Market Overview:
The global wafer bonder market is expected to grow at a CAGR of 6.5% during the forecast period from 2018 to 2030. The market growth can be attributed to the increasing demand for semiconductor devices and miniaturization of electronic components. The semi-automated wafer bonder segment is expected to hold the largest share of the global wafer bonder market in 2018, owing to its low cost and easy operability. However, the automated wafer bonder segment is projected to grow at a higher CAGR during the forecast period, due to its high accuracy and speed. The MEMS application segment is expected to hold the largest share of the global wafer bonder market in 2018, owingtoits growing demand for sensors and actuators in various end-use industries such as automotive, healthcare, consumer electronics, and industrial automation.
Product Definition:
A wafer bonder is a machine that bonds two semiconductor wafers together. This is typically done by using an adhesive or metal film to attach the two wafers and then heating them so that the adhesive or metal fuses. Wafer bonding is used in the manufacture of semiconductor devices, and it is important because it allows for the fabrication of very small devices.
Semi-Automated Wafer Bonder:
Semi-automatic wafer boder is a device used for manufacturing integrated circuits (IC) and has been witnessing significant growth over the past few years. This growth can be attributed to several factors such as increasing demand for ICs in consumer electronics, communication devices, and data processing equipment among others. Furthermore, technological advancements have led to the development of high performance semi-automatic wafer binders that are cost effective compared to manual binding machines.
Automated Wafer Bonder:
An automated wafer boder is a device used to bind and align wafers during the manufacturing process. It helps in improving the yield, consistency, uniformity of the product along with reducing human errors. The major applications include microelectronics assembly and packaging where it helps in producing high-quality integrated circuits (IC) with improved performance/wattage and smaller size/footprint.
Application Insights:
The others application segment accounted for the largest revenue share in 2017 and is projected to witness significant growth over the forecast period. Other applications include various types of integrated circuits such as micro-electromechanical systems, image sensors, programmable array logic, high-density circuit boards and flexible electronics. The demand for these products is expected to increase significantly owing to their increasing use in various electronic devices such as smartphones and wearable devices.
MEMS was the largest application segment accounting for a market share of more than 40% in 2017 owing to its low production cost coupled with superior characteristics required by modern day consumer electronics including miniaturization ability and small size that results into increased product adoption across end-use industries globally. MEMS includes products such as digital storage media players (DSMP), accelerometers, bar code readers/writers etc.
Regional Analysis:
Asia Pacific region dominated the global market in 2017 and is expected to continue its dominance over the forecast period. The growth can be attributed to increasing investments by key players in developing manufacturing facilities for high volume production of semiconductor devices. In addition, rising demand for electronic products such as smartphones and laptops coupled with rapid industrialization has led to increased adoption of wafer bonders across various application segments.
The Asia Pacific regional market is characterized by presence of a large number of small-scale manufacturers that cater primarily to domestic markets in China, Taiwan, South Korea, Japan among other Asian countries. These manufacturers are likely to face significant challenges due to lack of resources such as capital intensive technology required for mass production along with low efficiency levels resulting from excessive customization at each stage which will have adverse impact on their business operations over the coming years.
Growth Factors:
- Increasing demand for semiconductor devices from the consumer electronics sector is expected to drive the growth of the wafer bonder market.
- The increasing demand for miniaturized and high-performance semiconductor devices is also projected to fuel the growth of this market in the near future.
- The growing trend of 3D integration in semiconductor devices is also anticipated to create new opportunities for players operating in this market over the next few years.
- Rising investments by leading players in R&D activities aimed at developing innovative products is likely to boost the growth of this market during the forecast period.
- Growing number of mergers and acquisitions among key players are expected to provide a fillip to Wafer Bonder Market during forecast period
Scope Of The Report
Report Attributes
Report Details
Report Title
Wafer Bonder Market Research Report
By Type
Semi-Automated Wafer Bonder, Automated Wafer Bonder
By Application
MEMS, Advanced Packaging, CMOS, Others
By Companies
EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE
Regions Covered
North America, Europe, APAC, Latin America, MEA
Base Year
2021
Historical Year
2019 to 2020 (Data from 2010 can be provided as per availability)
Forecast Year
2030
Number of Pages
238
Number of Tables & Figures
167
Customization Available
Yes, the report can be customized as per your need.
Global Wafer Bonder Market Report Segments:
The global Wafer Bonder market is segmented on the basis of:
Types
Semi-Automated Wafer Bonder, Automated Wafer Bonder
The product segment provides information about the market share of each product and the respective CAGR during the forecast period. It lays out information about the product pricing parameters, trends, and profits that provides in-depth insights of the market. Furthermore, it discusses latest product developments & innovation in the market.
Applications
MEMS, Advanced Packaging, CMOS, Others
The application segment fragments various applications of the product and provides information on the market share and growth rate of each application segment. It discusses the potential future applications of the products and driving and restraining factors of each application segment.
Some of the companies that are profiled in this report are:
- EV Group
- SUSS MicroTec
- Tokyo Electron
- AML
- Mitsubishi
- Ayumi Industry
- SMEE
Highlights of The Wafer Bonder Market Report:
- The market structure and projections for the coming years.
- Drivers, restraints, opportunities, and current trends of market.
- Historical data and forecast.
- Estimations for the forecast period 2030.
- Developments and trends in the market.
- By Type:
- Semi-Automated Wafer Bonder
- Automated Wafer Bonder
- By Application:
- MEMS
- Advanced Packaging
- CMOS
- Others
- Market scenario by region, sub-region, and country.
- Market share of the market players, company profiles, product specifications, SWOT analysis, and competitive landscape.
- Analysis regarding upstream raw materials, downstream demand, and current market dynamics.
- Government Policies, Macro & Micro economic factors are also included in the report.
We have studied the Wafer Bonder Market in 360 degrees via. both primary & secondary research methodologies. This helped us in building an understanding of the current market dynamics, supply-demand gap, pricing trends, product preferences, consumer patterns & so on. The findings were further validated through primary research with industry experts & opinion leaders across countries. The data is further compiled & validated through various market estimation & data validation methodologies. Further, we also have our in-house data forecasting model to predict market growth up to 2030.
Regional Analysis
- North America
- Europe
- Asia Pacific
- Middle East & Africa
- Latin America
Note: A country of choice can be added in the report at no extra cost. If more than one country needs to be added, the research quote will vary accordingly.
The geographical analysis part of the report provides information about the product sales in terms of volume and revenue in regions. It lays out potential opportunities for the new entrants, emerging players, and major players in the region. The regional analysis is done after considering the socio-economic factors and government regulations of the countries in the regions.
How you may use our products:
- Correctly Positioning New Products
- Market Entry Strategies
- Business Expansion Strategies
- Consumer Insights
- Understanding Competition Scenario
- Product & Brand Management
- Channel & Customer Management
- Identifying Appropriate Advertising Appeals
8 Reasons to Buy This Report
- Includes a Chapter on the Impact of COVID-19 Pandemic On the Market
- Report Prepared After Conducting Interviews with Industry Experts & Top Designates of the Companies in the Market
- Implemented Robust Methodology to Prepare the Report
- Includes Graphs, Statistics, Flowcharts, and Infographics to Save Time
- Industry Growth Insights Provides 24/5 Assistance Regarding the Doubts in the Report
- Provides Information About the Top-winning Strategies Implemented by Industry Players.
- In-depth Insights On the Market Drivers, Restraints, Opportunities, and Threats
- Customization of the Report Available
Frequently Asked Questions?
Wafer Bonder is a technology that bonds semiconductor wafers together using heat and pressure. It is used in the manufacture of electronic devices, such as microprocessors and memory chips.
Some of the major companies in the wafer bonder market are EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE.
The wafer bonder market is expected to register a CAGR of 6.5%.
Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Wafer Bonder Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Wafer Bonder Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Wafer Bonder Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Wafer Bonder Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Wafer Bonder Market Size & Forecast, 2020-2028
4.5.1 Wafer Bonder Market Size and Y-o-Y Growth
4.5.2 Wafer Bonder Market Absolute $ Opportunity
Chapter 5 Global Market Analysis and Forecast by Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities by Type
5.1.2 Basis Point Share (BPS) Analysis by Type
5.1.3 Absolute $ Opportunity Assessment by Type
5.2 Market Size Forecast by Type
5.2.1 Semi-Automated Wafer Bonder
5.2.2 Automated Wafer Bonder
5.3 Market Attractiveness Analysis by Type
Chapter 6 Global Market Analysis and Forecast by Applications
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities by Applications
6.1.2 Basis Point Share (BPS) Analysis by Applications
6.1.3 Absolute $ Opportunity Assessment by Applications
6.2 Market Size Forecast by Applications
6.2.1 MEMS
6.2.2 Advanced Packaging
6.2.3 CMOS
6.2.4 Others
6.3 Market Attractiveness Analysis by Applications
Chapter 7 Global Wafer Bonder Market Analysis and Forecast by Region
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities by Region
7.1.2 Basis Point Share (BPS) Analysis by Region
7.1.3 Absolute $ Opportunity Assessment by Region
7.2 Wafer Bonder Market Size Forecast by Region
7.2.1 North America
7.2.2 Europe
7.2.3 Asia Pacific
7.2.4 Latin America
7.2.5 Middle East & Africa (MEA)
7.3 Market Attractiveness Analysis by Region
Chapter 8 Coronavirus Disease (COVID-19) Impact
8.1 Introduction
8.2 Current & Future Impact Analysis
8.3 Economic Impact Analysis
8.4 Government Policies
8.5 Investment Scenario
Chapter 9 North America Analysis and Forecast
9.1 Introduction
9.2 North America Market Size Forecast by Country
9.2.1 U.S.
9.2.2 Canada
9.3 Basis Point Share (BPS) Analysis by Country
9.4 Absolute $ Opportunity Assessment by Country
9.5 Market Attractiveness Analysis by Country
9.6 North America Market Size Forecast by Type
9.6.1 Semi-Automated Wafer Bonder
9.6.2 Automated Wafer Bonder
9.7 Basis Point Share (BPS) Analysis by Type
9.8 Absolute $ Opportunity Assessment by Type
9.9 Market Attractiveness Analysis by Type
9.10 North America Market Size Forecast by Applications
9.10.1 MEMS
9.10.2 Advanced Packaging
9.10.3 CMOS
9.10.4 Others
9.11 Basis Point Share (BPS) Analysis by Applications
9.12 Absolute $ Opportunity Assessment by Applications
9.13 Market Attractiveness Analysis by Applications
Chapter 10 Europe Analysis and Forecast
10.1 Introduction
10.2 Europe Market Size Forecast by Country
10.2.1 Germany
10.2.2 France
10.2.3 Italy
10.2.4 U.K.
10.2.5 Spain
10.2.6 Russia
10.2.7 Rest of Europe
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 Europe Market Size Forecast by Type
10.6.1 Semi-Automated Wafer Bonder
10.6.2 Automated Wafer Bonder
10.7 Basis Point Share (BPS) Analysis by Type
10.8 Absolute $ Opportunity Assessment by Type
10.9 Market Attractiveness Analysis by Type
10.10 Europe Market Size Forecast by Applications
10.10.1 MEMS
10.10.2 Advanced Packaging
10.10.3 CMOS
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis by Applications
10.12 Absolute $ Opportunity Assessment by Applications
10.13 Market Attractiveness Analysis by Applications
Chapter 11 Asia Pacific Analysis and Forecast
11.1 Introduction
11.2 Asia Pacific Market Size Forecast by Country
11.2.1 China
11.2.2 Japan
11.2.3 South Korea
11.2.4 India
11.2.5 Australia
11.2.6 South East Asia (SEA)
11.2.7 Rest of Asia Pacific (APAC)
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Asia Pacific Market Size Forecast by Type
11.6.1 Semi-Automated Wafer Bonder
11.6.2 Automated Wafer Bonder
11.7 Basis Point Share (BPS) Analysis by Type
11.8 Absolute $ Opportunity Assessment by Type
11.9 Market Attractiveness Analysis by Type
11.10 Asia Pacific Market Size Forecast by Applications
11.10.1 MEMS
11.10.2 Advanced Packaging
11.10.3 CMOS
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis by Applications
11.12 Absolute $ Opportunity Assessment by Applications
11.13 Market Attractiveness Analysis by Applications
Chapter 12 Latin America Analysis and Forecast
12.1 Introduction
12.2 Latin America Market Size Forecast by Country
12.2.1 Brazil
12.2.2 Mexico
12.2.3 Rest of Latin America (LATAM)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Latin America Market Size Forecast by Type
12.6.1 Semi-Automated Wafer Bonder
12.6.2 Automated Wafer Bonder
12.7 Basis Point Share (BPS) Analysis by Type
12.8 Absolute $ Opportunity Assessment by Type
12.9 Market Attractiveness Analysis by Type
12.10 Latin America Market Size Forecast by Applications
12.10.1 MEMS
12.10.2 Advanced Packaging
12.10.3 CMOS
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis by Applications
12.12 Absolute $ Opportunity Assessment by Applications
12.13 Market Attractiveness Analysis by Applications
Chapter 13 Middle East & Africa (MEA) Analysis and Forecast
13.1 Introduction
13.2 Middle East & Africa (MEA) Market Size Forecast by Country
13.2.1 Saudi Arabia
13.2.2 South Africa
13.2.3 UAE
13.2.4 Rest of Middle East & Africa (MEA)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Middle East & Africa (MEA) Market Size Forecast by Type
13.6.1 Semi-Automated Wafer Bonder
13.6.2 Automated Wafer Bonder
13.7 Basis Point Share (BPS) Analysis by Type
13.8 Absolute $ Opportunity Assessment by Type
13.9 Market Attractiveness Analysis by Type
13.10 Middle East & Africa (MEA) Market Size Forecast by Applications
13.10.1 MEMS
13.10.2 Advanced Packaging
13.10.3 CMOS
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis by Applications
13.12 Absolute $ Opportunity Assessment by Applications
13.13 Market Attractiveness Analysis by Applications
Chapter 14 Competition Landscape
14.1 Wafer Bonder Market: Competitive Dashboard
14.2 Global Wafer Bonder Market: Market Share Analysis, 2019
14.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
14.3.1 EV Group
14.3.2 SUSS MicroTec
14.3.3 Tokyo Electron
14.3.4 AML
14.3.5 Mitsubishi
14.3.6 Ayumi Industry
14.3.7 SMEE
