball Machine is a type of automated manufacturing machine that creates small balls from a molten material. These balls are then used in various industrial and consumer products, such as toys, cosmetics, and pharmaceuticals.
Some of the major companies in the wafer ball machine market are Pac Tech, Minami, Ueno Seiki Co Ltd, Kulicke Soffa, Kingrun Technology, Shinkawa, Mioson, Tec Photo, Techsense, Dezhengzn.
The wafer ball machine market is expected to register a CAGR of 5.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Ball Machine Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Ball Machine Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Ball Machine Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Ball Machine Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Ball Machine Market Size & Forecast, 2020-2028
4.5.1 Wafer Ball Machine Market Size and Y-o-Y Growth
4.5.2 Wafer Ball Machine Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Solder Paste + Solder Ball
5.2.2 Solder Paste + Solder Ball
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 Motherboard South Bridge Chip
6.2.2 Motherboard North Bridge Chip
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Ball Machine Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Ball Machine Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Solder Paste + Solder Ball
9.6.2 Solder Paste + Solder Ball
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 Motherboard South Bridge Chip
9.10.2 Motherboard North Bridge Chip
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Solder Paste + Solder Ball
10.6.2 Solder Paste + Solder Ball
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 Motherboard South Bridge Chip
10.10.2 Motherboard North Bridge Chip
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Solder Paste + Solder Ball
11.6.2 Solder Paste + Solder Ball
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 Motherboard South Bridge Chip
11.10.2 Motherboard North Bridge Chip
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Solder Paste + Solder Ball
12.6.2 Solder Paste + Solder Ball
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 Motherboard South Bridge Chip
12.10.2 Motherboard North Bridge Chip
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Solder Paste + Solder Ball
13.6.2 Solder Paste + Solder Ball
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 Motherboard South Bridge Chip
13.10.2 Motherboard North Bridge Chip
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Ball Machine Market: Competitive Dashboard
14.2 Global Wafer Ball Machine Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 Pac Tech
14.3.2 Minami
14.3.3 Ueno Seiki Co Ltd
14.3.4 Kulicke Soffa
14.3.5 Kingrun Technology
14.3.6 Shinkawa
14.3.7 Mioson
14.3.8 Tec Photo
14.3.9 Techsense
14.3.10 Dezhengzn
